JP5335002B2 - オプトエレクトロニクス素子 - Google Patents
オプトエレクトロニクス素子 Download PDFInfo
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- JP5335002B2 JP5335002B2 JP2010549012A JP2010549012A JP5335002B2 JP 5335002 B2 JP5335002 B2 JP 5335002B2 JP 2010549012 A JP2010549012 A JP 2010549012A JP 2010549012 A JP2010549012 A JP 2010549012A JP 5335002 B2 JP5335002 B2 JP 5335002B2
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- 230000005693 optoelectronics Effects 0.000 title claims description 76
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- 239000004020 conductor Substances 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 238000009751 slip forming Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- LFOUATARJXLWQD-UHFFFAOYSA-N 1-ethynyl-2-(2-methoxy-5-methylheptoxy)benzene Chemical group COC(COC1=C(C=CC=C1)C#C)CCC(C)CC LFOUATARJXLWQD-UHFFFAOYSA-N 0.000 description 1
- UIWLITBBFICQKW-UHFFFAOYSA-N 1h-benzo[h]quinolin-2-one Chemical compound C1=CC=C2C3=NC(O)=CC=C3C=CC2=C1 UIWLITBBFICQKW-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- NEQNKBCSPVHMBY-UHFFFAOYSA-N C=1C=C2C3=CC=CC=C3C2=C(C=C(C=2C=CC=CC=2)C=2C=CC=CC=2)C=1C=C(C=1C=CC=CC=1)C1=CC=CC=C1 Chemical group C=1C=C2C3=CC=CC=C3C2=C(C=C(C=2C=CC=CC=2)C=2C=CC=CC=2)C=1C=C(C=1C=CC=CC=1)C1=CC=CC=C1 NEQNKBCSPVHMBY-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
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- 229920002160 Celluloid Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910017911 MgIn Inorganic materials 0.000 description 1
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- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
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- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 239000010405 anode material Substances 0.000 description 1
- 150000004982 aromatic amines Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
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- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
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- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
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- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
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Description
相互に離れて配置されている複数のセグメントを備えた第1の電極層と、
動作時に電磁放射を放出する、第1の電極層の上の機能層と、
機能層の上の第2の電極層と、
給電リード部と、
複数の電気接続部とを有し、
第1の電極層との電気的な接触接続のために、第1の給電リード部と、第1の電極層の複数のセグメントのうちの少なくとも1つのセグメントとの間にはそれぞれ複数の電気接続部のうちの少なくとも1つの電気接続部が配置されており、
給電リード部は第1の断面を有し、複数の電気接続部の各電気接続部は第2の断面を有し、
第2の断面は第1の断面よりも小さく、
複数の電気接続部はヒューズとして構成されている。
フォトラック、
例えば、アクリルニトリル・ブタジエン・スチレン(ABS)、ポリアミド(PA)、ポリカーボネート(PC)、ポリエチレン(PE)、ポリプロピレン(PP)、ポリスチレン(PS)、ポリビニールクロライド(PVC)から選定することができる、またはセルロイドを含有するプラスチックから選定することができるサーモプラスチック材料、
ポリイミド、
金属酸化物および/または半金属酸化物、
金属窒化物および/または半金属窒化物、
例えばシリコン酸化物またはシリコン窒化物のような金属酸窒化物および/または半金属酸窒化物、
を有する誘電体として実施することができ、したがって、複数の電気接続部のそれぞれ1つの電気接続部を絶縁させることに適している。
プラチナ、金、パラジウムまたはインジウムのような金属、
鉛酸化物、スズ酸化物またはインジウムスズ酸化物(ITO)のような金属酸化物、
グラファイト、
シリコン、ゲルマニウムまたはヒ化ガリウムのようなドープされた無機半導体、および、
ポリアニリン、ポリピロールまたはポリチオフェンのようなドープされた導電性ポリマー。
Claims (14)
- 短絡保護装置を備えたオプトエレクトロニクス素子において、
相互に離れて配置されている複数のセグメント(11,12)を備えた第1の電極層(1)と、
動作時に電磁放射を放出する、前記第1の電極層(1)の上の機能層(2)と、
前記機能層(2)の上の第2の電極層(3)と、
給電リード部(4)と、
複数の電気接続部(51,52)とを有し、
前記第1の電極層(1)との電気的な接触接続のために、前記給電リード部(4)と、前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも1つのセグメントとの間にはそれぞれ前記複数の電気接続部(51,52)のうちの少なくとも1つの電気接続部が配置されており、
前記オプトエレクトロニクス素子は基板(6)を有し、前記給電リード部(4)と、前記複数の電気接続部(51,52)と、前記第1の電極層(1)の前記複数のセグメント(11,12)と、前記機能層(2)と、前記第2の電極層(3)とは前記基板(6)の一方の主面の上に配置されており、
前記基板(6)内に、前記複数の電気接続部(51,52)の少なくとも1つに隣接して中空部(7)が配置されており、
前記給電リード部(4)は第1の断面を有し、前記複数の電気接続部(51,52)の各電器接続部は第2の断面を有し、
前記第2の断面は前記第1の断面よりも小さく、
前記複数の電気接続部(51,52)はヒューズとして構成されている、
ことを特徴とする、オプトエレクトロニクス素子。 - 前記中空部(7)は、前記複数の電気接続部(51,52)のうちの少なくとも1つの溶融した材料のリザーバとして使用される、請求項1記載のオプトエレクトロニクス素子。
- 前記第2の断面は前記第1の断面に比べて少なくとも1/10に低減されている、請求項1または2記載のオプトエレクトロニクス素子。
- 前記給電リード部(4)および前記複数の電気接続部(51,52)は一体的に構成されているか、前記給電リード部(4)および前記複数の電気接続部(51,52)は異なる材料から構成されている、請求項1から3までのいずれか1項記載のオプトエレクトロニクス素子。
- さらに、前記複数の電気接続部(51,52)のうちの少なくとも1つの電気接続部の上に、絶縁層(8)を有する、請求項1から4までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記絶縁層は溶融性の材料または流動性の材料のうちの少なくとも1つから構成されている、請求項5記載のオプトエレクトロニクス素子。
- 前記複数の電気接続部(51,52)のうちの少なくとも1つの電気接続部は、該複数の電気接続部(51,52)のうちの少なくとも1つの電気接続部が短絡時に溶断するよう構成されており、
前記絶縁層(8)は前記複数の電気接続部(51,52)のうちの少なくとも1つの電気接続部を絶縁させることに適している、請求項5または6記載のオプトエレクトロニクス素子。 - 前記機能層(2)は無機の材料または有機の材料を含有する、請求項1から7までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記機能層(2)は少なくとも2つのセグメント(21,22)を有し、該セグメント(21,22)は相互に離れて配置されており、
前記機能層(2)のそれぞれ1つのセグメント(21,22)は前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも1つのセグメントの上に配置されている、請求項1から8までのいずれか1項記載のオプトエレクトロニクス素子。 - 前記機能層(2)は前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも2つのセグメントの上方において連続的に配置されている、請求項1から8までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも2つのセグメントは相互に並列に結線されている、請求項1から10までのいずれか1項記載のオプトエレクトロニクス素子。
- さらに、少なくとも1つの電流拡散層(91,92,93)を有し、該電流拡散層(91,92,93)は前記複数の電気接続部(51,52,53)のうちの少なくとも1つの電気接続部と、前記第1の電極層(1)の前記複数のセグメント(11,12,13)のうちの少なくとも1つのセグメントとの間に配置されている、請求項1から11までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記第2の電極層(3)は少なくとも2つのセグメント(31,32)を有し、
前記少なくとも2つのセグメント(31,32)のそれぞれ1つのセグメントは前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも1つのセグメントの上に配置されている、請求項1から12までのいずれか1項記載のオプトエレクトロニクス素子。 - 前記第2の電極層(3)は前記第1の電極層(1)の前記複数のセグメント(11,12)のうちの少なくとも2つのセグメントの上方において連続的に配置されている、請求項1から13までのいずれか1項記載のオプトエレクトロニクス素子。
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