HUE026251T2 - Eljárás legalább egy elektronikus modult tartalmazó kártyák elõállítására, elrendezés az eljáráshoz és közbensõ termék - Google Patents

Description

METHOD OF MA NU FACTURE NG CARDS COMPRISING AT LEAST ONE ELECTRONIC MODULE, ASSEMBLY PRODUCED DURING THIS MEET HOD AND INTERMEDIATE PRODUCTS

The present invention concerns a method of manufacturing cards that each Include an electronic modulo, in particular, an electronic module comprising an electronic display. Trie card obtained from the method according to the Invention Is. for example, a bankcard, In particular, which conforms to the ISO standard. However, the present invention: can also apply to electronic cards whose general profile Is not rectangular, particularly circular cards. The present Invention: also concerns assemblies and Intermediate products obtained within the scope of the method according: to the Invention.

Electronic cards or integrated circuit cards have considerably developed over the last few years. Initially, electronic cards were formed of a card body including a resistive contact module housed m a recess In the body of the card. Then, contactless cards were made, he, cards including a transponder formed of an electronic circuit con heeled to an antenna. As electronic cards develop, It Is sought to integrate other electronic elements for other functions into the cards. By way of example, cards Including a switch that can be activated by the user and an electronic display have been disclosed. Such cards generally require relatively large batteries or powering means of the photovoltaic cell type. In order to Integrate these various elements in a card;, they are generally grouped together In the form of at least one electronic module, including: a support or substrate, on the surface of which various electronic elements are arranged. Figure 1 shows a schematic example of this type of module. Module 2 Includes: an Integrated elmúlt 4, connected to an electronic display 6, a battery 8 and an activator 10, arranged on a support 12, forming a RGB Interconnecting these various elements, in order to limit trie thickness of these modules, the battery and/or trie display can be arranged at the periphery of support 12 or In recesses therein.

It Is not easy to Integrate a relatively large electronic· module, made up of various elements of variable shape and; size. In a card. Further, Integrating a digital display, which has to be precisely positioned In the manufactured card, causes an additional problem, which the present Invention proposes to overcome. EP Patent No. O 870 784 discloses, in one implementation, a method of manufacturing cards Including an electronic assembly, In particular, a transponder,: which Is placed In a main aperture of a positioning frame According to the implementation disclosed, the transponder end the positioning frame are embedded: In a binding: agent that can be added In viscous liquid form, particularly a resin. In: EP Patent No, 0 S7Ô 784, the positioning frame is only used for delimiting an inner cone for the franspohdep formed of an integrated circuit and a coil, inside the card. Thus, when pressure is applied to the various elements and the binding agent to form a card, the transponder is held in an inner zone, whereas It is possible for the binding agent, In a non-solid state, to spread out on to form a layer that passes through the manufactured card. These skilled in the art can find:, in this Patent document, a method 1er Integrating a relatively large and complex-shaped electronic module In a compact, flat card. 14 owe ver, the electronic module placed in the main aperture of a positioning frame, as described to that document, will often be moved slightly when the card Is being formed. Indeed, this document does not disclose bow to maintain the transponder In a precise:, determined position Inside the aperture of the positioning frame,; Those skied in the art might certainly think of reducing the dimensions of the main aperture to make them approximately match the dimensions of the electronic module,. In particular the external profile of the module, However, manufacturing tolerances must be taken Into account, so that It is difficult to envisage too tight a fit.; Moreover, depending upon the way In which the modules are manufactured, the positioning of the various elements on the support may also vary slightly. Thus, for example, digital display 8 Is arranged on the surface of the ROB or at the periphery thereof in a position: that may vary slightly. However, to obtain a high quality card, this: digital display must be positioned precisely relative to the external contour of the manufactured card, This Is particular important when a transparent aperture, which fits the dimensions of the digital display, is arranged above the digital display to allow the user of the card to read the display.

There Is a further problem: in addition to this problem of positioning the electronic module relatíve to the external contour of the card. This problem concerns Introducing the electronic module within the card manufacturing installation. It will be noted here that electronic cards are generally manufactured In batches, le. several cards are manufactured simultaneously la the 'term of a plate that includes a; plurality ùf «electronic modules: Then, each card: Is separated from the obtained plate during a cutting step, as Is described in EP Patent No. 0 570 704. Within the scope of the embodiments described In the latter disclosure, the transponder' remains free in relation: to the positioning frame until the card Is formed. This requires precautions In the handling: of the various elements brought to form the card, to ensure that the transponders remain In the corresponding apertures In tho positioning: structure until the press Is activated.

The present invention thus also proposes to answer this latter problem:, in order to simplify the provision of electronic modules, while ensuring that: the electronic modules are held in the apertures of a positioning structure and to facilitate assembly of the various elements and materials provided for manufacturing the cards.

Therefore, the : present invention concerns, firstly, an assembly produced during the manufacture of cards, which each: Include an electronic module, Tho card manufacturing process Includes the provision of a: plate, which has at least one, at least partially through aperture, and at least one electronic module, which Is electrically Independent of said plate and housed, at least partially, In said at least one aperture. In an Installation where a resin is added to at least one side of said electronic, mcdule, said plate forming a poslhonlng structure for said electronic modulo. This assembly Includes sold plate and said: at least one electronic module and Is characterised in that, before said assembly is brought tu said Installation, said1 plate and said at least one electronic module are assembled In a sufficiently rigid manner for said at least one electronic module to remain in a substantially defined position relative to said plate, firstly until the resin is added, and subsequently during said resin is added..........................................................................................................................................................................................

It should be noted that the resin could be added in various forms and In: various slates. The term “resin” should be understood In a broad sense, including: various known adhesives, PVC and Polyurethane resins or other resins available to those skilled: In the arc

In a preferred e mbod !m e n t, each ape dure and/or t he electronic rn cd nie located In said aperture are arranged such that a space remains In the aperture, and: open on at least one side of the plate. The card or intermediate product manulaelur^g: process then includes a step where· a filling: material is introduced into this apace 'remaining in the apertures.

Assembling the piáié pierced with apertures and electronic modules in a: preliminary step of the card manufacturing method has numerous advantages and answers the aforementioned problem. The fact that a material connection is made between the electronic module and the plate means that the assembly can be handled, in particular, via the plate, In order to Implement subséquent steps In the card manufacturing method. The assembly according to the Invention resolves the problem of holding the electronic modules In the apertures of the plate, when the plate and: electronic modules are brought Into an Installation where a resin Is added In accordance with the card or intermediate product manufacturing method of the invention.

In the preferred embodiment, wherein a space remains in the apertures of the pierced: plate after the assembly according to the Invention has been assembled, the spaces remaining In the apertures are generally lied with a filling material or a resin by applying pressure, particular using a press or a roller that spreads out the tilling: material or resin. If no particular precautions are taken, this step may move the electronic modules relative to the frame. The assembly according to the present Invention resolves this problem In an: advantageous manner, by maintaining the modules In a precise position during the entire card manufacturing method; both in the general plane of the plate and along the axis perpendicular to the general plane.

The present Invention also concerns an intermediate product of the card manufacturing process, which comprises an assembly according to the aforementioned preferred embodiment, and a filing material,: which fills at least most of the space remaining In the plate apertures, where the electronic modules are situated. The top and bottom surfaces of this Intermediate product are preferably more or less fiat; In a first variant, the thickness of the intermediate product is approximately the same as said plate, the filing material being essentially provided in the spaces remaining In the plate apertures. In a second: variant, the fling material Is formed by; a resin, which covers at least one of the top and bottom surfaces of the plate. : In this letter case, the Intermediate product has improved rigidity, because the resse covers at least one side of the plate ana preferably both sides..

If the resin covers both sides of the plate and the electronic modules, the Intermediate product, oan already be used as a card, when the cuter surfaces are approximately flat.. However, there are several advantages to making the Intermediate prodioct according to the Invention In a card manufacturing method that includes at least one further step of adding resin to both sides of the Intermediate product The present Invention also concerns this manufaotunng: method. According to this method of manufacturing at least one card, an Intermediate product, as defined above, Is made,, and then the resin Is deposited on at least one of the top and bottom surfaces of the Intermediate product Finally, pressure Is applied to the deposited resin, which Is then In a non-solid state, to form at least one card that has a flat: outer surface, since the resin deposited on the Intermediate produet flits In any variations In thickness in the Intermediate product The resin deposited on the Intermediate product: preferably forms a thm layer. The resin oan be added in a single step or In several successive steps to further Improve flatness,

This method is particularly advantageous for obtaining cards which have a perfectly fiat surface and which Incorporate a relatively large electronic module that has variations In thickness and is formed of various elements. In fact, when the electronic module is formed of various elements, made of different materials and with different levels of thickness and empty intermediate zones, the filling: material or resin added1 to the remaining space in the plate aperture is dlstnbuted in an Irregular manner, with variations m thickness. When: the filling material or resin hardens, shrinkage:, and thus a variation in thickness, may occur in the resin, which then generates a surface with slight nollows or Pumps. The surface state of the intermediate product generally does net meet the bankcard standards, but the variations in thickness can be removed:, by subsequently depositing1 a resin film on both sides of the Intermediate product, when the finished cards are formed, The cards then have perfectly flat outer surfaces,

Generally, the invention concerns a method of manufacturing at least one Intermediate product or at least one card including the following steps: ~ making an assembly according to the preferred emibodiment of the invention described above, said assembly Including a plate that has at least one aperture and at least one electooie module arranged, at least partially> In said aperture, said plate and said at least: one electronic module being assembled, before a filing material Is added to the remaining space In said at least one aperture, In a sufficiently rigid1 manner to bold said at least one electronic module In said: at least one aperture, In a substantially fixed position relative to said plate, prior to and: during the following: step of: - adding a filling materiel and Introducing said filling malarial in a viscous liquid state into said remaining space In said at leant one aperture; - solidifying sa Id filing: m aterlai.

According to a preferred variant, the method Is characterized in that a resin is deposited over at least one of the bottom and fop surfaces of said plate, at least on the side where the filing material was Introduced Into said at least one aperture In said plate. According to a preferred variant, the filling: material Is identical to the resin and Is added simultaneously.

According to a particular feature of the method described above, the resin Is spread out using at least one roller or one blade, which moves relative to the plate" electronic module assembly. An Intermediate product or card: with more or less flat outer surfaces is thus obtained.

Other advantages and particular features of the assembly cf the invention, of the: method according: to the present invention, and Intermediate products obtained within the scope of the method, wiii appear mere clearly upon: reading the following description of embodiments of said assembly and said Intermediate product. In addition to Implementations of the intermediate product or card: manufacturing method:, which: are given by way of nondimiting example. The description refers to the illustrative drawings, in which: '· Figure 1, already described, shows schematically an electronic module that can be integrated In a card according to the method of the present Invention; - Figure 2 shows a plate involved In a first embodiment of an assembly in accordance with: the present invention: - Figure 3A shows an electronic module being brought Into an ap&rfom of the plate of Figure 2 ” Figure do snows a parttal cross “Section of a first embodiment of an assembly according to the invention, - Figure 4 is a partial top view of the first embodiment of an assembly according to the invention; ~ Figures δ and 6 show, respectively, and partially, first and second variants of the first embodiment of said assembly, * Figure 7Ä Is a partial top view of a plate Involved in a third variant of the first embodiment of said assembly; - Figuré 78 is a partial top view of said third1 variant of the first embodiment of said assembly; · Hgure e shows partially a fourth variant of said first embodiment of said! assembly; -Hgure 9 is a pansai top vrew of a second embodiment of the assembly according to the Invention,, - nrgure 1u rs a partial top vrew of a variant of said second embodiment of salt! assembly; "mgure I s is a partial top vrew of a third embodiment of an assembly according to the invention; - Hgure d s a pansai top view of a fourth embodiment of an assemblv according to the Invention; · Figure 13 Is a partial orosswecflon along the line XlfhXHI of Figure 12; - Figure 14 shows schematically a partial top view of a variant of the fourth; embodiment of said assembly; - Figure 15 is a partial cross-section atone the line XV-XV of Figure 14;

Figure lb vs a partra? cross-sectron of mo Intermediate product according to the present invention, which is produced In a method of manufacturing cards according to the present invention; ~ Figure 17 is a partial cross-section of an alternative embodiment of an intermediate product according to the Invention: - Figure 18 Is a: partial cross-section of another alternative embodiment of an intermediate product according to the invention; ·· Figure 19 Is a partial cross-section of a card obtained according to a manufacturing method of the Invention from the intermediate product shewn in Figure 17; - Figure 20 shows schematically another Implementation of the card manufacturing method of the Invention. This method can also being be applied to make an intermediate product according to the present Invention; - Figure 21 is a: partial cross-section of a plurality of cards that result from the method described in Figure 20: and - Figure 22 shows schematically an alternative embodiment of a plurality of cards or Intermediate products that also result from the method1 described In Figure 29.

With reference to Figures 2 to 4. we will now describe a first embodiment of an assembly according to the Invention, which Is produced in a card manufacturing method, also In accordance with the Invention. The method of the invention Is particularly well suited: to manufacturing cards In batches. I.e, manufacturing several cards simultaneously . The assembly 22 shown partially in Figure 4 Includes several electronic modules 2 for manufacturing several batches of cards. However, it will be noted thai the present: invention Is not limited: to the batch manufacture of cards, but can also. In a particular variant, apply to card-by-oard manufacture, i.e. individual card manufacture.

Assembly 22 includes a plate 14 that has at least one. at least partially through-aperture 16 and at least one electronic module 2 at least partially housed In said at least one aperturo 16. In the example shown In Figure .2, plate 14 has a plurality of through apedures 16 and defines as many frames for electronic modules 2 as there are modules housed in said apertures 16. The plate defines a positioning structure for the electronic modules. According to the Invention, projecting portions 18 are arranged at the periphery of each aperture 16. In the variant shown In

Figures 2 to 4, two projecting portions 18 are arranged on two opposite sides of aperture 16, substantially along a diagonal of said aperture. If will be noted, however, that there can be any number of projecting parts and they can be arranged anywhere along the periphery of each aperture 16. Preferably; at least two projecting portions are provided in each aperture 16, These projecting portions form stop members for the electronic modules inserted in the apertures.

Figures 2 and 4 show, in dotted lines 20, the final periphery of each card: obtained from the manufacturing method of the Invention, In: which assembly 22 Is Involved, in a conventional manner, each card obtained Is cut out by means known to those skilled In the art, Figure 3A shows plate 14 In the cross-sectional plane Hi III of Figure 2. The thickness or height of projecting portions 18 is less than that: of plate 14. Projecting portions 18 are formed before electronic module 2 is brought, In a variety of manners. These portions can be obtained by hot or cold pressing in a press. They can also be obtained using: an ultrasound head or a head generating a high: frequency electric field:. This provides an initial plate 14 of constant thickness, pierced with apertures 16 that have projecting portions, Nest, the thickness of the projecting portions Is reduced, by a tool or head acting in a localised manner on these projecting portions. This step can be performed quickly and efficiently using one ef the aforementioned: means. In another variant of plate 14, the thickness of projecting portions 18 Is reduced by machining, In particular by using a milling cutter, in another variant plate 14 Is formed of two layers, laminate welded to each other, tfie bottom layer including projecting portions 18, whereas the top layer has rectangular apertures that match apertures 16 In the projecting portions. Projecting portions 18 can thus be made by any means known to those skilled: In the art,

Once plate 14 has been made, one electronic module 2, which is electrically independent of the plate, Is Inserted: into each aperture 16, The electronic module and ait the electrical connections thereof, are made beforehand:. Irr the example described here, module 2 Includes a substrate 12, which extends Into at least some zones at the edge of said module, beyond the electronic elements 4 to 8 which said module carries, The dimensions and shape of substrate 12 am such that It has two zones 24 which are superposed on the two projecting portions 18, when electronic module 2 is inserted into aperture 16, Thus, substrate 12 abuts against protecting portions 1-:8, as shown: in Figure .3-8,.

According to the invention:; electronic modules- 2 are assembled to plate 14 in a sutioenüy nerd manner, firstly, so that electronic modules 2 remain In apertures 16 during the card manufacturing method according to the invention; and secondly, so that they approximately maintain: the initial position defined when projecting portions 18 are assembled, I tie electronic module can be positioned when it is Inserted Into aperture 16 relative to a defined reference on plate 14, This positioning ot module 2 relative to plate 14 may concern the module as a whole and thus in particular substrate 12, or It may concern one particular element of the module, in particular" -electronic display 6. This is particularly advantageous, given that display 6 Is, by definition, meant to be visible on: one surface of the finished card. Precise positioning of the display relative to the contour 20 of the cate Is Important for aesthetic reasons, and also functional reasons, when the display appears through an aperture m a covering layer of the card. When positioning is reguired relative to the display, means are provided for marking electronic display 6 and then inserting module 2 In such a way that display 6 is In a determined position relative to plate 14-, which: thus forms a positioning structure.

Electronic module 2 can be secured to projecting portions 18 in various ways, By way of example, provided that the materials forming the two zones 2-4- of substrate 12 and projecting portions 18 can adhere directly to each other, said cones 24 are simply heat welded to projecting: portions 18, using: thermodes. yodule 2 can also he secured1 to plate 14 using an ultrasound head1 or other means known to those skied In the art. In another variant, an adhesive film Is deposited, either on praiecAng portions 18, or on zones 24, so as to bond them to each other. In other variants, substrate 12 Is secured to projecting portions by adding; drops of adhesive or a strip of adhesive between the edge of the substrata and the projecting portions. Any chemical or physical means that assemble module 2 to the projecting portions In a sufficiently rigid: manner can: be used within the scope of the present Invention, A secure assembly Is thus obtained, formed of plate 14 and electronic modules 2, which: are housed In apertures 16 of the plate. Two particular, advantageous feature« of assembly 22 will: be noted; firstly: the thickness of modele 2 is substantially identical to ide thickness of plate 14. electronic module 2 dologi entirely housed In the corresponding aperture 16: secondly ; a slot 26 remains between module 2 and the edge of aperture i6s with the exception of the zones where projecting portions 18 are located.

The fact that module 2 Is housed entirely inside aperture 16. r.e, in the thickness of plate 14,. means that the manufacture or relatively thin cams can he better controlled. This means cards that have the smallest possible increase in thickness relative to the thickness of module 2. The presence: of a slot 26 reduces manufacturing tolerances for pierced plate 14 and modules 2 and also allows substrate 12 to fee positioned slightly differently from one aperture to another, depending upon the position of the electronic display assembled to the substrate. Moreover, as will become clear below, slots 26 can: then be filled: by a resin: which thus provides an: adherent bridge between substrate 12 and the wall of througtr aperture 16. This ensures, finally, that electronic module 2 and: plate 4 ate perfectly secured to each oilier: such that, when the finished card is bent or subjected1 to other stress, electronic module 2 follows the deformation of plate 14 properly. This prevents the edges of substrate 1.2 of module 2 marking the external surfaces of the finished card1 and thus damaging the aesthetic appearance of the card: it wilt be noted: that the material used, In particular 1er making substrate 12. is selected: so that It can withstand a certain amount of elastic deformation: and can allow electronic: module 2 to be bent, when the card is subjected to stress, particularly within the scope of tests carried out to ensure compliance with the relevant standards, A first alternative embodiment Is shown In Figure 5, which shows a single aperture Î8 of a prate 14, which here has approximately the dimensions of a: single card. This simplified diagram, which Is also used In Figures 6 and 8. Is in no way restrictive, and describes an assembly 30, which is similar tc assembly 22 of Figure 4, i.e, for batch manufacturing a plurality of cards.

The variant of Figure 5 differs In that the projecting -portions 18;A are formed In ine tour corners of aperture 18. The portions thus define truncated corners In the bottom area of aperture 16, Projecting portions ISA. which project relative to the generally rectangular shape of aperture 18, car: be made by the same, aforementioned techniques. The dimensions of module 2 are such dial the four comers of substrate 12 are superposed on the four parts ISA, The electronic module Is assembled to plate 14 in a similar manner is the previously described venant.

Figure 6 shows a second alternative embodiment ef the assembly according to the invention. This alternative Is characterized in that it provides a step 34, which forms an intermediate level against which two lateral zones 36 of substrate 12 abut, along two opposite edges of rectangular aperture 16. Steps 34 can be formed in a similar manner tc the projecting portions described in the other variants. The electronic module Is assembled to plate 14 by welding; or bonding, or by any other physical or chemical means available to those skied in the art.

Figures 7A and 78 show an assembly according to a third variant of the first embodiment. Frame 14 Includes a plurality of apertures 16. The peripheral area of each aperture has at least one notch 38 or preferably at least two notches 38. Fach notch defines a small circular step. Electronic module 2 has projecting portions 40 at the edge thereof: which are partially superposed on; notches 38 when module 2 is Inserted in aperture 16 These projecting portions 40 rest on the small circular steps 38, Module 2 Is assembled to plate 14 via zones 40. which are either welded, or bonded in notches 38. In a particular variant: the notches are sized such that projecting zones 40 have to be forcibly pushed into these notches, which secures electronic module 2 to plate 14. However, this latter variant has the drawback of requiring substrate 12 and notches 38 to be machined very precisely in the peripheral area of each aperture 16, It: will be noted that the first and third variants can be combined, with prelecting: portions 18 then being superposed on projecting zones 40.

The various variants of the first embodiment of an assembly according to the invention;, which have been described up until now. are characterized in that distinct zones on the edge ef the electronic module, In particular on the substrate, are superposed on corresponding peripheral areas of the plate aperture, which houses said electronic module. The thiekness of these peripheral areas Is preferably smaller than that of the pierced plate. According to the invention, said edge zone and sard peripheral area, which Is superposed thereon, are assembled to each other so that the electronic module is secured in the plate aperture. The edge zene of the electronic module can directly abut against the corresponding peripheral area or be connected thereto via a resin film. Material connections are thus created between the electronic module and the pierced plate by means of specific zones on the edge of the electronic module, located opposite corresponding peripheral zones of the aperture, in which the-electronic module Is arranged.

Figure S shows a fourth, particular variant of the first embodiment of an assembly of the invention. Assembly 44 Is formed by a frame 14 that includes at feast one aperture Id, which is separated into two secondary apertures by a crossbeam 46 whose: thickness is less than that of plate 14, One could say that aperture 16 has two secondary apertures or equally that there are two apertures separated by a relatively narrow crossbeam. Electronic module 2 Is arranged so that there are no electronic elements in a central area of substrate 12, which Is superposed on crossbeam 46 once module 2 has been inserted in aperture: 16. Module 2 Is assembled to plate 14 via horizontal member 46, to which module 2 is, for example, welded or bonded. Other assembling means could he provided by those skilled In the art, in ail of the variants of the first embodiment of an assembly according to the Invention that have been described, the thickness of the areas of plate 14 that are peripheral to apertures 16 is preferably smaller than the thickness of the plate in general It will be noted that other variants with a plate of constant thickness could be envisaged. In such case, substrate 12 Is located above plate 14, with the electronic elements in aperture 16.

Figure 9 shows a second embodiment of an assembly 50 according to the invention. The references that were described above will not be described again. In detail here. This embodiment Is characterized in that electronic module 2 is assembled to plate 14 via portions of adhesive strip 52, In particular two portions, in this embodiment, electronic module 2 Is entirely contained within the corresponding aperture 16 and has no parts superposed on plate 14. The adhesive strip portions 52 define material connections between each electronic module arm the pierced plate. These portions 62 can be arranged on either side of electronic module 2. In the example cf Figure 9, these portions 52 form a bridge between substrate 12 of moeote 2 the peripheral area of aperture 16, These portions are arranged on the opposite side to the eiectrooic elements carried by substrate 12, This example is Ip no way restrictive.

Inis second embodiment h characterized generally by the arrangement of strips formed: of distinct material elements forming bridges between the edge of the electronic modales and the corresponding peripheral areas of the apertures housing the electronic modules. Art “adhesive strip portion“ means generally a strip portion with a surface that adheres both the plate 14 and to substrate 12, The adherence must be sufficient to- hold the electronic module in the corresponding aperture 16 during transport and handling: of assembly 50.. aod also during the steps of the card manufacturing method, in which this assembly SO Is produced as a constituent element In the batch of simultaneously manufactured cards.

Figure 10 shows an advantageous variant of the second embodiment of an assembly 56. The material connection or bridge between the electronic module and the peripheral area of aperture 16 In plate 14 is achieved here via self-adhesive discs 58. Tire peripheral area or each aperture has notches 60 defining two small intermediate steps, The parts of self-adhesive discs 58 superposed on plate 14 are arranged Inside these notches 60 In eider to avoid creating any excessive thickness relative to frame 14 The depth of notches 60 can be relatively small, at least ecus! to the thickness of disc 58, or, conversely, their depth can be relatively large but less than the thickness of frame 14, The references that: have already been described are net all described again: here.

Figure 11 shows a third embodiment of an assembly according to the invention. This assembly 62 also Includes a pierced plate 14 and: electronic modules 2 arranged in apertures 16, These modules 2 are assembled to plate 14 here by heat-react!eatable adhesive wires 64. These beat-reactivatabie adhesive wires 64 pass through plate 14 and: .in particular, apertures 16, Each heat-reactivafabte adhesive wire 64 is arranged to adhere to plate 14 and to the modules 2 through which It passes. In the example shewn in Figure 11, each electronic module 2 Is held In the corresponding aperture 16 by two wires 64 arranged In proximity to two opposite edges of the module, The beai-reactivatabíe adhesive wire 84 can be a wire made of synthetic or natural material, or covered with adhesive, In another variant, the wire itself is formed by a sold resin, which can he made to: adhere by applying heat or ultra-violet light Of course, in another variant, an adhesive atrip that passes through apertures 18 cam form wire 84, to another variant, the heat reaelivatable adhesive wires could pass grooves made In plate 14 between: two adjacent apertures 16, to prevent the wires causing excessive thickness relative to plate 14.

Heaereacrsvatatue adhesive wires 64 can be added befere or after the electronic modules, depending upon the arrangement anticipated. Likewise, the heatreactivafabie adhesive wires can be provided on ibe side of substrate 12 opposite the eieotrome elements carried by the substrate, as shewn in figure 11, or located elsewhere, relative to substrate 12, m the same side as the electronic elements. The heaweactivatabte adhesive wire can adhere either to substrate 12 or to some ot the electronic elements above which It Is arranged. These skilled; In the ah: will understand that the possible variants are numerous. The assembly method here comprises an element that adheres to the electronic module and fo plate 14 and passes in rough spaces 16 from a peripheral area to another peripheral area of eacn: aperture 16, .Hgyre 11 shews the heat-reactlvatable adhesive wires parallel: to one edge of rectangular apertures IS, but the wires could very well be arranged obliquely, particularly along a diagonal direction of said apertures-16, figures 12 to 15 shew two variants of a fourth embodiment of an assembly according to toe inventory The references that nave already been described previously will not be described again here In detail, This fourth embodiment differs In tint electronic modules 2 are assembled to plate 14 by introducing a resin In siet 26 between module 2 and the corresponding apeduie 16. In the variant shown in Figures 12 and 13, the adhesive Is Introduced, for example by using a syringe, into slot 26 so that a small strip of adhesive TO forms an adherent bridge between the lateral wall 17 of aperture 16 and the edge of substrate 12 of the electronic module. This strip of adhesive can be added once the electronic module has been placed In the corresponding aperture In the plate or before the module Is brought. In this latter case, a strip of adhesive i$ applied against lateral wall 17 ot aperture 16. The slop of adhesive can be added In a viscous liquid state or In a paste like state, or even In a solid state and then made soft or venous by applying heat Strip 70 can be formed by any resin that -adheres sufficiently welt to frame 14 and the electronic modula, to particular to the substrate 12 thereof, to hold the electronic module In the corresponding aporlute and thus enable assembly 68 to be harsdled. without the electronic modules coming out of their respective apertures. The material connection made beforehand between the electronic modulo and plate 14 Is important tor holding the electronic module In a giver? position during the Initial handling operations and also during the various steps of the method: according to the Invention, which will be described below.

The variant of figures 12 and 13 Is characterized In that the strip of resin 76 defines a small bridge In slot 26, be. between the edge of substrate 12 and the lateral surface 17 of plate 14. This obviously does net mean that: resin: strip 70 cannot also extend partly over one or other of the top or bottom surfaces of substrate 12 and also over the: top surface of plate 14, However, It wi be noted that, preferably, the resin for securing the module Is entirely Inside aperture 16 and: does not therefore cause any excessive thickness relative to the plate.

The variant shown In Figures 14 and 16 differs in. that the assembly 72 Includes drops of resin for securing electronic elements 2 to plate 14. These drops 74 are preferably added to the side of substrate 12 where the electronic elements are arranged, The drops of resin 72 form a joint essentially between the lateral wait 17 of aperture 16 and the top surface of substrate 12. This does net, however, mean that drop 74 flows Into slot 26. The two variants of this fourth embodiment of art assembly according to the invention are thus relatively dose to each other, in this fourth embodiment, a resin Is applied locally to create- a bridge o:r joint between the electronic module and the peripheral area of the corresponding aperture. This bridge or loin is preferably located Inside aperture 16 so that It does not cause any excessive thickness relative to the thickness of frame 14, which Is approximately oguai to the maximum thickness of electronic module 2,

It will be noted that the resin can be applied over several distinct edge zones ot module 2., in Figures' 12 and 14, the resin is only deposited in two diametdealfv opposite zones. Evidently, more zonae could be provided, in particular, four zones approximately at the four corners of aperture 16, it will also be noted that: the distinct zones can. be relatively short as shown in Figures 12 and 14, or extend over a longer distanoe: for example. along the two smalt sides of rectangular aperture 16. in all or the embodiments of the assembly according to the invention described above, the electronic module can have various configurations. This, electronic module can have electronic elements on both sides of substrate 12 so that the substrate 12 Is located in the median area of the corresponding: aperture. Some elements can also be arranged in apertures in substrate 12 or at the periphery thereof, to prevent their respective thickness- feeing added, in this latter case, it is also possible for' an electronic element to pass through the substrate and come out of both sides of the substrate. Preferably, the thickness of plate 14 Is approximately identical to the thickness of the electronic module; but this is not a compulsory requirement. Some elements, in particular an electronic display, have a greater thickness than that of plate 14, Finally, it will be noted that various embodiments andrer various variants could be combined with each ether.

Two main variants of an Intermediate product produced during the card manufacturing method according to the invention will fee described below with reference to Figures 16 and 1/.

The Intermediate product 86 shown in Figure 16 Is formed by an assembly according to the Invention, said assembly including a pierced plate 14 and electronic modules housed In corresponding apertures 16. Substrate 12 of module 2. rests abutting against projecting parts arranged at the periphery of apertures 16, as described with reference to the first embodiment of an assembly according to the Invention, Initially, electronic modules 2 and pierced: plate 14 are assembled to each other by an adherent film provided between the projecting parts of plate 14 and substrates 12 of the electronic modules, In another variant, modules 2 are secured to plate 14 Py adding: drops of resin or strips of resin, in particular in the slot remaining between substrate 1.2 and wail 84, it wilt fee noted in Figures 16 and 17 that the example chosen for the assembly according to the invention Is given by way of non-limiting illustration, in fact, any assembly aocording to the invention can form ail intermediate product by adding a filing: material 82 In the: space remaining in apertures 16. in the variant of Figure 16, the filling material 82 approximately fills each aperture 16, without, however, covering the lop and bottom surfaces of plate 14, or the surfaces of electronic display 8 that have the same thickness as plate 14, Filling material 82 fils at least: most of the space remaining In apertures 16, This fling material is added In viscous liquid form and Inserted In the apertures fey various means available to those skied in the art, In particular by casting pouring or any other technique known to those skilled In the art. It will be noted. In particular, that It is possible to envisage introducing fitting material 82 by an Injection technique, by pressing the mould: cover on piste 14, the cover mastering the top surface of electronic display 6 during Infection. One variant can be envisaged wherein: electronic display 6 is also covered by the fling material, which is then transparent. Once again, the examples given are In no way restrictive. In the variant of Figure 18., the filling material Is added entirety through the top surface of frame 14, l.e. on the opposite side of substrate 12 to electronic module 2,

Filling material 82 can be formed by various suitable materials, which preferably have some: elasticity once they have solidified. Preferably filling: material 82 has a good adherence with the lateral walls of openings 16. In particular, a synthetic or natural resin forms material 82. By way of example, material 82 can be a polyurethane resin or a PVC resin. Piaiéba! 82 could also be formed by an adhesive that hardens at ambient temperature or reacts, for example, to ultraviolet Hunt (UV), in another variant: that could be envisaged, material 82 could be formed by a gel or silicon-based material.

The Intermediate product 88 shown In Figure 1? differs from that of Figure 16 in that filling material 82 Is formed by a resin that covers at least the top surface 88 of plate 14, l.e. the surface on the side of which resin 82 was introduced. In the example of Figure 17, resin 82 also covers bottom surface 88 of plate 14 and module 2, in particular, substrate 12, In another variant, plate 14 and the electronic modules are placed on a work surface or a worksheet as In the case of Figure 18, and the resin Is only Introduced slowly:, from above, into the space remaining in apertures 16. In such case, only top surface 88 of plate 14 and the top surface of display 6 will he covered. If electronic display 6 Is covered by resin 82, this resin 82 will obviously be sufficiently transparent to allow the display to be read, âs in the example of Figure 18, electronic circuit 4 Is covered by resin 82,

Once tie resin has been added and distributed in apertures 16, a step is provided ter solidifying: the resin in term the intermediate product.. In the example of figure 17, the assembly according; to the invention is embedded In resin 02, However, In the example of figure 16, resin 82 dees not define a through layer, but If Is localised essentially In apetlares 16 of plate 14, in Figures 16 and 17, the top surface of the solidified resin is slightly rippled, re. It has slight variations In thickness. This does not mean: that the resin was only added by a casting technique, but It can Indicate that, when: the resta or fling material solidified, the material may have shrunk In a note homogenous manner, given the presence of relatively bulky electronic elements, formed of various materials. Thus, the non-flat surface of Intermediate product 88 can also result from: a method wherein the resin Is spread using a roller or blade:, and: even In the case where the resin Is Injected or spread In a press with flat surfaces. The Intermediate product 88 can already be used to form a sard: or electronic token once It has been cot out, but Its surface state can be Improved within the scope of a method: according to the Invention, which will be described below.

Figure 18 shows an alternative embodiment of the Intermediate product, This variant Is dharaciehzed Irt that two worksheets are also provided on either side of the assembly according to fhe Invention, Le, covering: the top and bottom surfaces of the resin layer. These worksheets 104 and 166 thus have poor adherence to resin 82 and facilitate the manufacture of the Intermediate product, In fact, the resin is not then placed: In contact with the surfaces of the manufacturing installation for the Intermediate products according: to the Invention. The worksheets are removed once the resin has solidified. In another variant, a thin plastic film Is provided on each: side of the resin, which adheres securely to the resin: This film remains In the cards manufactured In accordance with the method described below.

With reference to Figure 19, we will describe below a method of manufacturing at least one card: according: to the Invention.. The steps in this method Indude: making an intermediate product according to tho Invention, for example Intermediate product 80 of Figure 16, or Intermediate product 86 of Figure 17; depositing a resin over at least one of the top and bottom surfaces of the intermediate product; applying pressure on the resin deposited en the intermediate product to spread the resin out and make said bottom: and/or said top surface of the Intermediate- product level said main then being in a non-solid state and preferably viscous liquid, to compensate for any variations in thickness in the intermediate product.

Figure 19 shows a plurality of cards that are hatch manufactured In accordance with the method described below. After intermediate product 86 was made, two resin layers 92 have been added on either side of Intermediate product 86, In addition: to two external- solid layers 84 and 96, Using a press, pressure is applied1 against external layers 94 and 96 so as to form a plurality of cards 9(1 The references that have already been cited will not be described again here In detail. If the Intermediate product Includes two external plastic films, the resin is then deposited above and the films are covered with resin on both sides, ft will be noted that there are various possible variante as regards the addition of rosin 92 on either side of Intermediate product 86. A first main variant consists in adding the resin in a viscous liquid state, either before or simultaneously with the addition^ of external layers 94, 96, The card according to the invention can Performed for example In a press with flat surfaces in which the various elements are placed, or using press rollers known to those skilled In the art. Resin: 82 can be Identical to the filling: material or mein 82, used to form the Intermediate product However, a different resin that Is suited to application In thin layers could very well be selected for layers 92. Moreover, a resin 9:2 that Is particularly stable arid has no significant shrink during solidification, will preferably be selected.

As Is clear from Figure 19, intermediate product 88 has a slightly rippled top surface, Resin 92 Is distributed when pressure Is applied so as to fill In the ripples In the Intermediate product, to form a card:, or a plurality of cards 90, whose external layers 94 and 96 have a perfectly flat surface. Manufacturing by adding: the resin or filling: material in two steps results In cards that have a given thickness and thus overcomes the flatness problems encountered In the manufacture of cards that have relatively large electronic modules or elements inside, hr particular electronic elements whose thickness is variable, which cause variable resin thickness Inside the card. The resin can be added to the Intermediate product and pressure can be applied above In several successive steps. Thus, during the first application of resin, two worksheets are preferably used, and then removed once resin layers 92 have solidified.. A second resin layer can then he added above to further improve the flatness of the card. As already mentioned; a multi-layered structure with thin plastic films between two depositions of thin resin layers, could also be provided.

According to a second main variant, the resin layers 92 are added In the form of solid resin sheets, which are then at least partially melted prior to or simultaneously with the application of pressure to form the finished cards, The resin sheets are thus sufficiently soft and easily deformed for the resin to be. able: to spread and fill the surface unevenness of the intermediate product 86, In order to form a high quality flat card, Heat can be applied by various means and, In padleular, via the actual press. Finally, resin 92 can also be solidified In various ways, depending upon the features of the resin:. The resin can solidify at ambient temperature, or by other means known to these skilled In the art, particularly by a: chemical reaction or polymerisation with thermosetting materials.

It wit! be noted that the finished card 90 can: Include several external layers and transparent protective layers, for example, in protect any printing performed an layer 94 or 96. Generally, any intermediate product and any cam obtained within the scope of the present invention, can then be laminated with a variable number of plastic layers, without using any additional resin, An intermediate layer that has been laminated with external layers In this way can form finished cams after the cutting operation.

With reference to Figures 2:0 to 22, we will describe another Implementation of the card or Intemwdlate product manufacturing method according to the Invention, In this Implementation, one may take any assembly according to the Invention, formed of a pierced plate 14 and electronic modules, In particular a display 6 and an electronic circuit 4 mounted on a substrate 12. As In Figures 16 and 17, the electronic display Is arranged In an aperture of substrate 12 or at the periphery thereof, ft Is secured to the substrate by connecting: pins or other connecting: or .securing means. This assembly according to the Invention Is provided wsth a resin 98, in a viscous liquid state, between two solid layers 04 and 96, respectively 194 and 106 in an Installation provided with press rollers 100 and 102, between which the various elements arc· continuously Introduced, Rollers 100 and 192 preferably rotate freely end the assembly formed of the electronic modules end the pierced plate, end the external layers, are pulled. This Implementation Is not restrictive, but has the advantage of allowing the assembly according to the Invention and the exlernal layers In contact with press rollers 100 and 192 to move forward in an Identical way. Resin 98 is preferably added to bottom layer 94, or respectively top layer 164 and over the assembly according to the Invention, This is m no way restrictive and any other way of adding the resin that allows the electronic assembly to be properly embedded or coated could be used by those shilled In the art. The Installation supports have been shown entirely schematically and do not form any particular feature of the method of the invention, ft will be noted that press rollers 109 and 102, and the arrangement thereof In the card manufacturing installation, have been shown schematically, ft Is possible to provide several pairs of press rollers arranged one after the other or other similar means of pressure, for example a continuous press fitted with a conveyor belt. These pairs of rollers can have different diameters and the distance between the rollers of one pair can also be different. In particular, the distance between the press rollers could decrease in the direction of movement of the elements that pass through the press rollers. Thus, the thickness gradually decreases between external layers 94 and 96, or 194 and 106 respectively. This enables the resin 98 lo be better distributed to obtain Improved flatness for the manufactured cards. bteans other than press rollers could be provided, for example blades for spreading out fee resin and distributing It In the remaining spaces in the apertures In the pierced plate and on either side of the assembly of the invention.

Figure 21 shows, a batch of cards obtained by the method described: above. Cards 108 thus Include an electronic module connected to a pierced plate 14 and coated: with resin 98, These cards Include two external solid layers 94 and 98, which: have approximately flat surfaces. These layers 94 and 96 adhere properly to resin 98, so that they form part of the finished cards, in a known manner, each card Is out oat of the batch of simultaneously manufactured cards using a cutting toot or by means known to those skied in the art particularly using a fet fluid.

Figure 22 shows an intermediate product or a batch of cards 110 obtained by the manufacturing; method described with reference to Figure 20. Here, solid layers 104 and 106 form: worksheets that do not adhere well to resin 96 so that these snests 194 and 11)6 are removed once resin 98 has solidified. An Intermediate product, or batch of cards is thus obtained, whose body is formed by resin 98, the external surfaces of the resin then defining the externa! surfaces of the product obtained:. According to various variants, other external layers can be subsequently added, by laminating; either side of the intermediate product 110. Likewise, the cards 108 shown In Figure 21 can also receive other external layers, in particular a printing layer and a final transparent protective layer. The cards can be individually out before or after these additional layers are added.

In another implementation of the method described here, the Intermediate product or cards can he formed In a press that has flat surfaces. All of the elements are added between these surfaces before any pressure Is exerted; to form the Intermediate products or approximately flat cards, it will be noted that It is possible, firstly, to use press rollers and then to place the product obtained in a press with a flat surface until the resin solidifies, it will be noted finally, that resin §8 Is preferably added; In a viscous liquid state. However, in a variant, it is possible to add the resin or any other filling material in a solid state and then to melt it so that It can then ill the remaining spaces In the apertures in pierced plate 14 and thus form compact and substantially full cams, l.e. cards that have a relatively low level of residua! air.

Claims (4)

1. S su abadalmi ig-én^po» tok

   1. Elrendezés (22, 30, 32, 32., 34, 50, 56, 62, 63, 32? kártyák előállítására szolgáló eljáráshoz, .amelyben ezt az elrendezési először egy berendezésbe helyezzek, amelyben ezután töltőanyagét vagv: gyantát hordunk lel az elrendezés legalább egyik oldalén, úgyhogy egy közbenső terméket zagy legalább· egy kártyát alakítunk) ki, az elrendeziz legalább egy elektronikus modult (2) és eqy; lapot (14) tartalmaz, amely legalább egy átmenő nyílással yl6> yan ellátná, amelyben az elektronikus modul. (2) van elhelyezve, továbbá az elrendezést as jellemzi, hogy az elektronikus modul (2) elektromosan független a laptól (14), bogy mindegyik átmenő nyílás égy van elrendelve az ebhez'-az átmenő nyilasban levő elektronikus modulhoz viszonyítva, hogv az átmenő· nyilasban közbenső tér marad, a töltőanyag vagy a. gyanta befogadására, hogy mindegyik elektronu.Kus móriul es a megfelelő átmenő- nyitás fala (17) kozott rés (26? van a töltőanyag vagy a gyanta befogadáséra, es hogy a lap e.s a legalább egy elektronikus modul. rögzitbeszizözbá (.1.3, J.3.A, 34, 38vií), 4:6, 52, 58-+60, 70, 74) segítségével ügy van összeszerelve, hogy a legalább egy eiekexenu.bus mooul a legalább egy átmenő nyírásban a laphoz viszonyítva lényegében meghatározott helyzetben marad, a rbgzitőeszkőzek a zap ea a legalább egy elektronikus modul kozott összeköttetesebet 'vagy hidakat alkotnak, amelyek megszakítják vagy keresztezik az eeyaa elektronikáé mods.! ok és a megfelelő- átmenő- n.yliás közötti r ást . 2. la 1. igénypont szerinti elrendezés (22, 30, 32} , azzal jellasse&v·«, hogy a lap (14) mindegyik átmenő nyílásának (16;: kerületén legalább egy kiálló résa (18, 181, 34; van; amelynek vastagsága kisebb, mint a lapé, és amely átfedi az ebben az átmenő nyiláéban elhelyezett elektronikán modul szálénak egy zónáját; amely zóna az említett kiálló részhez van rögzítve: a lap es az elektronikus modal dsszeerds :U/:éséhez..
2. 3, Pz 1, vagy ,2 „ igénypont, ezerinti elrendezte {.42.}, azzal g ml less® zve, bogy mindegyik, alekéróni kes modal (z) legalsóé egy kiálló zónával (4b) rended kezik, amely átfedi a lap (11) megfeleld átmenő nyilasának (18) egy kerületi tartományát; amely kiálló zóna az említett kerületi tartományhoz van rögzítve a lap és az aiektroazkus mobuz ooszeeroazzesenez. gy g 3., igénypont szerinti elrendezés...142}., aggal jellemezve,, hocfy az erűi tett kerületi tartományt az egyes átmenő nymiaeGK kerületén kialakított mélyedés 133/ képezi; amely egy közbenső lépését éd.kot., amelynek vastagsága kisebb; .mint a lapé (lé). 5, dz I» igénypont szerinti elrendelés (41/, azzal ja 1.1 amaz me, hogy mindegyik átmenő nyílást két másodlagos nyilasra osztja fel a lap kereoztiéoe 14hí ? amely...áttérd az gooes, az armaoo nyílásban elhelyezett elektroné/kas moduli (2)., es ez a 'keresztléc az elektronikus modulhoz van erősítve, hogy ezt a raghoz rögzítse. ; €, Az 5. igénypont szerinti elrendezés, azzal jel lessen ve , bogy a kér a art léc vastagsága kisebb#, mint a lapé.
3. 7. Az 1< igénypont szerinti elrendezés iáig 56. 62;# astsal ÿ&amp;llmmzv®.( bogy mindegyik elektronikus modal. >2} ragasztott köteasel van a laphoz erősítve. 8.. a 7, igénypont szerinti, elrendezés iS G# 56'}, azzal geXXemeavo, bogy a ragasztott kötéseket ragasztószalag aarabok íS2) vagy ragasztóanyag korongok äSa) alkotják. á, A 6. i.qénysont szerinti elrendezés (56), azsal gelXsasosvo, hogy a ragasztott kötések s. lapon az egyes nyílások lit! kerületén kialakított mélyedésekben (60) vannak rögzítve. löt. 1 7. igénypont szerinti, elrendezés (62), azzal j el least zve, kegy a ragasztott kőtosekot hőre ragadd szálak vagy szalagok tél) alkotlak.., ama gyek here az te zik a lapban, levő .átmenő nyilasokat, és összekötik az ezekben az átmenő nyílásokban· elhelyezett eiekt:roni.k.ns modulokat (2) a lappal. 11. őz 1. igénypont szerinti, alrendé zés óta, 7.2}, azzal goXXos&amp;sazve, bogy a lap (14} egy átmenő nyzi.ásaran einetyezeot mindegyi-k elektronikus modul dl) a i.appui gyaotacseppek vvdy oyautasévök segitségévai tan összekötve,: amei.yek anyagún oa mm. képeznek az aiektronrkiis stoooz as a rag kozott. 12. äs előző igénypontok egyike seer inti elrendezés, azzal , bogy mindegyik eleittrorifcns modal (z.: es ettronz,rus eiemeket horhosé -alappal (2) rendelKezrK, es as etektrong.kus rzohal ennek as alapnak a segítségével van összeszerelve a Xappas ., la. Közbenső termes ¢80. 8s) .tatzyak ezoedm. iras are z, sssáx jellÄ^sve, bogy as 1.,-12 » igénypontok egyike szerinti, elrendezés és egy toltőgyanta (82) alkotja, amely Kitölti az elrendezés legalább egy át menő nyi sásában megmaraao kozoenso térnek legalább a nagyobb részét, 14, Ä 13, Igényporít. szerinti közbenső térnék, ézz&amp;I jell^pazve, hogy· a közbenső termék lényegében sir also és reise területtel rendelkezik, 15, Ά 13, vagy lé, igénypont szerinti közbenső termék (86), asgal * bogy a lap ils) alsó és reise rei.üreteinek iáig 8 83 legalább egyikét boti to tedégyantát (.82.) tartalmaz, 161 Ä 13. igénypont szerinti közbenső termék, azzal jellaméav-sy bogy a toltőgyanta és a fedögyanta ugyanabbéi az anyagból ran, 1.7, A 15, vagy la, igénypont szerinti kozoenso termek, azzal iellemezYsy, bogy a iedogyantát (82) legoiábP egy szxiaro rétég (104, 106) borítja, amely szilárd réteg a ieGogyanténoz gyengén tapadó rsérkafóliat alkot, any ív a kártya előállítása folyamán történd eltávolításra van tervezve, úgyhogy a rész kártya nem tartalmazza. ezt a .munkaiel iát,
4. 13. Eljárás közbenső termék vagy legalább egy kártya előállítására, amely eljárás á következő lépéseket tartalmáéra:: - az 1.-12, 1 g é n y p o n t o k eg y 1 ke s se r 1. n 11 e ! r e ad esés megváltsitasa ? - toitogyanta (32, 28} felhordása, és érmék a toitőqyamfcának a bevezetése viszkózusán folyó állapotban, az - 1 r orráé ele lap j árvák (14} átmenő nyílásaiban (16} megmaradó tétbe; és - a éolzőgyanta .megszilárdítása. 1.9, ,á 13, igényperre szerinti. ölj áras, azzal j®2'X®m«!»v®, hogy fedőgyantát (82, 88} visz (tok fel a lap (Is) alsó és felső fel vli étéin ok 1 aga labfc agyi, kére ,· 26 > A 19 . Igénypont, ezer.inti. el járás, aszal jellemezve, hogy a tolt©gyantát és a' fedőgyantát agyarar az anyag alkotja, és ezeket egyidejűleg alkaimat zo.k. 21, é 18. vagy 20n igénypont szerinti eljárás, &amp;szAl jellemezve, hogy legalább egy szilárd réteget (84, 86; IU4, 106} visziuak. fel a fedőgyantára egy felső és/vagy alsó réteg kialakításához, 22, á 21. igénypont szerinti, eljárás, azzal jellemezve, "hogy a felső réteg, ini .(at also réteg a feőögyantához gyengén tapadó minkaiéi!a (104, 106} , amely munkaisálat resöbb eltávolítjut> 23, à 21. igénypont szerinti eljárás, errai g ellessem ve ,. hogy a felső rétég, Ili. az alsó réteg az előállított kártya, egy rétegét alkotja, amely szilárd réteg or er er tapad a fedőgvattahot, 2 4, A 18, Igénypont szerinti eljárás:, azæ&amp;X. jelíemazve·, Ángy a fedőgyantáé lagalább egy henger (len, 102) vagy az el rendeléshez viszonyítva mozgo penge segítségével égy terítjük szét., hogy a fedőgyanta a megkeményedée után lényegéiben sie külső felületű, 25 „ A 19,-23, igénypontok egyike szerinti eljárás,, asnsal gelles»s;ye, hogy a töltőgyantái éa a fedogyantát legalább egy henger (lOOy 102) : tégy az: e lerendezéshez vimzonyitya mozgo penge segítségével ágy terítjük szét, hogy ezek a: gyanták a megkeményetíls után lényegében sik külső felületiek.