JP5379211B2 - エピタキシャル構造体及びその製造方法 - Google Patents

エピタキシャル構造体及びその製造方法 Download PDF

Info

Publication number
JP5379211B2
JP5379211B2 JP2011238667A JP2011238667A JP5379211B2 JP 5379211 B2 JP5379211 B2 JP 5379211B2 JP 2011238667 A JP2011238667 A JP 2011238667A JP 2011238667 A JP2011238667 A JP 2011238667A JP 5379211 B2 JP5379211 B2 JP 5379211B2
Authority
JP
Japan
Prior art keywords
carbon nanotube
layer
epitaxial
substrate
epitaxial layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011238667A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012209533A (ja
Inventor
洋 魏
守善 ▲ハン▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Publication of JP2012209533A publication Critical patent/JP2012209533A/ja
Application granted granted Critical
Publication of JP5379211B2 publication Critical patent/JP5379211B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Carbon And Carbon Compounds (AREA)
JP2011238667A 2011-03-29 2011-10-31 エピタキシャル構造体及びその製造方法 Active JP5379211B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110076903.4 2011-03-29
CN201110076903.4A CN102723407B (zh) 2011-03-29 2011-03-29 外延结构体的制备方法

Publications (2)

Publication Number Publication Date
JP2012209533A JP2012209533A (ja) 2012-10-25
JP5379211B2 true JP5379211B2 (ja) 2013-12-25

Family

ID=46949120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011238667A Active JP5379211B2 (ja) 2011-03-29 2011-10-31 エピタキシャル構造体及びその製造方法

Country Status (3)

Country Link
JP (1) JP5379211B2 (zh)
CN (1) CN102723407B (zh)
TW (1) TWI474966B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104952983B (zh) * 2014-03-26 2018-07-10 清华大学 外延结构的制备方法
CN104952988B (zh) * 2014-03-26 2017-07-07 清华大学 发光二极管的制备方法
CN104637795B (zh) * 2015-01-30 2018-03-30 北京大学 硅衬底上iii族氮化物外延薄膜的选区生长方法及结构
EP3404486B1 (en) * 2017-05-15 2021-07-14 IMEC vzw A method for forming a pellicle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10326912A (ja) * 1997-03-25 1998-12-08 Mitsubishi Cable Ind Ltd 無転位GaN基板の製造方法及びGaN基材
JPH11191657A (ja) * 1997-04-11 1999-07-13 Nichia Chem Ind Ltd 窒化物半導体の成長方法及び窒化物半導体素子
JP3930161B2 (ja) * 1997-08-29 2007-06-13 株式会社東芝 窒化物系半導体素子、発光素子及びその製造方法
WO2007081381A2 (en) * 2005-05-10 2007-07-19 The Regents Of The University Of California Spinodally patterned nanostructures
KR100663076B1 (ko) * 2005-08-31 2007-01-02 한국과학기술원 반도체 기판 상의 소정 영역에 탄소나노튜브를 형성시키는 방법, 이를 이용한 반도체 도선 형성방법 및 이를 이용하여 인덕터 소자 제조 방법
JP2008266064A (ja) * 2007-04-19 2008-11-06 Nichia Corp 半導体素子用基板、及びその製造方法
JP5276852B2 (ja) * 2008-02-08 2013-08-28 昭和電工株式会社 Iii族窒化物半導体エピタキシャル基板の製造方法
CN101820036B (zh) * 2009-02-27 2013-08-28 清华大学 一种发光二极管的制备方法
JP2010232464A (ja) * 2009-03-27 2010-10-14 Showa Denko Kk Iii族窒化物半導体発光素子及びその製造方法、並びにレーザダイオード

Also Published As

Publication number Publication date
TWI474966B (zh) 2015-03-01
TW201238887A (en) 2012-10-01
CN102723407A (zh) 2012-10-10
JP2012209533A (ja) 2012-10-25
CN102723407B (zh) 2015-01-21

Similar Documents

Publication Publication Date Title
JP5379212B2 (ja) エピタキシャル構造体及びその製造方法
JP5591864B2 (ja) 発光ダイオードの製造方法
JP5518933B2 (ja) 発光ダイオードの製造方法
JP5351309B2 (ja) エピタキシャルベース及びエピタキシャル構造体の製造方法
JP5746089B2 (ja) 発光ダイオード
JP5538472B2 (ja) 発光ダイオード
JP5518932B2 (ja) 発光ダイオードの製造方法
JP5783881B2 (ja) エピタキシャル構造体の製造方法
JP5591863B2 (ja) 発光ダイオード
US9559255B2 (en) Epitaxial structure
JP5385359B2 (ja) エピタキシャル層を成長させることに用いるベース及びその使用方法
JP5379211B2 (ja) エピタキシャル構造体及びその製造方法
JP5379210B2 (ja) エピタキシャル構造体の製造方法
JP5931402B2 (ja) エピタキシャル層を成長させることに用いるマスク及びその使用方法
JP5591865B2 (ja) 発光ダイオードの製造方法
JP5931401B2 (ja) エピタキシャル構造体及びその製造方法
JP5379209B2 (ja) エピタキシャル構造体及びその製造方法
JP5379208B2 (ja) エピタキシャル構造体及びその製造方法
JP5718209B2 (ja) エピタキシャル構造体の製造方法
JP5608776B2 (ja) エピタキシャル構造体の製造方法

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130426

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130806

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130926

R150 Certificate of patent or registration of utility model

Ref document number: 5379211

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250