JP5301352B2 - 発光ダイオード - Google Patents

発光ダイオード Download PDF

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Publication number
JP5301352B2
JP5301352B2 JP2009123917A JP2009123917A JP5301352B2 JP 5301352 B2 JP5301352 B2 JP 5301352B2 JP 2009123917 A JP2009123917 A JP 2009123917A JP 2009123917 A JP2009123917 A JP 2009123917A JP 5301352 B2 JP5301352 B2 JP 5301352B2
Authority
JP
Japan
Prior art keywords
adhesive
light emitting
metal base
wiring board
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009123917A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010272719A (ja
JP2010272719A5 (enExample
Inventor
典和 門谷
孝一 深沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP2009123917A priority Critical patent/JP5301352B2/ja
Publication of JP2010272719A publication Critical patent/JP2010272719A/ja
Publication of JP2010272719A5 publication Critical patent/JP2010272719A5/ja
Application granted granted Critical
Publication of JP5301352B2 publication Critical patent/JP5301352B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
JP2009123917A 2009-05-22 2009-05-22 発光ダイオード Active JP5301352B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009123917A JP5301352B2 (ja) 2009-05-22 2009-05-22 発光ダイオード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009123917A JP5301352B2 (ja) 2009-05-22 2009-05-22 発光ダイオード

Publications (3)

Publication Number Publication Date
JP2010272719A JP2010272719A (ja) 2010-12-02
JP2010272719A5 JP2010272719A5 (enExample) 2012-05-31
JP5301352B2 true JP5301352B2 (ja) 2013-09-25

Family

ID=43420505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009123917A Active JP5301352B2 (ja) 2009-05-22 2009-05-22 発光ダイオード

Country Status (1)

Country Link
JP (1) JP5301352B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5559027B2 (ja) * 2010-12-24 2014-07-23 株式会社朝日ラバー シリコーンレンズ、レンズ付ｌｅｄ装置及びレンズ付ｌｅｄ装置の製造方法
JP2013118292A (ja) 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332770A (ja) * 2000-05-23 2001-11-30 Koha Co Ltd Ｌｅｄチップの樹脂封止方法
JP4032677B2 (ja) * 2001-07-25 2008-01-16 松下電工株式会社 光源装置及びその製造方法
JP2007281323A (ja) * 2006-04-11 2007-10-25 Toyoda Gosei Co Ltd Ｌｅｄデバイス

Also Published As

Publication number Publication date
JP2010272719A (ja) 2010-12-02

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