JP5290926B2 - 導電性構造体を利用した導電性フィルム製造方法 - Google Patents
導電性構造体を利用した導電性フィルム製造方法 Download PDFInfo
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- JP5290926B2 JP5290926B2 JP2009237468A JP2009237468A JP5290926B2 JP 5290926 B2 JP5290926 B2 JP 5290926B2 JP 2009237468 A JP2009237468 A JP 2009237468A JP 2009237468 A JP2009237468 A JP 2009237468A JP 5290926 B2 JP5290926 B2 JP 5290926B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 52
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011259 mixed solution Substances 0.000 claims abstract description 20
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 12
- 239000002243 precursor Substances 0.000 claims abstract description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 24
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000001523 electrospinning Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229920000767 polyaniline Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- 229920000123 polythiophene Polymers 0.000 claims description 4
- 229910052701 rubidium Inorganic materials 0.000 claims description 4
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
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- 235000019441 ethanol Nutrition 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
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- 229910052786 argon Inorganic materials 0.000 claims description 2
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- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
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- 239000010408 film Substances 0.000 description 38
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 8
- 239000012789 electroconductive film Substances 0.000 description 6
- 239000002048 multi walled nanotube Substances 0.000 description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 238000004070 electrodeposition Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910001961 silver nitrate Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 210000003205 muscle Anatomy 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000003828 vacuum filtration Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- VEFXTGTZJOWDOF-UHFFFAOYSA-N benzene;hydrate Chemical compound O.C1=CC=CC=C1 VEFXTGTZJOWDOF-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000002079 double walled nanotube Substances 0.000 description 2
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- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000002109 single walled nanotube Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 101710134784 Agnoprotein Proteins 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- -1 PolyTetraFluoroEthylene Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/02—Electrophoretic coating characterised by the process with inorganic material
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- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H01B17/56—Insulating bodies
- H01B17/62—Insulating-layers or insulating-films on metal bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Thermal Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing Of Electric Cables (AREA)
- Carbon And Carbon Compounds (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Description
Claims (5)
- 金属前駆体及び導電性高分子物質が混合された混合溶液を形成する段階と、
前記混合溶液をエレクトロスピニングすることにより、前記混合溶液を微粒化して基板の表面に噴射する段階と、
アルゴン又は空気雰囲気下での前記基板の加熱処理により、前記基板上に網状の導電性構造体を形成する段階と、
電気伝導度が向上するように、前記導電性構造体にカーボンナノチューブを結合させる段階とを含み、
前記結合段階が、
前記カーボンナノチューブを溶媒に分散させる段階と、
前記分散液を利用してカーボンナノチューブバッキーペーパーを製造し、前記導電性構造体に前記カーボンナノチューブバッキーペーパーをスタンピングして静電気的引力により前記導電性構造体に前記カーボンナノチューブを結合させる段階と
を含むことを特徴とする導電性フィルム製造方法。 - 前記金属前駆体が、コバルト、ニッケル、銅、銀、金、鉄、カドミウム、ルビジウム、スズ、及びインジウムの少なくとも1つを形成することを特徴とする請求項1に記載の導電性フィルム製造方法。
- 前記導電性高分子物質が、ポリピロール、ポリアニリン、及びポリチオフェンの少なくとも1つであることを特徴とする請求項1に記載の導電性フィルム製造方法。
- 切断及び酸との化学反応の少なくとも一方により、前記カーボンナノチューブを前処理する段階をさらに含むことを特徴とする請求項1に記載の導電性フィルム製造方法。
- 前記溶媒が、ジメチルホルムアミド(DMF)、N−メチルピロリドン(N−メチル−2−ピロリドン;NMP)、エチルアルコール、水、及びクロロベンゼンの少なくとも1つであることを特徴とする請求項1に記載の導電性フィルム製造方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090032915A KR101009442B1 (ko) | 2009-04-15 | 2009-04-15 | 전도성 구조체를 이용한 전도성필름 제조방법 및 전도성필름 |
| KR10-2009-0032915 | 2009-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010251292A JP2010251292A (ja) | 2010-11-04 |
| JP5290926B2 true JP5290926B2 (ja) | 2013-09-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009237468A Expired - Fee Related JP5290926B2 (ja) | 2009-04-15 | 2009-10-14 | 導電性構造体を利用した導電性フィルム製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100263908A1 (ja) |
| JP (1) | JP5290926B2 (ja) |
| KR (1) | KR101009442B1 (ja) |
| CN (1) | CN101866721A (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103460303B (zh) * | 2011-03-28 | 2016-07-06 | Lg化学株式会社 | 导电结构、触控面板及其制造方法 |
| KR20130070729A (ko) * | 2011-12-20 | 2013-06-28 | 제일모직주식회사 | 메탈나노와이어 및 탄소나노튜브를 포함하는 적층형 투명전극. |
| JP6212050B2 (ja) | 2011-12-22 | 2017-10-11 | スリーエム イノベイティブ プロパティズ カンパニー | 高い光透過を備えた導電性物品 |
| WO2013096350A1 (en) | 2011-12-22 | 2013-06-27 | 3M Innovative Properties Company | Carbon coated articles and methods for making the same |
| CN103031610A (zh) * | 2012-12-07 | 2013-04-10 | 北京航空航天大学 | 一种制备单根超长Cu纳米线并测量其电学性能的方法 |
| US10082985B2 (en) | 2015-03-27 | 2018-09-25 | Pure Storage, Inc. | Data striping across storage nodes that are assigned to multiple logical arrays |
| CN104851523B (zh) * | 2015-05-21 | 2017-01-25 | 苏州大学 | 一种柔性透明导电膜制作方法及柔性透明导电膜 |
| CN105154938B (zh) * | 2015-08-18 | 2016-11-30 | 河南天海电器有限公司 | 汽车端子锡铜碳纳米管复合镀层、电镀液及其电镀方法 |
| CN105297098B (zh) * | 2015-11-10 | 2017-11-28 | 上海应用技术学院 | 一种在不锈钢表面电沉积形成聚吡咯薄膜的方法 |
| CN106057357A (zh) * | 2016-06-15 | 2016-10-26 | 浙江大学 | 制备银纳米线‑二氧化钛复合透明电极的方法及透明电极 |
| CN106328682B (zh) * | 2016-09-19 | 2019-06-14 | 昆山工研院新型平板显示技术中心有限公司 | Oled显示器件的制备方法及oled显示器件 |
| CN106782771A (zh) * | 2016-12-02 | 2017-05-31 | 天津宝兴威科技股份有限公司 | 一种新型纳米银复合导电薄膜 |
| CN109607469B (zh) * | 2019-01-07 | 2024-04-12 | 四川理工学院 | 基于单壁碳纳米管悬空结构的柔性传感器及其制作方法 |
| CN109920604A (zh) * | 2019-03-07 | 2019-06-21 | 无锡众创未来科技应用有限公司 | 一种可拉伸式导电薄膜的制备方法 |
| KR102117783B1 (ko) * | 2019-03-29 | 2020-06-01 | 한국기술교육대학교 산학협력단 | 선택적 부식을 이용한 은 나노와이어 제조방법 |
| JP6923966B1 (ja) * | 2020-05-13 | 2021-08-25 | 国立大学法人秋田大学 | 銀ナノファイバの製造方法 |
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| KR100845534B1 (ko) * | 2004-12-31 | 2008-07-10 | 엘지전자 주식회사 | 전도성 금속 도금 폴리이미드 기판 및 그 제조 방법 |
| US7645497B2 (en) * | 2005-06-02 | 2010-01-12 | Eastman Kodak Company | Multi-layer conductor with carbon nanotubes |
| KR20090025337A (ko) * | 2006-06-14 | 2009-03-10 | 바스프 에스이 | 지지체 상의 전기 전도성 표면의 제조 방법 |
| TWI556456B (zh) * | 2007-04-20 | 2016-11-01 | 坎畢歐科技公司 | 複合透明導體及形成其之方法 |
| CN101755493A (zh) * | 2007-07-19 | 2010-06-23 | 拜尔材料科学股份公司 | 在表面上制备精细导电结构的方法 |
| DE102007040762A1 (de) * | 2007-08-29 | 2009-03-05 | Bayer Materialscience Ag | Vorrichtung und Verfahren zur Herstellung von elektrisch leitenden Nanostrukturen mittels Elektrospinnen |
| JP5221088B2 (ja) * | 2007-09-12 | 2013-06-26 | 株式会社クラレ | 透明導電膜およびその製造方法 |
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| JP2010251292A (ja) | 2010-11-04 |
| KR101009442B1 (ko) | 2011-01-19 |
| CN101866721A (zh) | 2010-10-20 |
| KR20100114402A (ko) | 2010-10-25 |
| US20100263908A1 (en) | 2010-10-21 |
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