JP5351967B2 - 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 - Google Patents

構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Download PDF

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Publication number
JP5351967B2
JP5351967B2 JP2011525047A JP2011525047A JP5351967B2 JP 5351967 B2 JP5351967 B2 JP 5351967B2 JP 2011525047 A JP2011525047 A JP 2011525047A JP 2011525047 A JP2011525047 A JP 2011525047A JP 5351967 B2 JP5351967 B2 JP 5351967B2
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Japan
Prior art keywords
abrasive
meth
acrylate
wafer
particles
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Expired - Fee Related
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JP2011525047A
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Japanese (ja)
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JP2012501252A (ja
JP2012501252A5 (cg-RX-API-DMAC7.html
Inventor
ウィリアム， ディー． ジョゼフ，
ジュリー， ワイ． チエン，
ジミー， アール．， ジュニア バラン，
ジョン， ジェイ． ギャグリアーディ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2012501252A5 publication Critical patent/JP2012501252A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2011525047A 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Expired - Fee Related JP5351967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (3)

Publication Number Publication Date
JP2012501252A JP2012501252A (ja) 2012-01-19
JP2012501252A5 JP2012501252A5 (cg-RX-API-DMAC7.html) 2012-07-05
JP5351967B2 true JP5351967B2 (ja) 2013-11-27

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JP2011525047A Expired - Fee Related JP5351967B2 (ja) 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用

Country Status (7)

Country Link
US (1) US8251774B2 (cg-RX-API-DMAC7.html)
EP (1) EP2327088B1 (cg-RX-API-DMAC7.html)
JP (1) JP5351967B2 (cg-RX-API-DMAC7.html)
KR (1) KR101602001B1 (cg-RX-API-DMAC7.html)
CN (1) CN102138203B (cg-RX-API-DMAC7.html)
TW (1) TWI429735B (cg-RX-API-DMAC7.html)
WO (1) WO2010025003A2 (cg-RX-API-DMAC7.html)

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Also Published As

Publication number Publication date
KR101602001B1 (ko) 2016-03-17
JP2012501252A (ja) 2012-01-19
US20100056024A1 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
CN102138203B (zh) 2015-02-04
EP2327088A4 (en) 2017-06-14
TWI429735B (zh) 2014-03-11
CN102138203A (zh) 2011-07-27
US8251774B2 (en) 2012-08-28
EP2327088B1 (en) 2019-01-09
TW201012908A (en) 2010-04-01
EP2327088A2 (en) 2011-06-01
WO2010025003A2 (en) 2010-03-04
WO2010025003A3 (en) 2010-04-22

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