JP5325898B2 - 半導体ウェーハ取扱いロボット用ピボットアーム組立体の製造方法 - Google Patents
半導体ウェーハ取扱いロボット用ピボットアーム組立体の製造方法 Download PDFInfo
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- JP5325898B2 JP5325898B2 JP2010542220A JP2010542220A JP5325898B2 JP 5325898 B2 JP5325898 B2 JP 5325898B2 JP 2010542220 A JP2010542220 A JP 2010542220A JP 2010542220 A JP2010542220 A JP 2010542220A JP 5325898 B2 JP5325898 B2 JP 5325898B2
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- 239000004065 semiconductor Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005096 rolling process Methods 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims 3
- 239000010959 steel Substances 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 13
- 235000012431 wafers Nutrition 0.000 description 17
- 230000007246 mechanism Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000825 440 stainless steel Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/007—Arms the end effector rotating around a fixed point
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C11/00—Pivots; Pivotal connections
- F16C11/04—Pivotal connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C19/00—Bearings with rolling contact, for exclusively rotary movement
- F16C19/50—Other types of ball or roller bearings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49636—Process for making bearing or component thereof
- Y10T29/49643—Rotary bearing
- Y10T29/49679—Anti-friction bearing or component thereof
- Y10T29/49682—Assembling of race and rolling anti-friction members
- Y10T29/49684—Assembling of race and rolling anti-friction members with race making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49636—Process for making bearing or component thereof
- Y10T29/49643—Rotary bearing
- Y10T29/49679—Anti-friction bearing or component thereof
- Y10T29/49689—Race making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49636—Process for making bearing or component thereof
- Y10T29/49696—Mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49636—Process for making bearing or component thereof
- Y10T29/497—Pre-usage process, e.g., preloading, aligning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/19—Gearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/19—Gearing
- Y10T74/1987—Rotary bodies
- Y10T74/19884—Irregular teeth and bodies
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rolling Contact Bearings (AREA)
Description
11 リング部
14 溝(第1軸受トラック)
15 歯車セグメント部
18 歯
19 コネクタアーム部
23 スリーブ部
26 溝(第2軸受トラック)
32 軸受要素
34 セパレータ
Claims (14)
- 半導体ウェーハ取扱いロボット等のためのピボットアーム組立体を製造するための方法であって、
剛体で加工可能な材料から所定の中心を有する円形の円盤を形成するステップと、
円筒形状の内側表面を有するピボットアーム組立体の一体外輪部を画定するために円盤の中心を貫通して円形の穴を形成するステップと、
第1の軸受トラックを画定するために一体外輪部の内側表面に半径方向内側に開口する溝を形成するステップと、
加工装置であって、その加工部に対して工作物を正確に保持する固定部を有する加工装置を提供するステップと、
加工装置の加工部に対して所定の位置及び向きで穴あき円盤を取り外し可能であるが正確に保持するために、加工装置の固定部が第1の軸受トラックと係合した状態で穴あき円盤を加工装置内に位置決めするステップと、
加工装置の加工部を作動させて、環状のリング部であって、一体外輪部の内側表面と略同心に配置された円筒形状の外側表面と、リング部から半径方向外側に延在すると共にロボットの関節部材と接続するように適合されたアーム部と、アーム部に対して円周方向に離間した関係でリング部から半径方向外側に延在する歯車セグメントと、第1の軸受トラックと所定の関係で正確に向きが決められると共に関連するロボット駆動機構と噛合するために適合された歯車セグメント部の外側端部に沿う歯とを備えたリング部を穴あき円盤に形成するステップと、
取付け部材を収容すると共に保持するように構成された内側表面と円筒形状の外側表面とによって画定されたピボットアーム組立体の内輪部を形成するステップと、
一体外輪部の第1の軸受トラックと実質的に同様の形状とされた第2の軸受トラックを画定するために内輪部の外側表面に半径方向外側に開口する溝を形成するステップと、
第1及び第2の軸受トラックが半径方向に位置合わせされ、内輪部が一体外輪部に対して偏心した関係となって、幅広部と幅狭部とを有する偏心隙間を一体外輪部の内側表面と内輪部の外側表面との間に画定するように、内輪部を一体外輪部の内側表面の内側に位置決めするステップと、
複数の転がり軸受要素を隙間の幅広部を介して第1及び第2の軸受トラックに順番に挿入するステップと、
第1及び第2の軸受トラックの回りで一定間隔で離間された関係で軸受要素を位置決めし、内輪部と一体外輪部を同心の関係となるように同時にシフトするステップと、
第1及び第2の軸受トラック内に一定間隔で離間された関係で軸受要素を保持するステップとを含む方法。 - 前記穴形成ステップは、
第2の加工装置であって、その加工部に対して工作物を正確に保持する固定部を有する第2の加工装置を提供すること、及び
第2の加工装置の加工部に対して所定の位置及び向きで円盤を取り外し可能であるが正確に保持するために、第2の加工装置の固定部が円盤の外側周縁と係合した状態で円盤を第2の加工装置内に位置決めすることを含む、請求項1に記載の方法。 - 前記円盤形成ステップは、鋼製の細長の中実ロッドから円盤を切断することを含む、請求項2に記載の方法。
- 前記穴形成ステップは、円盤が第2の加工装置の固定部に保持されている間に、円盤の中心を貫通して穴を開けることを更に含む、請求項3に記載の方法。
- 前記穴形成ステップは、穴あき円盤が第2の加工装置の固定部に保持されている間に、一体外輪部の内側表面を研削することを更に含む、請求項4に記載の方法。
- 前記第1軸受トラック形成ステップは、穴あき円盤が第2の加工装置の固定部に保持されている間に、一体外輪部の内側表面に半径方向内側に開口する溝を研削することを含む、請求項5に記載の方法。
- 前記第1軸受トラック形成ステップは、軸受要素と共にラジアルコンタクト軸受を形成する形状に第1の軸受トラックを研削することを含む、請求項6に記載の方法。
- 前記内輪部形成ステップは、鋼から内輪部を形成することを含み、
前記内輪部溝形成ステップは、内輪部の外側表面を研削し、軸受要素と共にラジアルコンタクト軸受を形成する形状に第2の軸受トラックを形成することを含む、請求項7に記載の方法。 - 前記第1及び第2のトラック形成ステップは、軸受要素と4点接触するように第1及び第2の軸受トラックを研削することを含む、請求項8に記載の方法。
- 前記軸受要素保持ステップは、前記軸受要素位置決めステップの後でセパレータを軸受要素に取り付けることを含む、請求項9に記載の方法。
- 前記軸受要素挿入ステップは、軸受要素としてセラミック球を選択することを含む、請求項10に記載の方法。
- 前記最初に述べた加工装置を提供するステップは、ワイヤEDM機械を選択することを含む、請求項11に記載の方法。
- 前記円盤形成ステップは、ステンレス鋼製の細長の中実ロッドを選択することを更に含む、請求項12に記載の方法。
- 前記円盤形成ステップは、鋼製の細長の中実ロッドから円盤を切断することを含み、 前記穴形成ステップは、円盤の中心を貫通して穴を明けることを更に含む、請求項13に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/008,439 US8225509B2 (en) | 2008-01-11 | 2008-01-11 | Method for making a pivot arm assembly for semiconductor wafer handling robots |
US12/008,439 | 2008-01-11 | ||
PCT/US2008/062861 WO2009088523A1 (en) | 2008-01-11 | 2008-05-07 | Pivot arm assembly for semiconductor wafer handling robots and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011509527A JP2011509527A (ja) | 2011-03-24 |
JP5325898B2 true JP5325898B2 (ja) | 2013-10-23 |
Family
ID=40850767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010542220A Expired - Fee Related JP5325898B2 (ja) | 2008-01-11 | 2008-05-07 | 半導体ウェーハ取扱いロボット用ピボットアーム組立体の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8225509B2 (ja) |
JP (1) | JP5325898B2 (ja) |
KR (1) | KR101368614B1 (ja) |
CN (1) | CN101911282B (ja) |
TW (1) | TWI423384B (ja) |
WO (1) | WO2009088523A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113685436A (zh) * | 2021-08-23 | 2021-11-23 | 航天精工股份有限公司 | 一种高度单元化的航天航空用关节轴承 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US3980359A (en) * | 1975-05-08 | 1976-09-14 | United Technologies Corporation | Ball bearing |
US4648729A (en) | 1985-05-28 | 1987-03-10 | Kaydon Corporation | Bearing weld ring |
KR100215174B1 (ko) | 1996-03-07 | 1999-08-16 | 김경팔 | 레이디얼 베어링 |
US5955858A (en) * | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
JPH10329059A (ja) * | 1997-05-30 | 1998-12-15 | Daihen Corp | 2アーム方式の搬送用ロボット装置 |
US6546307B1 (en) * | 1999-08-20 | 2003-04-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system |
JP2002188646A (ja) | 2000-12-20 | 2002-07-05 | Nsk Ltd | 転がり軸受及び軸受装置 |
US20020182036A1 (en) | 2001-06-04 | 2002-12-05 | Applied Materials, Inc. | Semiconductor wafer handling robot for linear transfer chamber |
US6817640B2 (en) | 2001-06-28 | 2004-11-16 | Applied Materials, Inc. | Four-bar linkage wafer clamping mechanism |
JP2003074547A (ja) * | 2001-08-30 | 2003-03-12 | Nsk Ltd | 組み合わせ玉軸受ユニット |
KR20030072870A (ko) | 2002-03-07 | 2003-09-19 | 삼성전자주식회사 | 반도체 웨이퍼 이송 장치 |
JP2004150617A (ja) * | 2002-11-01 | 2004-05-27 | Minebea Co Ltd | 軸受用保持器 |
KR200312319Y1 (ko) | 2003-02-12 | 2003-05-09 | 가미다 | 반도체 및 엘시디 제조장치의 기판 이송용 축 지지를위한 총형 형태 회전체 |
SE0300642D0 (sv) * | 2003-03-11 | 2003-03-11 | Pergo Europ Ab | Process for sealing a joint |
US20060219042A1 (en) * | 2005-04-04 | 2006-10-05 | Wen-Chang Tu | Blade assembly for transmission of semiconductor chip |
DE102005061792A1 (de) * | 2005-12-23 | 2007-07-05 | Schaeffler Kg | Radialwälzlager, insbesondere einreihiges Kugelrollenlager |
JP2007198433A (ja) * | 2006-01-24 | 2007-08-09 | Jtekt Corp | 4点接触玉軸受 |
-
2008
- 2008-01-11 US US12/008,439 patent/US8225509B2/en active Active
- 2008-05-07 JP JP2010542220A patent/JP5325898B2/ja not_active Expired - Fee Related
- 2008-05-07 WO PCT/US2008/062861 patent/WO2009088523A1/en active Application Filing
- 2008-05-07 KR KR1020107015158A patent/KR101368614B1/ko not_active IP Right Cessation
- 2008-05-07 CN CN2008801245174A patent/CN101911282B/zh not_active Expired - Fee Related
- 2008-05-16 TW TW097117979A patent/TWI423384B/zh not_active IP Right Cessation
-
2012
- 2012-06-25 US US13/531,685 patent/US20120272766A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI423384B (zh) | 2014-01-11 |
TW200939391A (en) | 2009-09-16 |
WO2009088523A1 (en) | 2009-07-16 |
JP2011509527A (ja) | 2011-03-24 |
US20120272766A1 (en) | 2012-11-01 |
KR101368614B1 (ko) | 2014-02-27 |
CN101911282A (zh) | 2010-12-08 |
CN101911282B (zh) | 2012-07-04 |
KR20100095625A (ko) | 2010-08-31 |
US8225509B2 (en) | 2012-07-24 |
US20090180855A1 (en) | 2009-07-16 |
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