JP5345848B2 - 半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法 - Google Patents

半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法 Download PDF

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Publication number
JP5345848B2
JP5345848B2 JP2008530160A JP2008530160A JP5345848B2 JP 5345848 B2 JP5345848 B2 JP 5345848B2 JP 2008530160 A JP2008530160 A JP 2008530160A JP 2008530160 A JP2008530160 A JP 2008530160A JP 5345848 B2 JP5345848 B2 JP 5345848B2
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Japan
Prior art keywords
flux
solder
heat spreader
mounting
preform
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2008530160A
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English (en)
Japanese (ja)
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JP2009507395A5 (https=
JP2009507395A (ja
Inventor
ティー． デラム，ブライアン
エヌ． スティップ，ジョン
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ケスター，インコーポレイティド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2008530160A 2005-09-06 2006-09-05 半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法 Expired - Fee Related JP5345848B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/220,457 US20070051774A1 (en) 2005-09-06 2005-09-06 Method of controlling solder deposition on heat spreader used for semiconductor package
US11/220,457 2005-09-06
PCT/US2006/034678 WO2007030516A1 (en) 2005-09-06 2006-09-05 Method of controlling solder deposition on heat spreader used for semiconductor package

Publications (3)

Publication Number Publication Date
JP2009507395A JP2009507395A (ja) 2009-02-19
JP2009507395A5 JP2009507395A5 (https=) 2009-11-05
JP5345848B2 true JP5345848B2 (ja) 2013-11-20

Family

ID=37622172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008530160A Expired - Fee Related JP5345848B2 (ja) 2005-09-06 2006-09-05 半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法

Country Status (3)

Country Link
US (1) US20070051774A1 (https=)
JP (1) JP5345848B2 (https=)
WO (1) WO2007030516A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319048B2 (en) * 2004-09-03 2008-01-15 Intel Corporation Electronic assemblies having a low processing temperature
US7968426B1 (en) * 2005-10-24 2011-06-28 Microwave Bonding Instruments, Inc. Systems and methods for bonding semiconductor substrates to metal substrates using microwave energy
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
US7651938B2 (en) * 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US7829195B2 (en) * 2006-12-31 2010-11-09 Intel Corporation Fluorination pre-treatment of heat spreader attachment indium thermal interface material
US20080156635A1 (en) * 2006-12-31 2008-07-03 Simon Bogdan M System for processes including fluorination
US8728872B2 (en) * 2011-08-18 2014-05-20 DY 4 Systems, Inc. Manufacturing process and heat dissipating device for forming interface for electronic component
PL3834980T3 (pl) * 2019-12-10 2023-04-17 Heraeus Deutschland GmbH & Co. KG Pasta lutownicza

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2149962A (en) * 1937-12-11 1939-03-07 Atlas Powder Co Soldering flux
US3855679A (en) * 1973-11-05 1974-12-24 Ford Motor Co Aluminum soldering
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
JPS60210844A (ja) * 1984-04-05 1985-10-23 Sanken Electric Co Ltd 半田接着方法
US4817854A (en) * 1985-03-11 1989-04-04 The United States Of America As Represented By The Secretary Of The Air Force LED soldering method utilizing a PT migration barrier
US4752027A (en) * 1987-02-20 1988-06-21 Hewlett-Packard Company Method and apparatus for solder bumping of printed circuit boards
US5349495A (en) * 1989-06-23 1994-09-20 Vlsi Technology, Inc. System for securing and electrically connecting a semiconductor chip to a substrate
US5269453A (en) * 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
KR970005712B1 (ko) * 1994-01-11 1997-04-19 삼성전자 주식회사 고 열방출용 반도체 패키지
US5543585A (en) * 1994-02-02 1996-08-06 International Business Machines Corporation Direct chip attachment (DCA) with electrically conductive adhesives
US5411199A (en) * 1994-03-07 1995-05-02 Motorola, Inc. Method for attaching a shield
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
KR0181615B1 (ko) * 1995-01-30 1999-04-15 모리시다 요이치 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재
US5655703A (en) * 1995-05-25 1997-08-12 International Business Machines Corporation Solder hierarchy for chip attachment to substrates
US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US6367150B1 (en) * 1997-09-05 2002-04-09 Northrop Grumman Corporation Solder flux compatible with flip-chip underfill material
JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
WO1999035187A1 (en) * 1998-01-07 1999-07-15 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
JP2000036518A (ja) * 1998-07-16 2000-02-02 Nitto Denko Corp ウェハスケールパッケージ構造およびこれに用いる回路基板
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6362435B1 (en) * 1999-12-20 2002-03-26 Delphi Technologies, Inc. Multi-layer conductor pad for reducing solder voiding
US6548790B1 (en) * 2000-02-24 2003-04-15 Trucco Horacio Andres Apparatus for manufacturing solid solder deposit PCBs
JP2001339011A (ja) * 2000-03-24 2001-12-07 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
JP2001332575A (ja) * 2000-05-19 2001-11-30 Sony Corp フラックス洗浄方法及び半導体装置の製造方法
JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
KR100371567B1 (ko) * 2000-12-08 2003-02-07 삼성테크윈 주식회사 Ａｇ 선도금을 이용한 반도체 패키지용 리드프레임
JP2002273567A (ja) * 2001-03-16 2002-09-25 Nidec Tosok Corp スパンカツール
JP2003001408A (ja) * 2001-06-19 2003-01-08 Seiko Instruments Inc 基板同士のはんだ接合方法
US6800141B2 (en) * 2001-12-21 2004-10-05 International Business Machines Corporation Semi-aqueous solvent based method of cleaning rosin flux residue
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7182241B2 (en) * 2002-08-09 2007-02-27 Micron Technology, Inc. Multi-functional solder and articles made therewith, such as microelectronic components
US6786391B2 (en) * 2002-10-16 2004-09-07 Kac Holdings, Inc. Method of controlling solder deposition utilizing two fluxes and preform
JP2005007412A (ja) * 2003-06-17 2005-01-13 Sumitomo Metal Mining Co Ltd 半田クラッド片
US20050121776A1 (en) * 2003-12-05 2005-06-09 Deppisch Carl L. Integrated solder and heat spreader fabrication

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Publication number Publication date
US20070051774A1 (en) 2007-03-08
WO2007030516A1 (en) 2007-03-15
JP2009507395A (ja) 2009-02-19

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