JP5317635B2 - 微小電気機械式装置の作製方法 - Google Patents

微小電気機械式装置の作製方法 Download PDF

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JP5317635B2
JP5317635B2 JP2008289672A JP2008289672A JP5317635B2 JP 5317635 B2 JP5317635 B2 JP 5317635B2 JP 2008289672 A JP2008289672 A JP 2008289672A JP 2008289672 A JP2008289672 A JP 2008289672A JP 5317635 B2 JP5317635 B2 JP 5317635B2
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layer
dielectric layer
film
microstructure
electrode layer
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JP2008289672A
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Japanese (ja)
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JP2009148878A (ja
JP2009148878A5 (enrdf_load_stackoverflow
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薫 土屋
隆文 溝口
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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JP2008289672A 2007-11-30 2008-11-12 微小電気機械式装置の作製方法 Expired - Fee Related JP5317635B2 (ja)

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JP2008289672A JP5317635B2 (ja) 2007-11-30 2008-11-12 微小電気機械式装置の作製方法

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JP2007309621 2007-11-30
JP2008289672A JP5317635B2 (ja) 2007-11-30 2008-11-12 微小電気機械式装置の作製方法

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JP2009148878A JP2009148878A (ja) 2009-07-09
JP2009148878A5 JP2009148878A5 (enrdf_load_stackoverflow) 2011-11-24
JP5317635B2 true JP5317635B2 (ja) 2013-10-16

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107065501A (zh) * 2016-02-03 2017-08-18 劳力士有限公司 用于制造混合钟表组件的方法
CN109425266A (zh) * 2017-08-30 2019-03-05 南京理工大学 基于Al/MxOy含能薄膜的叉指结构换能元

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010003192T5 (de) * 2009-08-06 2012-07-12 Ulvac, Inc. Verfahren zur Herstellung eines piezoelektrischen Elements
US20130020573A1 (en) * 2010-03-29 2013-01-24 Keiichi Fukuyama Pressure detecting device and method for manufacturing the same, display device and method for manufacturing the same, and tft substrate with pressure detecting device
CN105621344B (zh) * 2016-03-04 2018-06-26 华天科技（昆山）电子有限公司 Mems气密性封装结构及封装方法
CN106927418A (zh) * 2017-03-29 2017-07-07 广东工业大学 一种微纳米发动机及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278925A (ja) * 1988-09-16 1990-03-19 Yokohama Syst Kenkyusho:Kk 静電容量型圧力センサ
JP2002170470A (ja) * 2000-11-28 2002-06-14 Matsushita Electric Works Ltd 半導体マイクロリレー及びその製造方法
JP2007276089A (ja) * 2006-04-11 2007-10-25 Sony Corp 電気機械素子とその製造方法、並びに共振器とその製造方法
JP5352975B2 (ja) * 2007-08-31 2013-11-27 オムロン株式会社 素子集合体及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107065501A (zh) * 2016-02-03 2017-08-18 劳力士有限公司 用于制造混合钟表组件的方法
CN107065501B (zh) * 2016-02-03 2023-10-20 劳力士有限公司 用于制造混合钟表组件的方法
CN109425266A (zh) * 2017-08-30 2019-03-05 南京理工大学 基于Al/MxOy含能薄膜的叉指结构换能元
CN109425266B (zh) * 2017-08-30 2021-07-06 南京理工大学 基于Al/MxOy含能薄膜的叉指结构换能元

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