JP5305523B2 - 保護素子 - Google Patents
保護素子 Download PDFInfo
- Publication number
- JP5305523B2 JP5305523B2 JP2009178918A JP2009178918A JP5305523B2 JP 5305523 B2 JP5305523 B2 JP 5305523B2 JP 2009178918 A JP2009178918 A JP 2009178918A JP 2009178918 A JP2009178918 A JP 2009178918A JP 5305523 B2 JP5305523 B2 JP 5305523B2
- Authority
- JP
- Japan
- Prior art keywords
- chip body
- ceramic chip
- heating element
- lead
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 74
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 50
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 230000020169 heat generation Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 description 21
- 230000004907 flux Effects 0.000 description 12
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 4
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 229910021485 fumed silica Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 2
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229940037312 stearamide Drugs 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/12—Two or more separate fusible members in parallel
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Fuses (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009178918A JP5305523B2 (ja) | 2009-07-31 | 2009-07-31 | 保護素子 |
| TW099121642A TWI485739B (zh) | 2009-07-31 | 2010-07-01 | Protection elements and non-retroactive protection devices |
| KR1020100070764A KR20110053896A (ko) | 2009-07-31 | 2010-07-22 | 보호 소자 |
| CN201010245159.1A CN101989519B (zh) | 2009-07-31 | 2010-07-28 | 保护元件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009178918A JP5305523B2 (ja) | 2009-07-31 | 2009-07-31 | 保護素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011034755A JP2011034755A (ja) | 2011-02-17 |
| JP2011034755A5 JP2011034755A5 (zh) | 2013-05-02 |
| JP5305523B2 true JP5305523B2 (ja) | 2013-10-02 |
Family
ID=43746000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009178918A Active JP5305523B2 (ja) | 2009-07-31 | 2009-07-31 | 保護素子 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5305523B2 (zh) |
| KR (1) | KR20110053896A (zh) |
| CN (1) | CN101989519B (zh) |
| TW (1) | TWI485739B (zh) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101266822B1 (ko) | 2011-09-07 | 2013-05-23 | (주)엠에스테크비젼 | 판상 반복형 퓨즈 |
| CN102522263A (zh) * | 2011-12-31 | 2012-06-27 | 上海长园维安电子线路保护有限公司 | 一种可经过回流焊接的温度熔断器 |
| JP5896412B2 (ja) | 2012-05-17 | 2016-03-30 | エヌイーシー ショット コンポーネンツ株式会社 | 保護素子用ヒューズ素子およびそれを利用した回路保護素子 |
| JP5807969B2 (ja) * | 2012-11-07 | 2015-11-10 | エヌイーシー ショット コンポーネンツ株式会社 | 保護素子用フラックス組成物およびそれを利用した回路保護素子 |
| CN103236380B (zh) * | 2013-04-10 | 2015-07-01 | 南京萨特科技发展有限公司 | 一种过流过压保护元件及其制造方法 |
| JP6151550B2 (ja) * | 2013-04-25 | 2017-06-21 | デクセリアルズ株式会社 | 保護素子 |
| TWI680482B (zh) * | 2014-01-15 | 2019-12-21 | 日商迪睿合股份有限公司 | 保護元件 |
| JP6480742B2 (ja) * | 2015-02-05 | 2019-03-13 | 内橋エステック株式会社 | 保護素子 |
| CN106410762A (zh) * | 2015-07-28 | 2017-02-15 | 有量科技股份有限公司 | 电池充电保护系统及其主动熔断式保护装置 |
| JP6708387B2 (ja) * | 2015-10-07 | 2020-06-10 | デクセリアルズ株式会社 | スイッチ素子、電子部品、バッテリシステム |
| JP2019021650A (ja) * | 2018-11-13 | 2019-02-07 | 内橋エステック株式会社 | 保護素子 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH117877A (ja) * | 1997-06-14 | 1999-01-12 | Uchihashi Estec Co Ltd | 合金型温度ヒュ−ズ |
| JP2002033035A (ja) * | 2000-07-18 | 2002-01-31 | Nec Schott Components Corp | 保護素子 |
| JP2003217416A (ja) * | 2002-01-25 | 2003-07-31 | Nec Schott Components Corp | 温度ヒュ−ズおよびこれを装着した保護装置 |
| JP4110967B2 (ja) * | 2002-12-27 | 2008-07-02 | ソニーケミカル＆インフォメーションデバイス株式会社 | 保護素子 |
| JP2006221919A (ja) * | 2005-02-09 | 2006-08-24 | Uchihashi Estec Co Ltd | 基板型抵抗体付きヒューズ及び電池パック |
-
2009
- 2009-07-31 JP JP2009178918A patent/JP5305523B2/ja active Active
-
2010
- 2010-07-01 TW TW099121642A patent/TWI485739B/zh active
- 2010-07-22 KR KR1020100070764A patent/KR20110053896A/ko not_active Application Discontinuation
- 2010-07-28 CN CN201010245159.1A patent/CN101989519B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101989519B (zh) | 2014-08-06 |
| CN101989519A (zh) | 2011-03-23 |
| TW201110180A (en) | 2011-03-16 |
| JP2011034755A (ja) | 2011-02-17 |
| KR20110053896A (ko) | 2011-05-24 |
| TWI485739B (zh) | 2015-05-21 |
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