JP5291333B2 - 不溶化材及び不溶化方法 - Google Patents
不溶化材及び不溶化方法 Download PDFInfo
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- JP5291333B2 JP5291333B2 JP2007333702A JP2007333702A JP5291333B2 JP 5291333 B2 JP5291333 B2 JP 5291333B2 JP 2007333702 A JP2007333702 A JP 2007333702A JP 2007333702 A JP2007333702 A JP 2007333702A JP 5291333 B2 JP5291333 B2 JP 5291333B2
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- magnesium oxide
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- hexavalent chromium
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- 239000000463 material Substances 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 38
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 106
- 239000000395 magnesium oxide Substances 0.000 claims description 93
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims description 83
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 69
- 239000002893 slag Substances 0.000 claims description 54
- 239000000843 powder Substances 0.000 claims description 37
- 238000002156 mixing Methods 0.000 claims description 27
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 11
- 239000011777 magnesium Substances 0.000 claims description 11
- 229910052749 magnesium Inorganic materials 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 9
- 239000002689 soil Substances 0.000 description 88
- 238000010828 elution Methods 0.000 description 70
- 235000012245 magnesium oxide Nutrition 0.000 description 70
- 239000000126 substance Substances 0.000 description 25
- 238000012360 testing method Methods 0.000 description 16
- 230000007613 environmental effect Effects 0.000 description 12
- 230000002829 reductive effect Effects 0.000 description 12
- 238000007711 solidification Methods 0.000 description 10
- 230000008023 solidification Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 8
- 230000001629 suppression Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 6
- 239000003440 toxic substance Substances 0.000 description 6
- KSPIHGBHKVISFI-UHFFFAOYSA-N Diphenylcarbazide Chemical compound C=1C=CC=CC=1NNC(=O)NNC1=CC=CC=C1 KSPIHGBHKVISFI-UHFFFAOYSA-N 0.000 description 5
- 238000005056 compaction Methods 0.000 description 5
- 238000011065 in-situ storage Methods 0.000 description 5
- 231100000167 toxic agent Toxicity 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 4
- 239000001095 magnesium carbonate Substances 0.000 description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 4
- 239000000347 magnesium hydroxide Substances 0.000 description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 4
- 238000013008 moisture curing Methods 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000004567 concrete Substances 0.000 description 3
- 229940031958 magnesium carbonate hydroxide Drugs 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000002956 ash Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000010881 fly ash Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 239000002211 L-ascorbic acid Substances 0.000 description 1
- 235000000069 L-ascorbic acid Nutrition 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- SXYCCJAPZKHOLS-UHFFFAOYSA-N chembl2008674 Chemical compound [O-][N+](=O)C1=CC=C2C(N=NC3=C4C=CC=CC4=CC=C3O)=C(O)C=C(S(O)(=O)=O)C2=C1 SXYCCJAPZKHOLS-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
Landscapes
- Processing Of Solid Wastes (AREA)
- Treatment Of Sludge (AREA)
- Curing Cements, Concrete, And Artificial Stone (AREA)
- Soil Conditioners And Soil-Stabilizing Materials (AREA)
Description
(1)模擬汚染土壌の調製
粘性土(含水比:22%,湿潤密度:1.953)に二クロム酸カリウム(K2Cr2O7,試薬特級)を添加・混合した後、24時間静置して下記表3に示す模擬汚染土壌1〜4を調製した。
模擬汚染土壌1に、下記表4に示す配合の不溶化材(実施例1〜2,比較例1)を100kg/m3となるように添加し、ホバートミキサで3分間混合して、JGS−0821「安定処理土の締固めをしない供試体作製」に準じて直径3.5cm×高さ7cmの供試体を作製した。
模擬汚染土壌2及び模擬汚染土壌3のそれぞれに、表5に示す配合の不溶化材(実施例3〜8)を100kg/m3となるように添加し、ホバートミキサで3分間混合して、JGS−0821「安定処理土の締固めをしない供試体作製」に準じて直径3.5cm×高さ7cmの供試体を作製した。
模擬汚染土壌4に、表6に示す配合の不溶化材(実施例3,9,10,比較例2)を表6に示す量となるように添加し、ホバートミキサで3分間混合して、JGS−0821「安定処理土の締固めをしない供試体作製」に準じて直径3.5cm×高さ7cmの供試体を作製した。
模擬汚染土壌1に、軽焼マグネシウム1を71.5kg/m3(100質量部)となるように添加してホバートミキサで1.5分間混合した後、さらに高炉スラグ2を28.5kg/m3(40質量部)となるように添加してホバートミキサで1.5分間混合した(実施例11)。なお、本試験4における軽焼マグネシウム1と高炉スラグ2との添加割合は、上記表4に示す実施例1の配合割合と同一になるようにした。その後、JGS−0821「安定処理土の締固めをしない供試体作製」に準じて直径3.5cm×高さ7cmの供試体を作製した。
模擬汚染土壌1に、軽焼マグネシウム1を71.5kg/m3(100質量部)となるように添加してホバートミキサで1.5分間混合した後、15分間静置し、さらに高炉スラグ2を28.5kg/m3(40質量部)となるように添加してホバートミキサで1.5分間混合した(実施例12)。なお、本試験5における軽焼マグネシウム1と高炉スラグ2との添加割合は、上記表4に示す実施例1の配合割合と同一になるようにした。その後、JGS−0821「安定処理土の締固めをしない供試体作製」に準じて直径3.5cm×高さ7cmの供試体を作製した。
Claims (6)
- 酸化マグネシウムと高炉スラグ粉末とを含有し、6価クロムを不溶化し得る不溶化材であって、
前記高炉スラグ粉末の配合割合が、前記酸化マグネシウム100質量部に対して5〜900質量部であり、
前記不溶化材中の全酸化マグネシウムの質量に対するく溶性苦土(C−MgO)の割合が、85質量%以上であることを特徴とする不溶化材。 - 前記酸化マグネシウムのハンターLab表色系におけるa値が、0.7以上であることを特徴とする請求項1に記載の不溶化材。
- 前記酸化マグネシウムが、軽焼マグネシウムであることを特徴とする請求項1又は2に記載の不溶化材。
- 前記高炉スラグ粉末は、熱質量測定における900〜1000℃での質量増加分が、0.8質量%以下のものであることを特徴とする請求項1〜3のいずれかに記載の不溶化材。
- 不溶化処理対象物に含まれる6価クロムを不溶化する方法であって、
酸化マグネシウムを前記不溶化処理対象物に添加し、混合した後、さらに高炉スラグ粉末を当該不溶化処理対象物に添加し、混合することを特徴とする不溶化方法。 - 前記酸化マグネシウムの添加量の0.05〜9倍量(質量比)の前記高炉スラグを添加し、
前記酸化マグネシウム及び前記高炉スラグ中の酸化マグネシウムの合計質量に対するく溶性苦土(C−MgO)の割合が85質量%以上となるように、前記酸化マグネシウム及び前記高炉スラグを添加することを特徴とする請求項5に記載の不溶化方法。
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JP2013120646A Division JP5690874B2 (ja) | 2013-06-07 | 2013-06-07 | 不溶化材及び不溶化方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4999786B2 (ja) * | 2008-06-24 | 2012-08-15 | 太平洋セメント株式会社 | 酸化マグネシウムの重金属不溶化性能の評価方法 |
JP5544628B2 (ja) * | 2009-01-30 | 2014-07-09 | インダストリー ファウンデーション オブ チョンナム ナショナル ユニバーシティ | アルカリ活性結合材、前記結合材を用いたアルカリ活性モルタル、コンクリート、コンクリート製品および黄土湿式舗装材 |
JP5915202B2 (ja) * | 2012-01-25 | 2016-05-11 | 宇部興産株式会社 | 不溶化方法 |
JP5910137B2 (ja) * | 2012-02-09 | 2016-04-27 | 宇部興産株式会社 | 鉄鋼スラグからのフッ素の溶出抑制方法、土木建築用資材およびその製造方法 |
JP5888055B2 (ja) * | 2012-03-28 | 2016-03-16 | 宇部興産株式会社 | 固化処理方法、固化材スラリー及び固化処理土 |
JP6023771B2 (ja) * | 2014-10-09 | 2016-11-09 | 国立大学法人東京工業大学 | セメント組成物及び土壌改良方法 |
CN109896824B (zh) * | 2019-04-09 | 2021-04-23 | 辽宁科大中驰镁建材科技有限公司 | 一种基于菱镁尾矿进行硫氧镁建材废料回用的方法及产品 |
CN115521787B (zh) * | 2022-10-17 | 2024-09-10 | 中国科学院南京土壤研究所 | 一种铅锌冶炼场地重金属复合污染土壤修复剂及其应用 |
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JPS5281963A (en) * | 1975-12-27 | 1977-07-08 | Ishikawa Kinzoku Kougiyou Kk | Method of treating industrial waste liquid mainly containing chromium |
JP2006187773A (ja) * | 2001-11-30 | 2006-07-20 | Matsuda Giken Kogyo Kk | シアン、リンおよび/または窒素および/またはヒ素である汚染物質によって汚染された土壌用固化不溶化剤 |
JP2003225640A (ja) * | 2001-11-30 | 2003-08-12 | Matsuda Giken Kogyo Kk | 汚染土壌用固化不溶化剤 |
JP3919577B2 (ja) * | 2002-04-01 | 2007-05-30 | 電気化学工業株式会社 | 有害重金属低減材及びそれを用いた有害重金属低減方法 |
JP2007222695A (ja) * | 2005-12-20 | 2007-09-06 | Sumitomo Osaka Cement Co Ltd | 有害金属溶出低減材及びそれを用いた有害金属の溶出低減方法 |
JP5158462B2 (ja) * | 2006-03-31 | 2013-03-06 | 住友大阪セメント株式会社 | 有害金属の溶出低減固化法 |
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