JP5380835B2 - 圧電素子 - Google Patents
圧電素子 Download PDFInfo
- Publication number
- JP5380835B2 JP5380835B2 JP2007326857A JP2007326857A JP5380835B2 JP 5380835 B2 JP5380835 B2 JP 5380835B2 JP 2007326857 A JP2007326857 A JP 2007326857A JP 2007326857 A JP2007326857 A JP 2007326857A JP 5380835 B2 JP5380835 B2 JP 5380835B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive adhesive
- epoxy
- vibrating piece
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 claims description 190
- 230000001070 adhesive effect Effects 0.000 claims description 190
- 239000004593 Epoxy Substances 0.000 claims description 70
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 60
- 229910052710 silicon Inorganic materials 0.000 claims description 60
- 239000010703 silicon Substances 0.000 claims description 60
- 238000000605 extraction Methods 0.000 claims description 42
- 239000004642 Polyimide Substances 0.000 claims description 38
- 229920001721 polyimide Polymers 0.000 claims description 38
- 230000005284 excitation Effects 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000013464 silicone adhesive Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 229910001020 Au alloy Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007326857A JP5380835B2 (ja) | 2007-12-19 | 2007-12-19 | 圧電素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007326857A JP5380835B2 (ja) | 2007-12-19 | 2007-12-19 | 圧電素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009152717A JP2009152717A (ja) | 2009-07-09 |
| JP2009152717A5 JP2009152717A5 (https=) | 2011-02-10 |
| JP5380835B2 true JP5380835B2 (ja) | 2014-01-08 |
Family
ID=40921369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007326857A Expired - Fee Related JP5380835B2 (ja) | 2007-12-19 | 2007-12-19 | 圧電素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5380835B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5479931B2 (ja) * | 2010-02-03 | 2014-04-23 | エスアイアイ・クリスタルテクノロジー株式会社 | 圧電振動子、発振器、電子機器および電波時計 |
| WO2018043084A1 (ja) * | 2016-08-31 | 2018-03-08 | 株式会社村田製作所 | 圧電振動子 |
| WO2023074615A1 (ja) * | 2021-10-26 | 2023-05-04 | 株式会社大真空 | 温度センサ付き水晶振動デバイス |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0993073A (ja) * | 1995-09-26 | 1997-04-04 | Kinseki Ltd | 圧電振動子 |
| JPH1169491A (ja) * | 1997-08-19 | 1999-03-09 | Miyota Co Ltd | 圧電振動子 |
| JP2002084160A (ja) * | 2000-06-30 | 2002-03-22 | Kyocera Corp | 圧電デバイス |
| JP2002158557A (ja) * | 2000-11-20 | 2002-05-31 | Daishinku Corp | 圧電振動デバイスの保持構造 |
| JP3948945B2 (ja) * | 2001-11-30 | 2007-07-25 | 京セラキンセキ株式会社 | 圧電振動子及びその製造方法 |
| JP2003198311A (ja) * | 2001-12-25 | 2003-07-11 | Seiko Epson Corp | 圧電デバイスと圧電振動片の接合方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器 |
-
2007
- 2007-12-19 JP JP2007326857A patent/JP5380835B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009152717A (ja) | 2009-07-09 |
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