JP5352045B2 - 集積回路装置の作製方法 - Google Patents
集積回路装置の作製方法 Download PDFInfo
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- JP5352045B2 JP5352045B2 JP2006153016A JP2006153016A JP5352045B2 JP 5352045 B2 JP5352045 B2 JP 5352045B2 JP 2006153016 A JP2006153016 A JP 2006153016A JP 2006153016 A JP2006153016 A JP 2006153016A JP 5352045 B2 JP5352045 B2 JP 5352045B2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Landscapes
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006153016A JP5352045B2 (ja) | 2005-06-03 | 2006-06-01 | 集積回路装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005164605 | 2005-06-03 | ||
| JP2005164605 | 2005-06-03 | ||
| JP2006153016A JP5352045B2 (ja) | 2005-06-03 | 2006-06-01 | 集積回路装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007013131A JP2007013131A (ja) | 2007-01-18 |
| JP2007013131A5 JP2007013131A5 (enrdf_load_stackoverflow) | 2009-07-09 |
| JP5352045B2 true JP5352045B2 (ja) | 2013-11-27 |
Family
ID=37751159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006153016A Expired - Fee Related JP5352045B2 (ja) | 2005-06-03 | 2006-06-01 | 集積回路装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5352045B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2699552C (en) * | 2007-09-14 | 2013-05-28 | Junsuke Tanaka | Antenna sheet, transponder, and booklet |
| US8685837B2 (en) | 2010-02-04 | 2014-04-01 | Sharp Kabushiki Kaisha | Transfer method, method for manufacturing semiconductor device, and semiconductor device |
| TWI506770B (zh) * | 2010-07-02 | 2015-11-01 | Himax Imagimg Inc | 影像感測器與其製造方法 |
| WO2012046428A1 (ja) * | 2010-10-08 | 2012-04-12 | シャープ株式会社 | 半導体装置の製造方法 |
| JP6517678B2 (ja) * | 2015-12-11 | 2019-05-22 | 株式会社Ｓｃｒｅｅｎホールディングス | 電子デバイスの製造方法 |
| JP6561966B2 (ja) * | 2016-11-01 | 2019-08-21 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04349621A (ja) * | 1991-05-27 | 1992-12-04 | Canon Inc | 半導体基材の作製方法 |
| JP4531923B2 (ja) * | 2000-04-25 | 2010-08-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5121103B2 (ja) * | 2000-09-14 | 2013-01-16 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体装置の作製方法及び電気器具 |
| TW574753B (en) * | 2001-04-13 | 2004-02-01 | Sony Corp | Manufacturing method of thin film apparatus and semiconductor device |
| JP3979074B2 (ja) * | 2001-12-11 | 2007-09-19 | 株式会社豊田自動織機 | 有機エレクトロルミネッセンス素子及びその製造方法 |
| US20040140469A1 (en) * | 2003-01-17 | 2004-07-22 | Tsung-Neng Liao | Panel of a flat display and method of fabricating the panel |
| JP2005045053A (ja) * | 2003-07-23 | 2005-02-17 | Elpida Memory Inc | 半導体装置の製造方法 |
-
2006
- 2006-06-01 JP JP2006153016A patent/JP5352045B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007013131A (ja) | 2007-01-18 |
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