CN103096638B - 一种压入式高导热pcb板及其制作方法 - Google Patents
一种压入式高导热pcb板及其制作方法 Download PDFInfo
- Publication number
- CN103096638B CN103096638B CN201110332521.3A CN201110332521A CN103096638B CN 103096638 B CN103096638 B CN 103096638B CN 201110332521 A CN201110332521 A CN 201110332521A CN 103096638 B CN103096638 B CN 103096638B
- Authority
- CN
- China
- Prior art keywords
- copper
- press
- groove
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 102
- 239000010949 copper Substances 0.000 claims abstract description 102
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 92
- 238000000034 method Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000003814 drug Substances 0.000 claims abstract description 15
- 239000002253 acid Substances 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 4
- 229910001431 copper ion Inorganic materials 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 18
- 238000005516 engineering process Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 210000002421 cell wall Anatomy 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000006087 Brown hydroboration reaction Methods 0.000 description 1
- 241000931705 Cicada Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110332521.3A CN103096638B (zh) | 2011-10-27 | 2011-10-27 | 一种压入式高导热pcb板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110332521.3A CN103096638B (zh) | 2011-10-27 | 2011-10-27 | 一种压入式高导热pcb板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103096638A CN103096638A (zh) | 2013-05-08 |
CN103096638B true CN103096638B (zh) | 2016-01-13 |
Family
ID=48208580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110332521.3A Active CN103096638B (zh) | 2011-10-27 | 2011-10-27 | 一种压入式高导热pcb板及其制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103096638B (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104625688A (zh) * | 2014-12-24 | 2015-05-20 | 东莞市中电爱华电子有限公司 | 一种电镀铝基板嵌铜块拍压方法 |
CN105472869A (zh) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | 一种半埋式埋入导热块的印制电路板 |
CN107343353A (zh) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | 一种厚铜pcb板及其散热加工方法 |
CN105764247B (zh) * | 2016-05-09 | 2019-03-05 | 深圳市博敏电子有限公司 | 一种抗高温的大功率强电流印制线路板及其制备方法 |
CN106102324B (zh) * | 2016-06-30 | 2018-12-25 | 景旺电子科技(龙川)有限公司 | 一种预防埋铜块偏位的方法 |
JP2018147996A (ja) * | 2017-03-03 | 2018-09-20 | 株式会社ジェイテクト | 制御基板及び制御基板の製造方法 |
CN107734839A (zh) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | 一种pcb |
CN108055763A (zh) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | 一种pcb的制造方法及pcb |
CN108260282A (zh) * | 2018-01-16 | 2018-07-06 | 生益电子股份有限公司 | 一种pcb的制造方法及pcb |
CN108055765A (zh) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | 一种pcb的制造方法及pcb |
CN108184308B (zh) * | 2018-01-16 | 2020-06-26 | 生益电子股份有限公司 | 一种pcb的制造方法及pcb |
CN108055767B (zh) * | 2018-01-16 | 2020-05-05 | 生益电子股份有限公司 | 一种pcb及其制造方法 |
CN108055764B (zh) * | 2018-01-16 | 2020-03-27 | 生益电子股份有限公司 | 一种pcb的制造方法及pcb |
CN108200714A (zh) * | 2018-01-16 | 2018-06-22 | 生益电子股份有限公司 | 一种pcb及其制造方法 |
CN108184307A (zh) * | 2018-01-16 | 2018-06-19 | 生益电子股份有限公司 | 一种pcb及其制造方法 |
CN108055766A (zh) * | 2018-01-16 | 2018-05-18 | 生益电子股份有限公司 | 一种pcb及其制造方法 |
CN108811304A (zh) * | 2018-06-22 | 2018-11-13 | 胜宏科技(惠州)股份有限公司 | 一种线路板嵌铜加工方法 |
CN111182710A (zh) * | 2019-10-28 | 2020-05-19 | 汕头凯星印制板有限公司 | 一种嵌入铜粒散热线路板及其制造工艺 |
CN111974948B (zh) * | 2020-08-14 | 2021-12-14 | 泉州市唯达五金工贸有限公司 | 一种水龙头加工工艺 |
CN114007324A (zh) * | 2021-11-03 | 2022-02-01 | 江西鹰高科技有限公司 | 一种高导热pcb板及其加工方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744794A (zh) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | 一种阶梯状印刷电路板及其制造方法 |
CN101784160A (zh) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | 压入式高导热pcb板的制作方法 |
CN101790290A (zh) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | 埋入式高导热pcb板的制作方法 |
CN201594949U (zh) * | 2010-01-22 | 2010-09-29 | 东莞生益电子有限公司 | 嵌入式散热结构的pcb板 |
CN102036509A (zh) * | 2009-09-25 | 2011-04-27 | 北大方正集团有限公司 | 一种电路板通孔盲孔电镀方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4159861B2 (ja) * | 2002-11-26 | 2008-10-01 | 新日本無線株式会社 | プリント回路基板の放熱構造の製造方法 |
JP5351563B2 (ja) * | 2009-03-04 | 2013-11-27 | 株式会社日立国際電気 | プリント基板およびプリント基板の製造方法 |
-
2011
- 2011-10-27 CN CN201110332521.3A patent/CN103096638B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1744794A (zh) * | 2004-09-03 | 2006-03-08 | 华为技术有限公司 | 一种阶梯状印刷电路板及其制造方法 |
CN102036509A (zh) * | 2009-09-25 | 2011-04-27 | 北大方正集团有限公司 | 一种电路板通孔盲孔电镀方法 |
CN101784160A (zh) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | 压入式高导热pcb板的制作方法 |
CN101790290A (zh) * | 2010-01-22 | 2010-07-28 | 东莞生益电子有限公司 | 埋入式高导热pcb板的制作方法 |
CN201594949U (zh) * | 2010-01-22 | 2010-09-29 | 东莞生益电子有限公司 | 嵌入式散热结构的pcb板 |
Also Published As
Publication number | Publication date |
---|---|
CN103096638A (zh) | 2013-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103096638B (zh) | 一种压入式高导热pcb板及其制作方法 | |
CN103619125B (zh) | 一种用于提高电镀均匀性的pcb电镀方法 | |
CN101873770B (zh) | 电路板的电镀铜塞孔工艺 | |
US20090120660A1 (en) | Electrical member and method of manufacturing a printed circuit board using the same | |
CN106304668B (zh) | 一种采用增强型半加成法制作印制线路板的制作方法 | |
CN102523689B (zh) | 一种高铜厚线路板的制作方法 | |
US6783654B2 (en) | Electrolytic plating method and device for a wiring board | |
CN102958289A (zh) | 印刷电路板加工工艺 | |
CN104349587A (zh) | 一种印制电路板及其盘中孔的制作方法、以及印制电路板 | |
CN105722302A (zh) | 嵌入凸台金属基的电路板及其加工方法 | |
CN102802367A (zh) | 一种改善pth槽孔孔壁结合力的多层板制作方法 | |
CN103188890B (zh) | 一种pcb板的制作方法及一种pcb板 | |
CN104780710A (zh) | 印制线路板及其制作方法 | |
JP2006012205A (ja) | 回路付サスペンション基板の製造方法 | |
CN104219876A (zh) | 电路板及其制作方法 | |
CN102045964B (zh) | 线路板的制作方法 | |
CN101466206B (zh) | 一种印刷线路板的导通孔电镀的方法 | |
CN103298259A (zh) | 消除高速背板杂讯的钻孔工艺 | |
CN104684264A (zh) | 印刷电路板内层芯板的蚀刻方法 | |
JP2007287920A (ja) | 両面配線基板の製造方法および両面配線基板 | |
CN104470234A (zh) | 一种阶梯镀铜的pcb生产方法 | |
CN103225094B (zh) | 一种盲孔板电镀单面电流保护方法 | |
CN104703401A (zh) | 一种电路板的电镀方法 | |
CN108449887A (zh) | 一种局部孔壁镀厚铜的制作方法及pcb | |
TWI531293B (zh) | 電路板及其製作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI FOUNDER PCB CO., LTD. FOUNDER INFORMATION I Free format text: FORMER OWNER: ZHUHAI FOUNDER PCB CO., LTD. Effective date: 20130829 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130829 Address after: 100871 Beijing, Haidian District into the house road, founder of the building on the 9 floor, No. 298 Applicant after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Applicant after: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. Address before: 100871 Beijing, Haidian District into the house road, founder of the building on the 9 floor, No. 298 Applicant before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Applicant before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |