CN102037086B - 环氧树脂反应性稀释剂组合物 - Google Patents

环氧树脂反应性稀释剂组合物 Download PDF

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Publication number
CN102037086B
CN102037086B CN2009801185303A CN200980118530A CN102037086B CN 102037086 B CN102037086 B CN 102037086B CN 2009801185303 A CN2009801185303 A CN 2009801185303A CN 200980118530 A CN200980118530 A CN 200980118530A CN 102037086 B CN102037086 B CN 102037086B
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CN
China
Prior art keywords
epoxy resin
cyclohexanedimethanol
cis
diluent
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2009801185303A
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English (en)
Chinese (zh)
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CN102037086A (zh
Inventor
罗伯特·E·小赫夫纳
小赫尔
詹姆斯·W·林格
约翰·N·阿伊罗普洛斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blue Cube Intellectual Property Co ltd
Original Assignee
Dow Global Technologies LLC
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Publication date
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Publication of CN102037086A publication Critical patent/CN102037086A/zh
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Publication of CN102037086B publication Critical patent/CN102037086B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
CN2009801185303A 2008-05-22 2009-05-04 环氧树脂反应性稀释剂组合物 Expired - Fee Related CN102037086B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5523908P 2008-05-22 2008-05-22
US61/055,239 2008-05-22
PCT/US2009/042645 WO2009142900A1 (en) 2008-05-22 2009-05-04 Epoxy resin reactive diluent compositions

Publications (2)

Publication Number Publication Date
CN102037086A CN102037086A (zh) 2011-04-27
CN102037086B true CN102037086B (zh) 2013-08-28

Family

ID=40793144

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801185303A Expired - Fee Related CN102037086B (zh) 2008-05-22 2009-05-04 环氧树脂反应性稀释剂组合物

Country Status (6)

Country Link
US (1) US8318834B2 (https=)
EP (1) EP2283093B1 (https=)
JP (1) JP5390600B2 (https=)
CN (1) CN102037086B (https=)
TW (1) TW201002780A (https=)
WO (1) WO2009142900A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110054056A1 (en) * 2008-05-22 2011-03-03 Hefner Jr Robert E Thermoset polyurethanes
JP5795804B2 (ja) 2010-09-30 2015-10-14 ダウ グローバル テクノロジーズ エルエルシー コーティング組成物
WO2012044443A1 (en) 2010-09-30 2012-04-05 Dow Global Technologies Llc Epoxy resin compositions
JP2013538918A (ja) 2010-09-30 2013-10-17 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂アダクトおよびその熱硬化樹脂
EP2621990B1 (en) 2010-09-30 2016-02-24 Blue Cube IP LLC Thermosettable compositions and thermosets therefrom
US8962792B2 (en) 2010-09-30 2015-02-24 Dow Global Technologies Llc Process for preparing epoxy resins
WO2014078219A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
WO2014078218A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
CN105229095A (zh) * 2012-12-14 2016-01-06 蓝立方知识产权有限责任公司 高含固量环氧树脂涂料
CN103665325A (zh) * 2013-11-25 2014-03-26 苏州宏泉高压电容器有限公司 环氧树脂及其制备方法
US9382472B2 (en) 2013-12-18 2016-07-05 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
US9464224B2 (en) 2013-12-18 2016-10-11 Rohm And Haas Electronic Materials Llc Transformative wavelength conversion medium
JP2015209516A (ja) * 2014-04-28 2015-11-24 株式会社クラレ 硬化性組成物、及び硬化物
JP6306419B2 (ja) * 2014-04-28 2018-04-04 株式会社クラレ モノグリシジルエーテル化合物、及びモノアリルエーテル化合物
WO2016209864A1 (en) * 2015-06-25 2016-12-29 Dow Global Technologies Llc Novel epoxy resin system for making carbon fiber composites
US10933389B2 (en) * 2017-07-28 2021-03-02 Swimc Llc Tinting water-borne and solvent-borne paints and stains with powdered colorants
US10934151B2 (en) * 2017-07-28 2021-03-02 Swimc Llc Tinting water-borne and solvent-borne paints and stains with water-only colorants
US11441027B2 (en) * 2017-10-24 2022-09-13 Toray Industries, Inc. Epoxy resin composition, prepreg, and fiber-reinforced composite material
ES2944118T3 (es) * 2017-12-21 2023-06-19 Huntsman Advanced Mat Americas Llc Sistema epoxi curable
AT521316A1 (de) * 2018-06-07 2019-12-15 All Bones Gmbh Polymermischung sowie deren Verwendung im 3D-Druck
CN110819202A (zh) * 2018-08-07 2020-02-21 广东万爱建筑科技有限公司 一种应用于建筑铝模板免脱模剂的石墨烯涂料
US10822517B2 (en) * 2018-11-28 2020-11-03 Industrial Technology Research Institute Resin composition and cured resin composition
WO2021092074A1 (en) * 2019-11-05 2021-05-14 Cambium Biomaterials, Inc. Composition and method for manufacturing resins
US12473439B2 (en) 2020-07-08 2025-11-18 Swimc Llc Paint tinting adjuvant with siccative for liquid colorant system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497764A (en) * 1982-09-30 1985-02-05 Exxon Research & Engineering Co. Epoxy resin compositions of enhanced creep resistance
CN1747979A (zh) * 2003-02-03 2006-03-15 Ppg工业俄亥俄公司 溶剂型2k涂料组合物

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548961A (en) * 1982-09-30 1985-10-22 Exxon Research & Engineering Co. Epoxy resin compositions of enhanced creep resistance
US4578453A (en) 1984-11-23 1986-03-25 Eastman Kodak Company High molecular weight polyesters
US4623701A (en) 1985-07-10 1986-11-18 The Dow Chemical Company Multifunctional epoxy resins
US5073595A (en) * 1987-12-23 1991-12-17 Minnesota Mining And Manufacturing Company Epoxide resin compositions and method
US5239406A (en) * 1988-02-12 1993-08-24 Donnelly Corporation Near-infrared reflecting, ultraviolet protected, safety protected, electrochromic vehicular glazing
US5355245A (en) * 1988-02-12 1994-10-11 Donnelly Corporation Ultraviolet protected electrochemichromic rearview mirror
US4885319A (en) * 1988-02-29 1989-12-05 Gaf Corporation Solvent resistant irradiation curable coatings
US5463091A (en) 1989-01-17 1995-10-31 The Dow Chemical Company Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene
JPH0459878A (ja) * 1990-06-28 1992-02-26 Nippon Paint Co Ltd 粉体塗料組成物
US5354797A (en) * 1992-08-31 1994-10-11 E. I. Du Pont De Nemours And Company Coating composition of hydroxy functional acrylic polymer, polyol and polyisocyanate crosslinking agent
ATE206725T1 (de) * 1994-04-06 2001-10-15 Ppg Ind Ohio Inc 1,4-cyclohexan-dimethanol enthaltende beschichtungszusammensetzungen
US5681907A (en) * 1996-01-04 1997-10-28 Air Products And Chemicals, Inc. Fast cure amines for ambient and subambient cure of epoxy resins comprising methylamine adducts
KR20050121761A (ko) * 2000-01-19 2005-12-27 히다치 가세고교 가부시끼가이샤 반도체용 접착필름, 반도체용 접착필름 부착 리드프레임 및이것을 사용한 반도체장치
DE10002605C2 (de) * 2000-01-21 2002-06-20 Hilti Ag Härtbare Zwei-Komponenten-Mörtelmasse und deren Verwendung
JP3681978B2 (ja) * 2000-12-19 2005-08-10 株式会社巴川製紙所 光反射板および反射型液晶表示装置
US6548175B2 (en) * 2001-01-11 2003-04-15 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
CA2469820C (en) * 2001-12-28 2010-02-23 Jim Surjan Adhesive of epoxy compound, aliphatic amine and tertiary amine
TWI223736B (en) * 2002-12-19 2004-11-11 Ind Tech Res Inst Hybrid photoresist with multi reaction models and process for forming pattern using the same
DE10317646A1 (de) * 2003-04-17 2004-11-04 Cognis Deutschland Gmbh & Co. Kg Strahlungshärtbare Massen
US6818293B1 (en) * 2003-04-24 2004-11-16 Eastman Chemical Company Stabilized polyester fibers and films
US20070110957A1 (en) * 2004-03-16 2007-05-17 Kensaku Higashi Anisotropic diffusing medium and production method therefor
CN101010357B (zh) * 2004-09-03 2012-03-21 陶氏环球技术有限责任公司 可乳化的聚异氰酸酯
JP4135940B2 (ja) * 2004-10-20 2008-08-20 株式会社巴川製紙所 異方性拡散媒体
US7560821B2 (en) * 2005-03-24 2009-07-14 Sumitomo Bakelite Company, Ltd Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
US7425594B2 (en) * 2005-11-23 2008-09-16 Ppg Industries Ohio, Inc. Copolymer of glycidyl ester and/or ether with polyol
ZA200806228B (en) * 2006-02-03 2009-11-25 Dow Global Technologies Inc 1,3/1,4-cyclohexane dimethanol based monomers and polymers
US20110039982A1 (en) 2008-05-22 2011-02-17 Hefner Jr Robert E Epoxy resins and processes for preparing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497764A (en) * 1982-09-30 1985-02-05 Exxon Research & Engineering Co. Epoxy resin compositions of enhanced creep resistance
CN1747979A (zh) * 2003-02-03 2006-03-15 Ppg工业俄亥俄公司 溶剂型2k涂料组合物

Also Published As

Publication number Publication date
EP2283093A1 (en) 2011-02-16
JP5390600B2 (ja) 2014-01-15
TW201002780A (en) 2010-01-16
JP2011521075A (ja) 2011-07-21
CN102037086A (zh) 2011-04-27
WO2009142900A1 (en) 2009-11-26
US20110046266A1 (en) 2011-02-24
US8318834B2 (en) 2012-11-27
EP2283093B1 (en) 2014-04-09

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Granted publication date: 20130828

Termination date: 20210504