JP5395660B2 - 少なくとも１つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物 - Google Patents

少なくとも１つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物 Download PDF

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JP5395660B2
JP5395660B2 JP2009515814A JP2009515814A JP5395660B2 JP 5395660 B2 JP5395660 B2 JP 5395660B2 JP 2009515814 A JP2009515814 A JP 2009515814A JP 2009515814 A JP2009515814 A JP 2009515814A JP 5395660 B2 JP5395660 B2 JP 5395660B2
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resin
plate
electronic module
opening
assembly
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Japanese (ja)
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JP2010508169A (ja
JP2010508169A5 (OSRAM
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ドロー，フランセス
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ナグライデ・エス アー
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2009515814A 2006-06-19 2007-06-05 少なくとも１つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物 Expired - Fee Related JP5395660B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP06012550 2006-06-19
EP06012550.7 2006-06-19
EPPCT/EP2006/009663 2006-10-05
EP2006009663 2006-10-05
PCT/EP2007/055530 WO2007147729A1 (fr) 2006-06-19 2007-06-05 Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire

Publications (3)

Publication Number Publication Date
JP2010508169A JP2010508169A (ja) 2010-03-18
JP2010508169A5 JP2010508169A5 (OSRAM) 2011-05-19
JP5395660B2 true JP5395660B2 (ja) 2014-01-22

Family

ID=38358055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515814A Expired - Fee Related JP5395660B2 (ja) 2006-06-19 2007-06-05 少なくとも１つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物

Country Status (10)

Country Link
US (1) US8528824B2 (OSRAM)
EP (1) EP2036008B1 (OSRAM)
JP (1) JP5395660B2 (OSRAM)
AU (1) AU2007263133B2 (OSRAM)
CA (1) CA2656978C (OSRAM)
ES (1) ES2537081T3 (OSRAM)
HU (1) HUE026251T2 (OSRAM)
MX (1) MX2008016464A (OSRAM)
SG (1) SG172719A1 (OSRAM)
WO (1) WO2007147729A1 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5525970B2 (ja) * 2010-08-31 2014-06-18 トッパン・フォームズ株式会社 情報媒体およびその製造方法
JP5525980B2 (ja) * 2010-09-28 2014-06-18 トッパン・フォームズ株式会社 情報媒体およびその製造方法
JP5641845B2 (ja) * 2010-09-28 2014-12-17 トッパン・フォームズ株式会社 情報媒体
JP5870564B2 (ja) * 2011-09-07 2016-03-01 大日本印刷株式会社 電子部品一体シートの製造方法、カードの製造方法、電子部品一体シート、カード
EP2644376B1 (fr) 2012-03-26 2015-03-04 Nagravision S.A. Carte incorporant un objet de valeur visible et son procédé de fabrication
JP5556865B2 (ja) * 2012-08-22 2014-07-23 大日本印刷株式会社 カード、カード製造方法
DE102013105575A1 (de) * 2013-05-30 2014-12-04 Infineon Technologies Ag Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls
US20150286921A1 (en) 2014-04-03 2015-10-08 Infineon Technologies Ag Chip card substrate and method of forming a chip card substrate
JP2016048492A (ja) * 2014-08-28 2016-04-07 トッパン・フォームズ株式会社 情報媒体
JP2016048491A (ja) * 2014-08-28 2016-04-07 トッパン・フォームズ株式会社 情報媒体
USD868888S1 (en) 2016-03-03 2019-12-03 Fine Swiss Metals Ag Transaction card
DE102016109654A1 (de) 2016-05-25 2017-11-30 Ovd Kinegram Ag Bogen für ein Sicherheitsdokument, Verfahren zur Herstellung des Bogens und daraus hergestelltes Sicherheitsdokument
EP3651068A1 (fr) 2018-11-12 2020-05-13 Thales Dis France SA Procédé de réalisation d'un insert électronique pour support portable multi-composants et insert obtenu

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123283A (ja) * 1984-07-11 1986-01-31 Toppan Printing Co Ltd Ｉｃカ−ドの製造方法
FR2625000B1 (fr) * 1987-12-22 1991-08-16 Sgs Thomson Microelectronics Structure de carte a puce
JP2560895B2 (ja) * 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
US6817532B2 (en) * 1992-02-12 2004-11-16 Lenscard U.S., Llc Wallet card with built-in light
FR2691563B1 (fr) 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
JPH08230367A (ja) * 1994-12-27 1996-09-10 Mitsubishi Electric Corp 非接触型ｉｃカードならびにその製造方法および装置
GB2309933B (en) 1996-02-12 2000-02-23 Plessey Telecomm Contact card
JPH10166771A (ja) * 1996-12-17 1998-06-23 Dainippon Printing Co Ltd 非接触型ｉｃカードとその製造方法
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
US7093767B2 (en) * 1999-09-07 2006-08-22 American Express Travel Related Services Company, Inc. System and method for manufacturing a punch-out RFID transaction device
JP2002279384A (ja) * 2001-03-19 2002-09-27 Toshiba Corp 携帯可能電子媒体及びその製造方法
US7063264B2 (en) 2001-12-24 2006-06-20 Digimarc Corporation Covert variable information on identification documents and methods of making same
EP1428258B1 (fr) * 2001-09-18 2017-08-30 Nagravision S.A. Procede de fabrication d'une etiquette electronique de faible epaisseur
WO2003044733A1 (fr) * 2001-11-23 2003-05-30 Nagraid Sa Methode de fabrication d'un module comprenant au moins un composant electronique
AU2002361855A1 (en) * 2001-12-24 2003-07-15 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
US6851617B2 (en) 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
JP4109039B2 (ja) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
US20040144472A1 (en) 2003-01-24 2004-07-29 G & D Cardtech, Inc. Process for manufacturing laminated plastic products
NL1022766C2 (nl) 2003-02-24 2004-09-21 Enschede Sdu Bv Identiteitskaart alsmede reisdocument.
MY148205A (en) 2003-05-13 2013-03-15 Nagraid Sa Process for assembling an electronic component on a substrate
WO2005062388A1 (en) * 2003-12-19 2005-07-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP4829529B2 (ja) * 2005-04-28 2011-12-07 株式会社小森コーポレーション 印刷機

Also Published As

Publication number Publication date
HUE026251T2 (hu) 2016-06-28
EP2036008A1 (fr) 2009-03-18
JP2010508169A (ja) 2010-03-18
US8528824B2 (en) 2013-09-10
AU2007263133A2 (en) 2009-02-05
MX2008016464A (es) 2009-04-02
EP2036008B1 (fr) 2015-04-01
WO2007147729A1 (fr) 2007-12-27
CA2656978C (en) 2014-11-04
AU2007263133A1 (en) 2007-12-27
ES2537081T3 (es) 2015-06-02
HK1133940A1 (en) 2010-04-09
CA2656978A1 (en) 2007-12-27
US20100090009A1 (en) 2010-04-15
SG172719A1 (en) 2011-07-28
AU2007263133B2 (en) 2012-04-05

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