JP2012501252A5 - - Google Patents

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Publication number
JP2012501252A5
JP2012501252A5 JP2011525047A JP2011525047A JP2012501252A5 JP 2012501252 A5 JP2012501252 A5 JP 2012501252A5 JP 2011525047 A JP2011525047 A JP 2011525047A JP 2011525047 A JP2011525047 A JP 2011525047A JP 2012501252 A5 JP2012501252 A5 JP 2012501252A5
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JP
Japan
Prior art keywords
abrasive
layer
particles
translucent film
meth
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JP2011525047A
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English (en)
Japanese (ja)
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JP2012501252A (ja
JP5351967B2 (ja
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Priority claimed from PCT/US2009/052188 external-priority patent/WO2010025003A2/en
Publication of JP2012501252A publication Critical patent/JP2012501252A/ja
Publication of JP2012501252A5 publication Critical patent/JP2012501252A5/ja
Application granted granted Critical
Publication of JP5351967B2 publication Critical patent/JP5351967B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011525047A 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Expired - Fee Related JP5351967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (3)

Publication Number Publication Date
JP2012501252A JP2012501252A (ja) 2012-01-19
JP2012501252A5 true JP2012501252A5 (cg-RX-API-DMAC7.html) 2012-07-05
JP5351967B2 JP5351967B2 (ja) 2013-11-27

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JP2011525047A Expired - Fee Related JP5351967B2 (ja) 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用

Country Status (7)

Country Link
US (1) US8251774B2 (cg-RX-API-DMAC7.html)
EP (1) EP2327088B1 (cg-RX-API-DMAC7.html)
JP (1) JP5351967B2 (cg-RX-API-DMAC7.html)
KR (1) KR101602001B1 (cg-RX-API-DMAC7.html)
CN (1) CN102138203B (cg-RX-API-DMAC7.html)
TW (1) TWI429735B (cg-RX-API-DMAC7.html)
WO (1) WO2010025003A2 (cg-RX-API-DMAC7.html)

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