JP5301904B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5301904B2
JP5301904B2 JP2008179172A JP2008179172A JP5301904B2 JP 5301904 B2 JP5301904 B2 JP 5301904B2 JP 2008179172 A JP2008179172 A JP 2008179172A JP 2008179172 A JP2008179172 A JP 2008179172A JP 5301904 B2 JP5301904 B2 JP 5301904B2
Authority
JP
Japan
Prior art keywords
led element
light
fluorescent substrate
sic fluorescent
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008179172A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010021268A (ja
Inventor
勇次 今井
智 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Original Assignee
Ushio Denki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP2008179172A priority Critical patent/JP5301904B2/ja
Priority to KR1020090052295A priority patent/KR101266226B1/ko
Priority to TW098120105A priority patent/TW201011951A/zh
Priority to CN200910151263A priority patent/CN101625083A/zh
Priority to US12/498,758 priority patent/US8143632B2/en
Priority to EP20090008919 priority patent/EP2146135A3/en
Publication of JP2010021268A publication Critical patent/JP2010021268A/ja
Application granted granted Critical
Publication of JP5301904B2 publication Critical patent/JP5301904B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Luminescent Compositions (AREA)
JP2008179172A 2008-07-09 2008-07-09 発光装置 Expired - Fee Related JP5301904B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008179172A JP5301904B2 (ja) 2008-07-09 2008-07-09 発光装置
KR1020090052295A KR101266226B1 (ko) 2008-07-09 2009-06-12 발광 장치 및 발광 장치의 제조 방법
TW098120105A TW201011951A (en) 2008-07-09 2009-06-16 Light emitting device and method for manufacturing the same
CN200910151263A CN101625083A (zh) 2008-07-09 2009-07-01 发光装置和发光装置的制造方法
US12/498,758 US8143632B2 (en) 2008-07-09 2009-07-07 Light emitting device and method for producing the light emitting device
EP20090008919 EP2146135A3 (en) 2008-07-09 2009-07-08 Light emitting device and method for producing the light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008179172A JP5301904B2 (ja) 2008-07-09 2008-07-09 発光装置

Publications (2)

Publication Number Publication Date
JP2010021268A JP2010021268A (ja) 2010-01-28
JP5301904B2 true JP5301904B2 (ja) 2013-09-25

Family

ID=41521019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008179172A Expired - Fee Related JP5301904B2 (ja) 2008-07-09 2008-07-09 発光装置

Country Status (2)

Country Link
JP (1) JP5301904B2 (zh)
CN (1) CN101625083A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027645A (ja) * 2008-07-15 2010-02-04 Ushio Inc 発光装置及び発光装置の製造方法
CN102376698A (zh) * 2010-08-27 2012-03-14 苏州科医世凯半导体技术有限责任公司 用于照明或显示设备的高亮度led彩色光学模组
JP2012227249A (ja) * 2011-04-18 2012-11-15 Citizen Electronics Co Ltd Ｌｅｄパッケージ
JP5552573B2 (ja) * 2011-07-12 2014-07-16 パナソニック株式会社 光学素子及びそれを用いた半導体発光装置
JP2014123014A (ja) * 2012-12-21 2014-07-03 Casio Comput Co Ltd 光源装置、プロジェクタ
CN103320862B (zh) * 2013-06-07 2016-03-30 山东大学 有色碳硅石宝石及其制备方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2380444A1 (en) * 2000-05-29 2001-12-06 Patent-Treuhand-Gesellschaft Fuer Elektrische Gluehlampen Mbh Led-based white-emitting illumination unit
DE10101554A1 (de) * 2001-01-15 2002-08-01 Osram Opto Semiconductors Gmbh Lumineszenzdiode
JP2005158957A (ja) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
JP2005079244A (ja) * 2003-08-29 2005-03-24 Sanyo Electric Co Ltd 発光ダイオード
JP2005136006A (ja) * 2003-10-28 2005-05-26 Matsushita Electric Works Ltd 発光装置及びそれを用いた演出装置
JP4285199B2 (ja) * 2003-10-28 2009-06-24 パナソニック電工株式会社 発光素子
JP4153455B2 (ja) * 2003-11-28 2008-09-24 学校法人 名城大学 蛍光体および発光ダイオード
JP4482706B2 (ja) * 2005-04-08 2010-06-16 東芝ライテック株式会社 電球型ランプ
JP2006344617A (ja) * 2005-06-07 2006-12-21 Fine Rubber Kenkyusho:Kk 発光装置ユニット
JP2007088348A (ja) * 2005-09-26 2007-04-05 Sharp Corp 照明装置及びバックライト装置、液晶表示装置
US20070128068A1 (en) * 2005-11-15 2007-06-07 Hitachi Metals, Ltd. Solder alloy, solder ball, and solder joint using the same
JP2007142173A (ja) * 2005-11-18 2007-06-07 Koha Co Ltd 照明装置
JP2008066691A (ja) * 2006-03-10 2008-03-21 Toshiba Lighting & Technology Corp 照明装置
JP4963867B2 (ja) * 2006-04-28 2012-06-27 学校法人 名城大学 光制御構造の作成方法、光制御構造および半導体発光素子
JP2007305708A (ja) * 2006-05-10 2007-11-22 Rohm Co Ltd 半導体発光素子アレイおよびこれを用いた照明用器具
JP4820871B2 (ja) * 2006-06-30 2011-11-24 パナソニック株式会社 反射防止構造体及びその製造方法
JP2008085324A (ja) * 2006-09-01 2008-04-10 Intekkusu Kk 光源装置
JP2008091855A (ja) * 2006-09-06 2008-04-17 Toshiba Lighting & Technology Corp 照明装置
JP4989170B2 (ja) * 2006-09-20 2012-08-01 オスラム・メルコ株式会社 コンパクト形ｌｅｄランプ

Also Published As

Publication number Publication date
JP2010021268A (ja) 2010-01-28
CN101625083A (zh) 2010-01-13

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