JP5292388B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5292388B2
JP5292388B2 JP2010292753A JP2010292753A JP5292388B2 JP 5292388 B2 JP5292388 B2 JP 5292388B2 JP 2010292753 A JP2010292753 A JP 2010292753A JP 2010292753 A JP2010292753 A JP 2010292753A JP 5292388 B2 JP5292388 B2 JP 5292388B2
Authority
JP
Japan
Prior art keywords
field effect
mounting portion
chip mounting
effect transistor
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010292753A
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English (en)
Japanese (ja)
Other versions
JP2011077550A (ja
JP2011077550A5 (https=
Inventor
正樹 白石
貴之 岩崎
伸悌 松浦
友彰 宇野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2010292753A priority Critical patent/JP5292388B2/ja
Publication of JP2011077550A publication Critical patent/JP2011077550A/ja
Publication of JP2011077550A5 publication Critical patent/JP2011077550A5/ja
Application granted granted Critical
Publication of JP5292388B2 publication Critical patent/JP5292388B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Dc-Dc Converters (AREA)
JP2010292753A 2010-12-28 2010-12-28 半導体装置 Expired - Fee Related JP5292388B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010292753A JP5292388B2 (ja) 2010-12-28 2010-12-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010292753A JP5292388B2 (ja) 2010-12-28 2010-12-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2007287203A Division JP4769784B2 (ja) 2007-11-05 2007-11-05 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013088367A Division JP2013141035A (ja) 2013-04-19 2013-04-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2011077550A JP2011077550A (ja) 2011-04-14
JP2011077550A5 JP2011077550A5 (https=) 2012-01-19
JP5292388B2 true JP5292388B2 (ja) 2013-09-18

Family

ID=44021126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010292753A Expired - Fee Related JP5292388B2 (ja) 2010-12-28 2010-12-28 半導体装置

Country Status (1)

Country Link
JP (1) JP5292388B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013141035A (ja) * 2013-04-19 2013-07-18 Renesas Electronics Corp 半導体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113366636B (zh) * 2019-03-22 2024-06-21 株式会社村田制作所 电路模块
CN117832177B (zh) * 2024-03-04 2024-05-28 深圳市沃芯半导体技术有限公司 开关电源模块封装系统及封装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001291823A (ja) * 2000-04-05 2001-10-19 Toshiba Digital Media Engineering Corp 半導体装置
JP2001339041A (ja) * 2000-05-29 2001-12-07 Toshiba Digital Media Engineering Corp 半導体装置及び半導体装置の製造方法
JP3450803B2 (ja) * 2000-06-22 2003-09-29 株式会社東芝 樹脂封止型半導体装置
JP2002083927A (ja) * 2000-09-07 2002-03-22 Matsushita Electric Ind Co Ltd 半導体装置
JP2002299544A (ja) * 2001-03-30 2002-10-11 Matsushita Electric Ind Co Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013141035A (ja) * 2013-04-19 2013-07-18 Renesas Electronics Corp 半導体装置

Also Published As

Publication number Publication date
JP2011077550A (ja) 2011-04-14

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