JP5351563B2 - プリント基板およびプリント基板の製造方法 - Google Patents

プリント基板およびプリント基板の製造方法 Download PDF

Info

Publication number
JP5351563B2
JP5351563B2 JP2009050786A JP2009050786A JP5351563B2 JP 5351563 B2 JP5351563 B2 JP 5351563B2 JP 2009050786 A JP2009050786 A JP 2009050786A JP 2009050786 A JP2009050786 A JP 2009050786A JP 5351563 B2 JP5351563 B2 JP 5351563B2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
metal piece
heat
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009050786A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010205995A5 (enExample
JP2010205995A (ja
Inventor
和康 小林
昭久 宮川
和彦 一色
広幸 内田
悟 横川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2009050786A priority Critical patent/JP5351563B2/ja
Publication of JP2010205995A publication Critical patent/JP2010205995A/ja
Publication of JP2010205995A5 publication Critical patent/JP2010205995A5/ja
Application granted granted Critical
Publication of JP5351563B2 publication Critical patent/JP5351563B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
JP2009050786A 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法 Active JP5351563B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009050786A JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050786A JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Publications (3)

Publication Number Publication Date
JP2010205995A JP2010205995A (ja) 2010-09-16
JP2010205995A5 JP2010205995A5 (enExample) 2012-05-31
JP5351563B2 true JP5351563B2 (ja) 2013-11-27

Family

ID=42967191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009050786A Active JP5351563B2 (ja) 2009-03-04 2009-03-04 プリント基板およびプリント基板の製造方法

Country Status (1)

Country Link
JP (1) JP5351563B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019134060A (ja) * 2018-01-31 2019-08-08 日本シイエムケイ株式会社 プリント配線板とその製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781158A (zh) * 2011-05-09 2012-11-14 代芳 一种可提高散热效果的印制线路板技术
CN103096638B (zh) * 2011-10-27 2016-01-13 北大方正集团有限公司 一种压入式高导热pcb板及其制作方法
JPWO2013179527A1 (ja) * 2012-06-01 2016-01-18 日本電気株式会社 シールドケースを有する電子部品
JP6252000B2 (ja) * 2013-07-09 2017-12-27 三菱電機株式会社 基板
JP2016195192A (ja) * 2015-04-01 2016-11-17 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
JP6333215B2 (ja) 2015-05-19 2018-05-30 オムロンオートモーティブエレクトロニクス株式会社 プリント基板、電子装置
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
JP2019009153A (ja) * 2017-06-20 2019-01-17 大陽工業株式会社 配線基板、電子デバイス及び電子デバイスの製造方法
JP6894816B2 (ja) * 2017-09-28 2021-06-30 日本シイエムケイ株式会社 放熱金属片素材を用いたプリント配線板の製造方法
WO2021039849A1 (ja) * 2019-08-30 2021-03-04 パナソニックＩｐマネジメント株式会社 座板付きコンデンサ
JP7560915B1 (ja) * 2024-05-30 2024-10-03 株式会社日本フューテック インレイ基板の製造方法、インレイ基板、及び、部品実装基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544747A (en) * 1978-09-26 1980-03-29 Fujitsu Ltd Manufacture of dielectric substrate
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019134060A (ja) * 2018-01-31 2019-08-08 日本シイエムケイ株式会社 プリント配線板とその製造方法
JP7041535B2 (ja) 2018-01-31 2022-03-24 日本シイエムケイ株式会社 プリント配線板とその製造方法

Also Published As

Publication number Publication date
JP2010205995A (ja) 2010-09-16

Similar Documents

Publication Publication Date Title
JP5351563B2 (ja) プリント基板およびプリント基板の製造方法
EP2146374B1 (en) Printed circuit boards assembly comprising a heat sink
US7606035B2 (en) Heat sink and memory module using the same
US8279607B2 (en) Cooling module assembly method
US20020015288A1 (en) High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications
KR100416980B1 (ko) 볼 그리드 어레이 칩 고정장치
JP6839897B2 (ja) 電子制御装置
JP5885630B2 (ja) プリント基板
EP2575168A1 (en) Electronic device
JP5546778B2 (ja) プリント基板およびプリント基板の製造方法
KR20140032845A (ko) 방열부재, 방열회로기판 및 발열소자 패키지
US9117788B2 (en) Heat sink device and method of repairing semiconductor device
JP2013157377A (ja) 半導体装置の半田付け方法および半田付け治具
JP6569314B2 (ja) 基板放熱構造およびその組み立て方法
US7888790B2 (en) Bare die package with displacement constraint
JP2009123770A (ja) 放熱部材
US8759686B2 (en) Printed circuit board providing heat dissipation
KR100650405B1 (ko) 히트 싱크를 형성하는 솔 플레이트를 가진 전자 어셈블리
KR101884516B1 (ko) 엘이디 라이트용 방열핀 설치방법
JP2009176990A (ja) 電子機器ユニット
KR101735439B1 (ko) 히팅싱크패드가 삽입된 방열인쇄회로기판의 제조방법
US20180332699A1 (en) Printed circuit board
CN117747558A (zh) 一种增强稳固性的多芯片封装结构及其制造方法
JP2007109904A (ja) 半導体チップの実装構造
JP2019036690A (ja) 回路基板構造及び回路基板構造の製造方法

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20101128

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120221

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120316

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20120316

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121211

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130806

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130823

R150 Certificate of patent or registration of utility model

Ref document number: 5351563

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350