JP5406487B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5406487B2
JP5406487B2 JP2008237423A JP2008237423A JP5406487B2 JP 5406487 B2 JP5406487 B2 JP 5406487B2 JP 2008237423 A JP2008237423 A JP 2008237423A JP 2008237423 A JP2008237423 A JP 2008237423A JP 5406487 B2 JP5406487 B2 JP 5406487B2
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chip
sensor chip
semiconductor device
sensor
controller chip
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JP2010073765A (ja
JP2010073765A5 (enExample
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敦 藤澤
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H10W72/0198—
    • H10W72/073—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W72/932—
    • H10W74/00—
    • H10W90/732—
    • H10W90/736—
    • H10W90/756—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Pressure Sensors (AREA)
  • Dicing (AREA)
JP2008237423A 2008-09-17 2008-09-17 半導体装置の製造方法 Active JP5406487B2 (ja)

Priority Applications (1)

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JP2008237423A JP5406487B2 (ja) 2008-09-17 2008-09-17 半導体装置の製造方法

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JP2008237423A JP5406487B2 (ja) 2008-09-17 2008-09-17 半導体装置の製造方法

Publications (3)

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JP2010073765A JP2010073765A (ja) 2010-04-02
JP2010073765A5 JP2010073765A5 (enExample) 2011-09-22
JP5406487B2 true JP5406487B2 (ja) 2014-02-05

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5357100B2 (ja) * 2010-04-09 2013-12-04 アルプス電気株式会社 フォースセンサパッケージ及びその製造方法
JP5771915B2 (ja) * 2010-08-03 2015-09-02 大日本印刷株式会社 Ｍｅｍｓデバイス及びその製造方法
US8476720B2 (en) * 2011-06-29 2013-07-02 Honeywell International Inc. Systems and methods for vertically stacking a sensor on an integrated circuit chip
WO2014042055A1 (ja) * 2012-09-13 2014-03-20 アルプス電気株式会社 半導体装置
TWI559495B (zh) * 2013-07-24 2016-11-21 精材科技股份有限公司 晶片封裝體及其製造方法
DE102019110570B4 (de) * 2019-04-24 2023-05-25 Infineon Technologies Ag Magnetfeldsensorpackage mit integrierter passiver komponente
JP2024012731A (ja) * 2020-12-21 2024-01-31 アルプスアルパイン株式会社 歪みセンサ
JP2022155336A (ja) * 2021-03-30 2022-10-13 ミツミ電機株式会社 検出装置及び検出装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3985214B2 (ja) * 2001-09-17 2007-10-03 日立金属株式会社 半導体加速度センサー
JP4578087B2 (ja) * 2003-11-10 2010-11-10 Ｏｋｉセミコンダクタ株式会社 加速度センサ
JP4244920B2 (ja) * 2004-12-14 2009-03-25 株式会社デンソー 半導体センサ
JP2008070312A (ja) * 2006-09-15 2008-03-27 Hitachi Metals Ltd マルチレンジ加速度センサー
JP5112659B2 (ja) * 2006-08-11 2013-01-09 ローム株式会社 加速度センサならびにセンサチップおよびその製造方法
JP2009241164A (ja) * 2008-03-28 2009-10-22 Torex Semiconductor Ltd 半導体センサー装置およびその製造方法

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JP2010073765A (ja) 2010-04-02

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