JP5390600B2 - エポキシ樹脂反応性希釈剤組成物 - Google Patents

エポキシ樹脂反応性希釈剤組成物 Download PDF

Info

Publication number
JP5390600B2
JP5390600B2 JP2011510552A JP2011510552A JP5390600B2 JP 5390600 B2 JP5390600 B2 JP 5390600B2 JP 2011510552 A JP2011510552 A JP 2011510552A JP 2011510552 A JP2011510552 A JP 2011510552A JP 5390600 B2 JP5390600 B2 JP 5390600B2
Authority
JP
Japan
Prior art keywords
cyclohexanedimethanol
cis
trans
epoxy resin
ether
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011510552A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011521075A5 (https=
JP2011521075A (ja
Inventor
イー．，ジュニア ヘフナー，ロバート
ダブリュ．，ジュニア フル，ジョン
ダブリュ． リンガー，ジェイムズ
エヌ． アルギロポウロス，ジョン
Original Assignee
ダウ グローバル テクノロジーズ エルエルシー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ダウ グローバル テクノロジーズ エルエルシー filed Critical ダウ グローバル テクノロジーズ エルエルシー
Publication of JP2011521075A publication Critical patent/JP2011521075A/ja
Publication of JP2011521075A5 publication Critical patent/JP2011521075A5/ja
Application granted granted Critical
Publication of JP5390600B2 publication Critical patent/JP5390600B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
JP2011510552A 2008-05-22 2009-05-04 エポキシ樹脂反応性希釈剤組成物 Active JP5390600B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5523908P 2008-05-22 2008-05-22
US61/055,239 2008-05-22
PCT/US2009/042645 WO2009142900A1 (en) 2008-05-22 2009-05-04 Epoxy resin reactive diluent compositions

Publications (3)

Publication Number Publication Date
JP2011521075A JP2011521075A (ja) 2011-07-21
JP2011521075A5 JP2011521075A5 (https=) 2012-05-10
JP5390600B2 true JP5390600B2 (ja) 2014-01-15

Family

ID=40793144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510552A Active JP5390600B2 (ja) 2008-05-22 2009-05-04 エポキシ樹脂反応性希釈剤組成物

Country Status (6)

Country Link
US (1) US8318834B2 (https=)
EP (1) EP2283093B1 (https=)
JP (1) JP5390600B2 (https=)
CN (1) CN102037086B (https=)
TW (1) TW201002780A (https=)
WO (1) WO2009142900A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110054056A1 (en) * 2008-05-22 2011-03-03 Hefner Jr Robert E Thermoset polyurethanes
JP5795804B2 (ja) 2010-09-30 2015-10-14 ダウ グローバル テクノロジーズ エルエルシー コーティング組成物
WO2012044443A1 (en) 2010-09-30 2012-04-05 Dow Global Technologies Llc Epoxy resin compositions
JP2013538918A (ja) 2010-09-30 2013-10-17 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂アダクトおよびその熱硬化樹脂
EP2621990B1 (en) 2010-09-30 2016-02-24 Blue Cube IP LLC Thermosettable compositions and thermosets therefrom
US8962792B2 (en) 2010-09-30 2015-02-24 Dow Global Technologies Llc Process for preparing epoxy resins
WO2014078219A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
WO2014078218A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
CN105229095A (zh) * 2012-12-14 2016-01-06 蓝立方知识产权有限责任公司 高含固量环氧树脂涂料
CN103665325A (zh) * 2013-11-25 2014-03-26 苏州宏泉高压电容器有限公司 环氧树脂及其制备方法
US9382472B2 (en) 2013-12-18 2016-07-05 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
US9464224B2 (en) 2013-12-18 2016-10-11 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
JP2015209516A (ja) * 2014-04-28 2015-11-24 株式会社クラレ 硬化性組成物、及び硬化物
JP6306419B2 (ja) * 2014-04-28 2018-04-04 株式会社クラレ モノグリシジルエーテル化合物、及びモノアリルエーテル化合物
WO2016209864A1 (en) * 2015-06-25 2016-12-29 Dow Global Technologies Llc Novel epoxy resin system for making carbon fiber composites
US10933389B2 (en) * 2017-07-28 2021-03-02 Swimc Llc Tinting water-borne and solvent-borne paints and stains with powdered colorants
US10934151B2 (en) * 2017-07-28 2021-03-02 Swimc Llc Tinting water-borne and solvent-borne paints and stains with water-only colorants
US11441027B2 (en) * 2017-10-24 2022-09-13 Toray Industries, Inc. Epoxy resin composition, prepreg, and fiber-reinforced composite material
ES2944118T3 (es) * 2017-12-21 2023-06-19 Huntsman Advanced Mat Americas Llc Sistema epoxi curable
AT521316A1 (de) * 2018-06-07 2019-12-15 All Bones Gmbh Polymermischung sowie deren Verwendung im 3D-Druck
CN110819202A (zh) * 2018-08-07 2020-02-21 广东万爱建筑科技有限公司 一种应用于建筑铝模板免脱模剂的石墨烯涂料
US10822517B2 (en) * 2018-11-28 2020-11-03 Industrial Technology Research Institute Resin composition and cured resin composition
WO2021092074A1 (en) * 2019-11-05 2021-05-14 Cambium Biomaterials, Inc. Composition and method for manufacturing resins
US12473439B2 (en) 2020-07-08 2025-11-18 Swimc Llc Paint tinting adjuvant with siccative for liquid colorant system

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548961A (en) * 1982-09-30 1985-10-22 Exxon Research & Engineering Co. Epoxy resin compositions of enhanced creep resistance
US4497764A (en) * 1982-09-30 1985-02-05 Exxon Research & Engineering Co. Epoxy resin compositions of enhanced creep resistance
US4578453A (en) 1984-11-23 1986-03-25 Eastman Kodak Company High molecular weight polyesters
US4623701A (en) 1985-07-10 1986-11-18 The Dow Chemical Company Multifunctional epoxy resins
US5073595A (en) * 1987-12-23 1991-12-17 Minnesota Mining And Manufacturing Company Epoxide resin compositions and method
US5239406A (en) * 1988-02-12 1993-08-24 Donnelly Corporation Near-infrared reflecting, ultraviolet protected, safety protected, electrochromic vehicular glazing
US5355245A (en) * 1988-02-12 1994-10-11 Donnelly Corporation Ultraviolet protected electrochemichromic rearview mirror
US4885319A (en) * 1988-02-29 1989-12-05 Gaf Corporation Solvent resistant irradiation curable coatings
US5463091A (en) 1989-01-17 1995-10-31 The Dow Chemical Company Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene
JPH0459878A (ja) * 1990-06-28 1992-02-26 Nippon Paint Co Ltd 粉体塗料組成物
US5354797A (en) * 1992-08-31 1994-10-11 E. I. Du Pont De Nemours And Company Coating composition of hydroxy functional acrylic polymer, polyol and polyisocyanate crosslinking agent
ATE206725T1 (de) * 1994-04-06 2001-10-15 Ppg Ind Ohio Inc 1,4-cyclohexan-dimethanol enthaltende beschichtungszusammensetzungen
US5681907A (en) * 1996-01-04 1997-10-28 Air Products And Chemicals, Inc. Fast cure amines for ambient and subambient cure of epoxy resins comprising methylamine adducts
KR20050121761A (ko) * 2000-01-19 2005-12-27 히다치 가세고교 가부시끼가이샤 반도체용 접착필름, 반도체용 접착필름 부착 리드프레임 및이것을 사용한 반도체장치
DE10002605C2 (de) * 2000-01-21 2002-06-20 Hilti Ag Härtbare Zwei-Komponenten-Mörtelmasse und deren Verwendung
JP3681978B2 (ja) * 2000-12-19 2005-08-10 株式会社巴川製紙所 光反射板および反射型液晶表示装置
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
CA2469820C (en) * 2001-12-28 2010-02-23 Jim Surjan Adhesive of epoxy compound, aliphatic amine and tertiary amine
TWI223736B (en) * 2002-12-19 2004-11-11 Ind Tech Res Inst Hybrid photoresist with multi reaction models and process for forming pattern using the same
US6806314B2 (en) * 2003-02-03 2004-10-19 Ppg Industries Ohio, Inc. Coating of Hydroxy-functional polymer(s), crosslinker, and 1,3- and 1,4-cyclohexane dimethanols
DE10317646A1 (de) * 2003-04-17 2004-11-04 Cognis Deutschland Gmbh & Co. Kg Strahlungshärtbare Massen
US6818293B1 (en) * 2003-04-24 2004-11-16 Eastman Chemical Company Stabilized polyester fibers and films
US20070110957A1 (en) * 2004-03-16 2007-05-17 Kensaku Higashi Anisotropic diffusing medium and production method therefor
CN101010357B (zh) * 2004-09-03 2012-03-21 陶氏环球技术有限责任公司 可乳化的聚异氰酸酯
JP4135940B2 (ja) * 2004-10-20 2008-08-20 株式会社巴川製紙所 異方性拡散媒体
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
US7425594B2 (en) * 2005-11-23 2008-09-16 Ppg Industries Ohio, Inc. Copolymer of glycidyl ester and/or ether with polyol
ZA200806228B (en) * 2006-02-03 2009-11-25 Dow Global Technologies Inc 1,3/1,4-cyclohexane dimethanol based monomers and polymers
US20110039982A1 (en) 2008-05-22 2011-02-17 Hefner Jr Robert E Epoxy resins and processes for preparing the same

Also Published As

Publication number Publication date
EP2283093A1 (en) 2011-02-16
TW201002780A (en) 2010-01-16
CN102037086B (zh) 2013-08-28
JP2011521075A (ja) 2011-07-21
CN102037086A (zh) 2011-04-27
WO2009142900A1 (en) 2009-11-26
US20110046266A1 (en) 2011-02-24
US8318834B2 (en) 2012-11-27
EP2283093B1 (en) 2014-04-09

Similar Documents

Publication Publication Date Title
JP5390600B2 (ja) エポキシ樹脂反応性希釈剤組成物
JP5390599B2 (ja) エポキシ樹脂のアダクト及びその製造方法
JP5871326B2 (ja) コーティング組成物
JP2013512988A (ja) エポキシ樹脂組成物
EP2621990B1 (en) Thermosettable compositions and thermosets therefrom
EP2621994A1 (en) Epoxy resin compositions
US20220106479A1 (en) Composition comprising a polymer based on epoxide compounds
EP2746312A2 (en) Epoxy resin compositions, methods of making same, and articles thereof
CN102341425B (zh) 包含基于三羟甲基丙烷十八乙氧基化物的缩水甘油醚的可热固组合物
US9359468B2 (en) Divinylarene dioxide resin compositions
US20110060076A1 (en) Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same
KR20120114295A (ko) 에폭시 수지 조성물
US20110039981A1 (en) Epoxy resins derived from non-seed oil based alkanolamides and a process for preparing the same
Rudawska Formulations of epoxy resins
WO2011071650A1 (en) Hydroxyl-functional polyester resins
WO2018047799A1 (ja) エポキシ化合物、エポキシ化合物の製造方法、エポキシ化合物含有組成物、塗料及び硬化物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120315

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120315

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130123

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130405

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130718

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130910

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131010

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5390600

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250