JP5306935B2 - 反応生成物の検知方法 - Google Patents
反応生成物の検知方法 Download PDFInfo
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- JP5306935B2 JP5306935B2 JP2009181176A JP2009181176A JP5306935B2 JP 5306935 B2 JP5306935 B2 JP 5306935B2 JP 2009181176 A JP2009181176 A JP 2009181176A JP 2009181176 A JP2009181176 A JP 2009181176A JP 5306935 B2 JP5306935 B2 JP 5306935B2
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- JP
- Japan
- Prior art keywords
- reaction product
- light
- cleaning
- reactor
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000007795 chemical reaction product Substances 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 41
- 238000004140 cleaning Methods 0.000 claims description 62
- 238000006243 chemical reaction Methods 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 150000004767 nitrides Chemical class 0.000 claims description 15
- 239000000460 chlorine Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 14
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 9
- 229910052801 chlorine Inorganic materials 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 8
- 238000001947 vapour-phase growth Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 description 44
- 239000007789 gas Substances 0.000 description 19
- 229910002601 GaN Inorganic materials 0.000 description 17
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000002994 raw material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Description
Claims (3)
- 基板上に窒化物半導体である薄膜を気相成長させた後の反応炉部品上に付着した反応生成物を洗浄した後、前記反応炉部品にブラックライトから300〜400nmの波長の光を照射して該反応炉部品上に残留する反応生成物の発光状態を目視可能にすることにより、反応炉部品上の反応生成物の残留状態を検知することを特徴とする反応生成物の検知方法。
- 前記反応炉部品への前記光の照射を、遮光状態のグローブボックス内で行うことを特徴とする請求項1記載の反応生成物の検知方法。
- 前記反応生成物の洗浄を、塩素系ガスを主成分とする洗浄ガスにより行うことを特徴とする請求項1又は2記載の反応生成物の検知方法。
Priority Applications (1)
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JP2009181176A JP5306935B2 (ja) | 2009-08-04 | 2009-08-04 | 反応生成物の検知方法 |
Applications Claiming Priority (1)
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JP2009181176A JP5306935B2 (ja) | 2009-08-04 | 2009-08-04 | 反応生成物の検知方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011035218A JP2011035218A (ja) | 2011-02-17 |
JP5306935B2 true JP5306935B2 (ja) | 2013-10-02 |
Family
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JP2009181176A Expired - Fee Related JP5306935B2 (ja) | 2009-08-04 | 2009-08-04 | 反応生成物の検知方法 |
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JP (1) | JP5306935B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013044229A1 (en) * | 2011-09-23 | 2013-03-28 | Lucas Milhaupt, Inc. | Luminescent braze preforms |
US20140290702A1 (en) * | 2011-09-27 | 2014-10-02 | Taiyo Nippon Sanso Corporation | Method for cleaning components of nitride semiconductor manufacturing apparatus and device for cleaning components of nitride semiconductor manufacturing apparatus |
JP6530356B2 (ja) * | 2016-09-01 | 2019-06-12 | 大陽日酸株式会社 | 窒化物半導体製造装置の洗浄方法 |
JP2018046044A (ja) * | 2016-09-12 | 2018-03-22 | 大陽日酸株式会社 | サセプタのクリーニング装置及びクリーニング方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5613730A (en) * | 1979-07-13 | 1981-02-10 | Fujitsu Ltd | Etching method |
JPS56108234A (en) * | 1980-01-31 | 1981-08-27 | Fujitsu Ltd | Etching treatment method |
JP3670533B2 (ja) * | 1999-09-27 | 2005-07-13 | 株式会社東芝 | 基板処理装置及びそのクリーニング方法 |
JP3910041B2 (ja) * | 2001-10-29 | 2007-04-25 | シャープ株式会社 | 窒化物半導体レーザ素子及びこれを備えた半導体光学装置 |
JP4178936B2 (ja) * | 2002-12-11 | 2008-11-12 | 日本電気株式会社 | Iii族窒化物自立基板およびそれを用いた半導体素子ならびにそれらの製造方法 |
JP3916584B2 (ja) * | 2003-04-24 | 2007-05-16 | シャープ株式会社 | 窒化物半導体レーザ装置 |
US7534469B2 (en) * | 2005-03-31 | 2009-05-19 | Asm Japan K.K. | Semiconductor-processing apparatus provided with self-cleaning device |
JP5021907B2 (ja) * | 2005-05-24 | 2012-09-12 | 大陽日酸株式会社 | 窒化物半導体製造装置の洗浄方法と洗浄装置 |
JP4385027B2 (ja) * | 2006-02-21 | 2009-12-16 | 大陽日酸株式会社 | 半導体製造装置のクリーニング方法およびクリーニング装置ならびに半導体製造装置 |
JP2008262967A (ja) * | 2007-04-10 | 2008-10-30 | Taiyo Nippon Sanso Corp | 気相成長方法及び装置 |
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- 2009-08-04 JP JP2009181176A patent/JP5306935B2/ja not_active Expired - Fee Related
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