JP5329735B2 - 多孔質高分子膜強化複合体 - Google Patents
多孔質高分子膜強化複合体 Download PDFInfo
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- JP5329735B2 JP5329735B2 JP2004550123A JP2004550123A JP5329735B2 JP 5329735 B2 JP5329735 B2 JP 5329735B2 JP 2004550123 A JP2004550123 A JP 2004550123A JP 2004550123 A JP2004550123 A JP 2004550123A JP 5329735 B2 JP5329735 B2 JP 5329735B2
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
延伸PTFE膜に、表1及び表2に示す樹脂A又はBを含浸させた。複合体を、以下のようにして形成した。プリプレグを一方向に積層して、以下に記載するような厚さ1/8”(0.32cm)プラークを作製し、硬化した後、破壊試験片をこれらのプラークから切断し、破壊エネルギーを、改良ASTM D5045に準じて3点曲げ構成で測定した。具体的には、試験片寸法は、2.5”(6.4cm)×0.5”(1.27cm)×0.125”(0.32cm)であり、中央プレクラックは、寸法0.5“の約40〜60%であった。試験前に、新しいかみそりの刃を使用して、スクライビングをおこない試験片に鋭いクラックを生じさせた。Kqを、Kqとして応力ひずみ曲線におけるピーク負荷を用いてASTM D5045における式A1.4.3を用いて計算した。Kqは、亀裂が進行に必要な応力強度の目安である。試験は、3点曲げ構成で、スパン2.0”(5.08cm)及びクロスヘッドスピード0.1mm/秒で実施した。Kqを、プラーク上で縦横方向で測定し、それぞれx及びy方向での亀裂方向により示した。また、膜引張弾性率も、縦横方向で測定した。
実施例7、8及び9において使用し且つ室温曲げ弾性率4.9GPaである樹脂Bを、横引張弾性率119MPa及び縦引張弾性率56MPaの延伸PTFE膜に吸収させた。図14は、本実施例に使用される膜の走査型電子顕微鏡写真(1000倍)である。樹脂を、実質的に実施例1〜9及び比較例1〜7に記載されたのと同じ膜の細孔に吸収させて、複合体ボディを得た。複合体の室温曲げ弾性率は、4.5GPaであった(膜の横方向に平行に測定)。複合体の室温曲げ弾性率は、上記した樹脂Aの室温曲げ弾性率の測定と同じ方法を用いて測定した。したがって、この実施例では、樹脂室温曲げ弾性率の複合体の室温曲げ弾性率に対する比(膜の横方向に平行に測定)が1超である複合体が形成されていることが明らかである。
米国特許第5,476,589号に記載の方法で作製したePTFE膜に、メチルエチルケトン溶液を用いてポリスチレンを含浸させた。各膜は、膜をポリマー溶液を通過させた後、溶媒を乾燥除去することにより含浸させた。ポリスチレン含量は、最終複合体の70+/−10重量%であった。プラークを、厚さ1/8”のフレームモールドの内部にプリプレグを入れることにより作製した。モールドに、両側にPTFE膜を設け、200psi(1.378KPa)でプレスして被覆した。熱サイクルは、実施例11(低分子量ポリスチレン(Mw=200,000とMw=4,000とのブレンド))について200℃で1時間であり、実施例12(高分子量ポリスチレン(Mw280,000))について250℃で1時間であった。本明細書で使用されるMwは、重量平均分子量である。両方のポリスチレンは、ウイスコンシン州ミルウォーキーにあるAldrich Chemical社から入手したものであり、それぞれAldrich Cat#33、165−1及びAldrich Cat#18、242−7として入手できる。
厚さ900μmの試験積層体を、メリーランド州エリクトンにあるW.L.Gore and Associates社製の市販品MICROLAM(登録商標)410Dielectricを用いて作製した。この積層体を、325psi(2.24KPa)でプレスし、350°F(177℃)で1時間硬化した後、435°F(224℃)で2時間硬化させたMICROLAM(登録商標)410Dielectricの積層した層から作製した。寸法50mm×12.5mmの試験片を、積層体から切断した。比較例8は、MICROLAM(登録商標)410Dielectricからなる層のみを有するものであった。実施例13及び14は、高弾性率ePTFE膜の単一外層を有し、残りがMICROLAM(登録商標)410Dielectricからなる層であった。実施例13及び14は、積層中、外ePTFE層と内MICROLAM(登録商標)410Dielectric層とをプレスすることにより作製した。積層中、MICROLAM(登録商標)410Dielectricからの樹脂の一部は、外層膜の細孔の少なくとも一部に浸透した。外層膜細孔の一部に浸透したMICROLAM(登録商標)410Dielectricの樹脂成分は、上記樹脂Bと実質的に同じであり、室温曲げ弾性率が約4.9GPaであった。実施例13では、外層膜は、縦引張弾性率が805MPaであり、横引張弾性率82MPaであった。実施例14では、外層膜は、縦引張弾性率が570MPaであり、横引張弾性率が22MPaであった。したがって、実施例13及び実施例14の外層は、本発明による複合体である。
強度=3PL/2bd2
(式中、P=ピーク負荷、L=スパン、b=試験片幅、d=試験片深さである)。
Claims (37)
- 多孔質高分子膜を含む複合体であって、前記膜の細孔に、少なくとも部分的に樹脂が充填されており、前記樹脂の室温曲げ弾性率が1GPa超であり、且つ前記膜が下式:75MPa<(縦膜引張弾性率+横膜引張弾性率)/2を満たす、二軸延伸により形成されるノードのない延伸ポリテトラフルオロエチレン膜である、複合体。
- 多孔質高分子膜を含む複合体であって、前記膜の細孔に少なくとも部分的に樹脂が充填されており、前記膜が下式:75MPa<(縦膜引張弾性率+横膜引張弾性率)/2を満たす、二軸延伸により形成されるノードのない延伸ポリテトラフルオロエチレン膜であり、横弾性率と縦弾性率のうちの高いほうの方向において測定した、前記樹脂の室温曲げ弾性率の前記複合体の室温曲げ弾性率に対する比が、1より大きいか、又は1に等しい、複合体。
- 前記樹脂が、金属、メタロイド、セラミック、高分子材料及びそれらの組み合わせからなる群から選択された材料を含む、請求項1又は2に記載の複合体。
- 前記樹脂が高分子材料を含む、請求項1又は2に記載の複合体。
- 前記高分子材料が熱可塑性ポリマーを含む、請求項4に記載の複合体。
- 前記高分子材料が熱硬化性ポリマーを含む、請求項4に記載の複合体。
- 横弾性率と縦弾性率のうちの高いほうの方向において測定した、前記樹脂の室温曲げ弾性率の前記複合体の室温曲げ弾性率に対する比が、1より大きいか、又は1に等しい、請求項1に記載の複合体。
- 少なくとも一種のフィラー材料をさらに含む、請求項4に記載の複合体。
- 前記複合体が積層体の形態で1層以上の金属層に接合されている、請求項1又は2に記載の複合体。
- 前記一種以上の金属が、アルミニウム、銅、金、スズ、銀、鉛及びそれらの組み合わせからなる群から選択されたものである、請求項9に記載の複合体。
- 前記複合体が一種以上のキャパシタンス層材料に接合されている、請求項1又は2に記載の複合体。
- 前記複合体が積層体からなる層である、請求項1又は2に記載の複合体。
- 前記複合体が前記積層体における界面接着層である、請求項12に記載の複合体。
- 前記複合体が前記積層体上の外層である、請求項12に記載の複合体。
- 前記積層体が、金属及びキャパシタンス材料から選択された材料からなる少なくとも1層をさらに有している、請求項12に記載の複合体。
- 前記金属が、アルミニウム、銅、金、スズ、銀、鉛及びそれらの組み合わせからなる群から選択されたものである、請求項15に記載の複合体。
- 前記樹脂が脆性破壊を示す、請求項1又は2に記載の複合体。
- 前記樹脂のガラス転移温度が、前記複合体のガラス転移温度に等しい、請求項1又は2に記載の複合体。
- 前記複合体が、高弾性率繊維含有材料からなる少なくとも1層に積層されている、請求項1又は2に記載の複合体。
- 前記高弾性率繊維が、ガラス繊維、カーボン繊維、セラミック繊維及びそれらの組み合わせからなる群から選択されたものである、請求項19に記載の複合体。
- 前記樹脂の室温曲げ弾性率が、1GPaを超える、請求項2に記載の複合体。
- 請求項1又は2の複合体を備えたプリント回路基板。
- 請求項1又は2の複合体を備えた電子基板。
- 請求項1又は2の複合体を備えたチップパッケージ基板。
- 請求項1又は2の複合体を備えたシリコンウエハ。
- 積層基板を備えた電子チップパッケージであって、前記積層基板が、少なくとも1層の導電層と、前記導電層に結合された少なくとも1層の誘電体層とを有し、前記誘電体層が二軸延伸により形成されるノードのない多孔質延伸ポリテトラフルオロエチレン膜を含み、前記膜の細孔に少なくとも部分的に樹脂が充填されており、前記樹脂の室温曲げ弾性率が1GPa超であり、前記膜が下式:75MPa<(縦膜引張弾性率+横膜引張弾性率)/2を満たす、電子チップパッケージ。
- 前記少なくとも1層の導電層と前記少なくとも1層の誘電体層とを交互に設けた層をさらに備えた、請求項26に記載の電子チップパッケージ。
- 中に少なくとも一つのビアをさらに備えている、請求項27に記載の電子チップパッケージ。
- 前記樹脂が高分子材料を含む、請求項26に記載の電子チップパッケージ。
- 前記高分子材料が熱可塑性ポリマーを含む、請求項29に記載の電子チップパッケージ。
- 前記高分子材料が熱硬化性ポリマーを含む、請求項29に記載の電子チップパッケージ。
- 前記導電層が、アルミニウム、銅、金、スズ、銀、鉛及びそれらの組み合わせからなる群から選択された材料を含む、請求項29に記載の電子チップパッケージ。
- 前記導電層が銅を含む、請求項32に記載の電子チップパッケージ。
- 横弾性率と縦弾性率のうちの高いほうの方向において測定した、前記樹脂の室温曲げ弾性率の前記複合体の室温曲げ弾性率に対する比が、1より大きいか、又は1に等しい、請求項29に記載の電子チップパッケージ。
- 請求項1又は2の複合体を備えたスポーツ用品。
- 請求項1又は2に記載の複合体を備えた航空宇宙部品。
- 請求項1又は2に記載の複合体を備えた外装材料。
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Families Citing this family (112)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6001067A (en) | 1997-03-04 | 1999-12-14 | Shults; Mark C. | Device and method for determining analyte levels |
US7657297B2 (en) * | 2004-05-03 | 2010-02-02 | Dexcom, Inc. | Implantable analyte sensor |
US7899511B2 (en) | 2004-07-13 | 2011-03-01 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
US8527026B2 (en) | 1997-03-04 | 2013-09-03 | Dexcom, Inc. | Device and method for determining analyte levels |
US6862465B2 (en) | 1997-03-04 | 2005-03-01 | Dexcom, Inc. | Device and method for determining analyte levels |
US9155496B2 (en) | 1997-03-04 | 2015-10-13 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
US6342294B1 (en) * | 1999-08-12 | 2002-01-29 | Bruce G. Ruefer | Composite PTFE article and method of manufacture |
US7562612B2 (en) * | 2001-07-25 | 2009-07-21 | Aceram Materials & Technologies, Inc. | Ceramic components, ceramic component systems, and ceramic armour systems |
US20030032874A1 (en) | 2001-07-27 | 2003-02-13 | Dexcom, Inc. | Sensor head for use with implantable devices |
US10022078B2 (en) | 2004-07-13 | 2018-07-17 | Dexcom, Inc. | Analyte sensor |
US7134999B2 (en) * | 2003-04-04 | 2006-11-14 | Dexcom, Inc. | Optimized sensor geometry for an implantable glucose sensor |
WO2005017617A1 (en) | 2003-07-17 | 2005-02-24 | Honeywell International Inc. | Planarization films for advanced microelectronic applications and devices and methods of production thereof |
US7715893B2 (en) | 2003-12-05 | 2010-05-11 | Dexcom, Inc. | Calibration techniques for a continuous analyte sensor |
WO2007120442A2 (en) | 2003-07-25 | 2007-10-25 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US7074307B2 (en) | 2003-07-25 | 2006-07-11 | Dexcom, Inc. | Electrode systems for electrochemical sensors |
US20190357827A1 (en) | 2003-08-01 | 2019-11-28 | Dexcom, Inc. | Analyte sensor |
US8275437B2 (en) | 2003-08-01 | 2012-09-25 | Dexcom, Inc. | Transcutaneous analyte sensor |
US20100168657A1 (en) | 2003-08-01 | 2010-07-01 | Dexcom, Inc. | System and methods for processing analyte sensor data |
US7778680B2 (en) | 2003-08-01 | 2010-08-17 | Dexcom, Inc. | System and methods for processing analyte sensor data |
US7920906B2 (en) | 2005-03-10 | 2011-04-05 | Dexcom, Inc. | System and methods for processing analyte sensor data for sensor calibration |
US9247900B2 (en) | 2004-07-13 | 2016-02-02 | Dexcom, Inc. | Analyte sensor |
US8423114B2 (en) | 2006-10-04 | 2013-04-16 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US8287453B2 (en) | 2003-12-05 | 2012-10-16 | Dexcom, Inc. | Analyte sensor |
US8364231B2 (en) | 2006-10-04 | 2013-01-29 | Dexcom, Inc. | Analyte sensor |
US8532730B2 (en) | 2006-10-04 | 2013-09-10 | Dexcom, Inc. | Analyte sensor |
US11633133B2 (en) | 2003-12-05 | 2023-04-25 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US7637868B2 (en) * | 2004-01-12 | 2009-12-29 | Dexcom, Inc. | Composite material for implantable device |
US20050186367A1 (en) * | 2004-02-19 | 2005-08-25 | Hanrahan James R. | Low friction, abrasion-resistant materials and articles made therefrom |
US20050196603A1 (en) * | 2004-03-08 | 2005-09-08 | Carr Mark E. | Anti-microbial breathable laminate |
US20050245799A1 (en) * | 2004-05-03 | 2005-11-03 | Dexcom, Inc. | Implantable analyte sensor |
US8792955B2 (en) | 2004-05-03 | 2014-07-29 | Dexcom, Inc. | Transcutaneous analyte sensor |
CA2580704A1 (en) * | 2004-06-11 | 2006-08-17 | Stewart & Stevenson Tactical Vehicle Systems, L.P. | Armored cab for vehicles |
US8452368B2 (en) | 2004-07-13 | 2013-05-28 | Dexcom, Inc. | Transcutaneous analyte sensor |
US7654956B2 (en) | 2004-07-13 | 2010-02-02 | Dexcom, Inc. | Transcutaneous analyte sensor |
US7783333B2 (en) | 2004-07-13 | 2010-08-24 | Dexcom, Inc. | Transcutaneous medical device with variable stiffness |
US8886272B2 (en) | 2004-07-13 | 2014-11-11 | Dexcom, Inc. | Analyte sensor |
US7905833B2 (en) | 2004-07-13 | 2011-03-15 | Dexcom, Inc. | Transcutaneous analyte sensor |
US8565848B2 (en) | 2004-07-13 | 2013-10-22 | Dexcom, Inc. | Transcutaneous analyte sensor |
US20080242961A1 (en) * | 2004-07-13 | 2008-10-02 | Dexcom, Inc. | Transcutaneous analyte sensor |
CA2483231C (en) * | 2004-09-30 | 2011-11-29 | Aceram Technologies Inc. | Ceramic armor system with diamond coating |
US20110129657A1 (en) * | 2005-02-11 | 2011-06-02 | Norman Clough | Ballistic Resistant Composite Fabric |
US8133178B2 (en) | 2006-02-22 | 2012-03-13 | Dexcom, Inc. | Analyte sensor |
US20090076360A1 (en) | 2007-09-13 | 2009-03-19 | Dexcom, Inc. | Transcutaneous analyte sensor |
US20130210302A1 (en) * | 2005-05-25 | 2013-08-15 | W. L. Gore & Associates, Inc. | Aqueous Delivery System for Low Surface Energy Structures |
US7306729B2 (en) * | 2005-07-18 | 2007-12-11 | Gore Enterprise Holdings, Inc. | Porous PTFE materials and articles produced therefrom |
TW200719507A (en) * | 2005-11-08 | 2007-05-16 | Univ Chang Gung | Making method for separator with high ionic conductivity |
US8597016B2 (en) | 2005-11-23 | 2013-12-03 | Milgard Manufacturing Incorporated | System for producing pultruded components |
US7901762B2 (en) | 2005-11-23 | 2011-03-08 | Milgard Manufacturing Incorporated | Pultruded component |
US8101107B2 (en) | 2005-11-23 | 2012-01-24 | Milgard Manufacturing Incorporated | Method for producing pultruded components |
US7875675B2 (en) | 2005-11-23 | 2011-01-25 | Milgard Manufacturing Incorporated | Resin for composite structures |
US20070128425A1 (en) * | 2005-12-07 | 2007-06-07 | 3M Innovative Properties Company | Reinforced ion-conductive membranes |
US9757061B2 (en) | 2006-01-17 | 2017-09-12 | Dexcom, Inc. | Low oxygen in vivo analyte sensor |
US8689671B2 (en) | 2006-09-29 | 2014-04-08 | Federal-Mogul World Wide, Inc. | Lightweight armor and methods of making |
US7831287B2 (en) | 2006-10-04 | 2010-11-09 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US20080207073A1 (en) * | 2007-02-22 | 2008-08-28 | David Michael Jones | Coated multi-purpose fabric |
JP2008288193A (ja) * | 2007-04-19 | 2008-11-27 | Toyota Motor Corp | 燃料電池用補強型電解質膜、燃料電池用膜−電極接合体、及びそれを備えた固体高分子形燃料電池 |
FR2915903B1 (fr) * | 2007-05-10 | 2010-06-04 | Carpentier Matra Carmat | Procede pour la realisation d'un objet hemocompatible de configuration complexe et objet ainsi obtenu. |
US8417312B2 (en) | 2007-10-25 | 2013-04-09 | Dexcom, Inc. | Systems and methods for processing sensor data |
GB0803194D0 (en) * | 2008-02-21 | 2008-04-02 | Microsphere Technology Ltd | Process for the manufacture of titania coated microspheres |
CN101960658B (zh) | 2008-02-26 | 2014-07-16 | 丰田自动车株式会社 | 燃料电池用增强型电解质膜、燃料电池用膜-电极接合体以及具备该膜-电极接合体的固体高分子型燃料电池 |
US8396528B2 (en) | 2008-03-25 | 2013-03-12 | Dexcom, Inc. | Analyte sensor |
US10399709B2 (en) * | 2008-07-18 | 2019-09-03 | The Boeing Company | Method of making a device for controlling stress in joints at cryogenic temperatures |
US9453293B2 (en) | 2008-07-18 | 2016-09-27 | The Boeing Company | Method of making a composite tank having joint with softening strip |
US8656571B2 (en) | 2008-07-18 | 2014-02-25 | The Boeing Company | Strong bonded joints for cryogenic applications |
DE112009002507B8 (de) | 2008-10-17 | 2018-08-30 | Toyota Jidosha Kabushiki Kaisha | Verstärkte brennstoffzellen-elektrolytmembran, membran-elektroden-anordnung und polymerelektrolytbrennstoffzelle, diese enthaltend und herstellungsverfahren dazu |
US9149220B2 (en) | 2011-04-15 | 2015-10-06 | Dexcom, Inc. | Advanced analyte sensor calibration and error detection |
US8784710B2 (en) * | 2009-07-16 | 2014-07-22 | Phillips Scientific Inc. | Expandable polymer membrane and tubes, and a method of manufacturing thereof |
US8288454B2 (en) * | 2009-08-11 | 2012-10-16 | The United States Of America, As Represented By The Secretary Of The Navy | Polymeric compositions containing microspheres |
US8474120B2 (en) * | 2009-10-09 | 2013-07-02 | W. L. Gore & Associates, Inc. | Bifurcated highly conformable medical device branch access |
US8974135B2 (en) | 2010-07-22 | 2015-03-10 | The Boeing Company | Fabric preform insert for a composite tank Y-joint |
US8609249B2 (en) | 2011-02-09 | 2013-12-17 | Phillips Scientific Inc. | Thin wall expandable polymer tubes having improved axial and radial strength, and a method of manufacturing thereof |
EP2741809B1 (en) | 2011-08-12 | 2018-08-01 | Cardiac Pacemakers, Inc. | Method for coating devices using electrospinning and melt blowing |
EP2618090B1 (en) | 2012-01-20 | 2014-10-15 | Westwind Limited | Heat exchanger element and method for the production |
JP5862766B2 (ja) * | 2012-04-20 | 2016-02-16 | ダイキン工業株式会社 | Ptfeを主成分とするフィルタ用濾材、エアフィルタユニット、並びに多孔膜の製造方法 |
CN103158858B (zh) * | 2013-03-01 | 2015-11-25 | 溧阳市科技开发中心 | 一种飞机机翼外壳 |
CN103158857B (zh) * | 2013-03-01 | 2015-11-25 | 溧阳市科技开发中心 | 一种复合机翼 |
AU2014236747B2 (en) | 2013-03-15 | 2019-11-07 | The Regents Of The University Of California | High-throughput cargo delivery into live cells using photothermal platforms |
US11116947B2 (en) | 2013-03-15 | 2021-09-14 | W. L. Gore & Associates, Inc. | Balloon seal stress reduction and related systems and methods |
US10415900B2 (en) | 2013-07-19 | 2019-09-17 | Westwind Limited | Heat / enthalpy exchanger element and method for the production |
US20150025608A1 (en) | 2013-07-22 | 2015-01-22 | Cardiac Pacemakers, Inc. | Lubricious, biocompatible hydrophilic thermoset coating using interpenetrating hydrogel networks |
US10245343B2 (en) * | 2013-08-23 | 2019-04-02 | American Felt & Filter Company | Scented wafer |
US10449781B2 (en) | 2013-10-09 | 2019-10-22 | Dover Europe Sarl | Apparatus and method for thermal transfer printing |
KR20160091386A (ko) | 2013-11-29 | 2016-08-02 | 아사히 가세이 가부시키가이샤 | 고분자 전해질막 |
TW201533125A (zh) | 2013-11-29 | 2015-09-01 | Daikin Ind Ltd | 改性聚四氟乙烯細粉及單軸拉伸多孔質體 |
US10688448B2 (en) | 2013-11-29 | 2020-06-23 | Daikin Industries, Ltd. | Porous body, polymer electrolyte membrane, filter material for filter, and filter unit |
CN105849958B (zh) | 2013-11-29 | 2019-10-29 | 旭化成株式会社 | 高分子电解质膜 |
US10472651B2 (en) | 2014-03-28 | 2019-11-12 | The Regents Of The University Of California | Efficient delivery of large cargos into cells on a porous substrate |
US9862859B2 (en) | 2014-09-12 | 2018-01-09 | W. L. Gore & Associates, Inc. | Porous air permeable polytetrafluoroethylene composites with improved mechanical and thermal properties |
US20160075914A1 (en) | 2014-09-12 | 2016-03-17 | W. L. Gore & Associates, Inc. | Porous Air Permeable Polytetrafluoroethylene Composites with Improved Mechanical and Thermal Properties |
US10215537B2 (en) * | 2014-12-08 | 2019-02-26 | A. Jacob Ganor | Modular ceramic composite antiballistic armor |
CN104606925A (zh) * | 2015-01-28 | 2015-05-13 | 郑州大学 | 一种超疏水超亲油多孔材料的制备方法 |
WO2016142239A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
US9855415B2 (en) | 2015-07-25 | 2018-01-02 | Cardiac Pacemakers, Inc. | Medical electrical lead with biostable PVDF-based materials |
PL3374726T3 (pl) * | 2015-11-13 | 2022-09-05 | Dsm Ip Assets B.V. | Odporne na uderzenia tworzywo kompozytowe |
CA3001441A1 (en) * | 2015-11-13 | 2017-05-18 | Dsm Ip Assets B.V. | Impact resistant composite material |
US20170264009A1 (en) * | 2016-03-14 | 2017-09-14 | Raytheon Company | Reduced moisture permeable radomes and enclosures and methods of making same |
WO2017195457A1 (ja) * | 2016-05-13 | 2017-11-16 | 旭化成メディカル株式会社 | ポリエチレン系樹脂多孔質中空糸膜、分離膜及びそれらの製造方法 |
JP2018021718A (ja) * | 2016-08-04 | 2018-02-08 | スターライト工業株式会社 | 防刃防突刺し用保護材及びそれを用いた防護用具 |
WO2018125864A1 (en) | 2016-12-27 | 2018-07-05 | Boston Scientific Scimed Inc. | Degradable scaffolding for electrospinning |
CN110494279B (zh) * | 2017-04-04 | 2022-02-15 | W.L.戈尔有限公司 | 具有增强弹性体和集成电极的介电复合物 |
CA3097213C (en) | 2018-05-08 | 2023-03-07 | Mark D. Edmundson | Flexible and durable printed circuits on stretchable and non-stretchable substrates |
CN112136367A (zh) | 2018-05-08 | 2020-12-25 | W.L.戈尔及同仁股份有限公司 | 用于皮肤应用的柔性印刷电路 |
WO2019216885A1 (en) | 2018-05-08 | 2019-11-14 | W.L. Gore & Associates, Inc. | Flexible and stretchable printed circuits on stretchable substrates |
EP3897914A1 (en) * | 2018-12-17 | 2021-10-27 | Donaldson Company, Inc. | Porous ptfe membrane |
US20220088240A1 (en) | 2019-02-08 | 2022-03-24 | W. L. Gore & Associates, Inc. | Ultraviolet light disinfecting systems |
JP7502743B2 (ja) | 2019-03-28 | 2024-06-19 | 公立大学法人大阪 | モノリス孔充填型相分離構造体 |
US20220410082A1 (en) * | 2019-10-14 | 2022-12-29 | W. L. Gore & Associates, Inc. | Acoustic composite including a stiffening polymer, devices, and assemblies including the same |
US11040548B1 (en) | 2019-12-10 | 2021-06-22 | Dover Europe Sarl | Thermal transfer printers for deposition of thin ink layers including a carrier belt and rigid blade |
US11359062B1 (en) | 2021-01-20 | 2022-06-14 | Thintronics, Inc. | Polymer compositions and their uses |
CN112940325B (zh) * | 2021-02-24 | 2022-07-12 | 辽宁万鑫富利新材料有限公司 | 一种可降解塑料复合薄膜及其制备工艺 |
CN114456020B (zh) * | 2021-12-27 | 2022-12-13 | 西安近代化学研究所 | 一种过渡层材料、应用及改善战斗部装药内部应力的工艺 |
US11596066B1 (en) | 2022-03-22 | 2023-02-28 | Thintronics. Inc. | Materials for printed circuit boards |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3962153A (en) * | 1970-05-21 | 1976-06-08 | W. L. Gore & Associates, Inc. | Very highly stretched polytetrafluoroethylene and process therefor |
SE392582B (sv) * | 1970-05-21 | 1977-04-04 | Gore & Ass | Forfarande vid framstellning av ett porost material, genom expandering och streckning av en tetrafluoretenpolymer framstelld i ett pastabildande strengsprutningsforfarande |
JPS62148537A (ja) * | 1985-12-23 | 1987-07-02 | Mitsui Toatsu Chem Inc | 多孔性フイルムの製造法 |
US4784901A (en) * | 1987-04-13 | 1988-11-15 | Japan Gore-Tex, Inc. | Flexible printed circuit board base material |
AU619175B2 (en) * | 1987-04-21 | 1992-01-23 | W.L. Gore & Associates, Inc. | Coated products and methods for making |
JPH01254758A (ja) * | 1988-04-01 | 1989-10-11 | Junkosha Co Ltd | 低誘電率複合材料 |
US5036551A (en) * | 1990-02-16 | 1991-08-06 | W. L. Gore & Associates, Inc. | Elastomeric composite fabric |
GB9101691D0 (en) * | 1991-01-25 | 1991-03-06 | British Petroleum Co Plc | Toughened resins and composites |
JPH05146491A (ja) * | 1991-07-02 | 1993-06-15 | Koki Bussan Kk | 脱臭用布材およびそれを用いてなる脱臭装置 |
US5548034A (en) * | 1992-07-31 | 1996-08-20 | International Business Machines Corporation | Modified dicyanate ester resins having enhanced fracture toughness |
US5374473A (en) * | 1992-08-19 | 1994-12-20 | W. L. Gore & Associates, Inc. | Dense polytetrafluoroethylene articles |
US5494301A (en) * | 1993-04-20 | 1996-02-27 | W. L. Gore & Associates, Inc. | Wrapped composite gasket material |
US5471906A (en) * | 1993-10-15 | 1995-12-05 | W. L. Gore & Associates, Inc. | Body armor cover and method for making the same |
US5445862A (en) * | 1993-12-24 | 1995-08-29 | Tokuyama Corporation | Porous film and process for production thereof |
US5753358A (en) * | 1994-08-25 | 1998-05-19 | W. L. Gore & Associates, Inc. | Adhisive-filler polymer film composite |
US5766750A (en) * | 1994-08-25 | 1998-06-16 | W. L. Gore & Associates, Inc. | Process for making an adhesive-filler polymer film composite |
US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
US5545475A (en) * | 1994-09-20 | 1996-08-13 | W. L. Gore & Associates | Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof |
US5538756A (en) * | 1994-09-23 | 1996-07-23 | W. L. Gore & Associates | High capacitance sheet adhesives and process for making the same |
JPH09507802A (ja) * | 1994-10-31 | 1997-08-12 | ダブリュ.エル.ゴア アンド アソシエイツ,インコーポレイティド | ポリテトラフルオロエチレン剛性シート材 |
US5547551A (en) * | 1995-03-15 | 1996-08-20 | W. L. Gore & Associates, Inc. | Ultra-thin integral composite membrane |
US5476589A (en) * | 1995-03-10 | 1995-12-19 | W. L. Gore & Associates, Inc. | Porpous PTFE film and a manufacturing method therefor |
US5889104A (en) * | 1996-01-11 | 1999-03-30 | W. L. Gore & Associates, Inc. | Low dielectric constant material for use as an insulation element in an electronic device |
US5907113A (en) * | 1995-11-22 | 1999-05-25 | W. L. Gore & Associates, Inc. | Strings for musical instruments |
US5883319A (en) * | 1995-11-22 | 1999-03-16 | W.L. Gore & Associates, Inc. | Strings for musical instruments |
JPH1092444A (ja) * | 1996-09-13 | 1998-04-10 | Japan Gore Tex Inc | 電気化学反応装置用固体高分子電解質複合体及びそれを用いた電気化学反応装置 |
US5731073A (en) * | 1996-10-01 | 1998-03-24 | W. L. Gore & Associates, Inc. | Reusable, selectively conductive, Z-axis, elastomeric composite substrate |
US5888630A (en) * | 1996-11-08 | 1999-03-30 | W. L. Gore & Associates, Inc. | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly |
US5847327A (en) * | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
AU4902897A (en) * | 1996-11-08 | 1998-05-29 | W.L. Gore & Associates, Inc. | Method for improving reliability of thin circuit substrates by increasing the T of the substrate |
US5947918A (en) * | 1996-11-18 | 1999-09-07 | Gore Enterprise Holdings, Inc. | Impact energy absorbing composite materials |
US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
EP1090436A1 (en) * | 1999-04-20 | 2001-04-11 | Lynntech, Inc. | Process of making a composite menbrane |
US6427451B2 (en) * | 1999-06-08 | 2002-08-06 | W. L. Gore & Associates (Uk) Ltd. | Material for the controlled vaporization of a liquid cryogen |
US7153566B2 (en) * | 1999-12-22 | 2006-12-26 | Mitsui Chemicals, Inc. | Porous film and process for producing the same |
AU2001288619A1 (en) * | 2000-08-30 | 2002-03-13 | Warwick Mills, Inc. | Woven fabric constructions having high cover factors and fill yarns with a weight per unit length less than the weight per unit length of warp yarns of the fabric |
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TW200415256A (en) | 2004-08-16 |
CN100349731C (zh) | 2007-11-21 |
JP2006504848A (ja) | 2006-02-09 |
DE60334233D1 (de) | 2010-10-28 |
TWI311593B (en) | 2009-07-01 |
WO2004041529A1 (en) | 2004-05-21 |
AU2003284960A1 (en) | 2004-06-07 |
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