JP5276410B2 - 高アスペクト比構造物用の共押出組成物 - Google Patents
高アスペクト比構造物用の共押出組成物 Download PDFInfo
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- JP5276410B2 JP5276410B2 JP2008278098A JP2008278098A JP5276410B2 JP 5276410 B2 JP5276410 B2 JP 5276410B2 JP 2008278098 A JP2008278098 A JP 2008278098A JP 2008278098 A JP2008278098 A JP 2008278098A JP 5276410 B2 JP5276410 B2 JP 5276410B2
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
- B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Description
下記の成分を使用して、犠牲原料を形成した。
2エチルセルロース標準45は、48.0〜49.5%のエトキシル含有量を有する標準エチルセルロースポリマーであり、80%トルエン/20%エタノール溶媒ブレンド中のこのポリマーの5%溶液は、約45センチポイズ(ミリパスカル−秒)の粘度を有する。
[比較例1]犠牲材料の製造
下記の成分を使用して、犠牲原料を形成した。
[比較例2]犠牲材料の製造
下記の成分を使用して、犠牲原料を形成した。
[実施例2]インク材料の製造
下記の成分を使用して、導電性インク組成物を製造する。
[実施例3]インク及び犠牲材料の共押出
適切な銀インクとして、犠牲原料と密接に合致した、レオロジー特性、特に剪断粘度対剪断速度を有する銀インク組成物を、上記の犠牲原料との共押出のために選択する。インク材料と犠牲原料材料との剪断粘度特性の比較の目的のために、これらの材料についての剪断粘度(Pa−s)対剪断速度(1/秒)のプロットを、図3に示す。
[比較例3−4]
インク及び充填材含有犠牲材料の共押出
比較例1及び2の充填材を含む犠牲原料を、実施例1の犠牲原料の代わりに使用する以外は、実施例4の手順を繰り返す。犠牲原料及び銀インクのそれぞれの共押出リボン状物の焼成は、犠牲原料の不完全な燃え尽くしを生じ、焼結した導電性インクと並んで犠牲原料残渣を残す。この犠牲原料残渣は、太陽電池基体を部分的に覆い、太陽電池の低下した効率を引き起こす。
Claims (4)
- 0.3以上のアスペクト比を有する機能性材料と、前記機能性材料の少なくとも1面上の犠牲材料と、のリボン状物を押し出すことと、
0.3よりも大きいアスペクト比を有する前記機能性材料を所定の場所に残して、前記犠牲材料を前記リボン状物から除去することと、
を含む、基体上に導電性ラインを形成する方法であって、
前記犠牲材料が、有機ポリマー及び溶媒を含有し、
前記リボン状物が構造的原形を維持することを可能にするために、前記犠牲材料が、100Paよりも大きい降伏強度又は10秒-1よりも小さい剪断速度で104cPよりも大きい粘度を有する、
方法。 - 基体と、前記基体上に形成された少なくとも1個のグリッドラインと、を含む太陽電池構造物であって、
前記少なくとも1個のグリッドラインが、少なくとも0.3のアスペクト比を有し、前記基体の上に、0.3以上のアスペクト比を有する機能性材料と、前記機能性材料の少なくとも1面上の犠牲材料と、のリボン状物を押し出すことと、0.3よりも大きいアスペクト比を有する前記機能性材料を所定の場所に残して、前記犠牲材料を前記リボン状物から除去することと、を含む方法によって形成され、
前記犠牲材料が、有機ポリマー及び溶媒を含有し、
前記リボン状物が構造的原形を維持することを可能にするために、前記犠牲材料が、100Paよりも大きい降伏強度又は10秒-1よりも小さい剪断速度で104cPよりも大きい粘度を有する、
太陽電池構造物。 - 前記犠牲材料が1種以上の添加物を更に含有する、請求項1に記載の方法。
- 前記犠牲材料が1種以上の添加物を更に含有する、請求項2に記載の太陽電池構造物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/926,405 US20090107546A1 (en) | 2007-10-29 | 2007-10-29 | Co-extruded compositions for high aspect ratio structures |
US11/926,405 | 2007-10-29 |
Publications (2)
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JP2009111390A JP2009111390A (ja) | 2009-05-21 |
JP5276410B2 true JP5276410B2 (ja) | 2013-08-28 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008278098A Expired - Fee Related JP5276410B2 (ja) | 2007-10-29 | 2008-10-29 | 高アスペクト比構造物用の共押出組成物 |
Country Status (6)
Country | Link |
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US (1) | US20090107546A1 (ja) |
EP (1) | EP2056352A3 (ja) |
JP (1) | JP5276410B2 (ja) |
KR (1) | KR101534471B1 (ja) |
CN (1) | CN101423682A (ja) |
IL (1) | IL194917A (ja) |
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US7928015B2 (en) | 2006-12-12 | 2011-04-19 | Palo Alto Research Center Incorporated | Solar cell fabrication using extruded dopant-bearing materials |
-
2007
- 2007-10-29 US US11/926,405 patent/US20090107546A1/en not_active Abandoned
-
2008
- 2008-08-07 EP EP08162002.3A patent/EP2056352A3/en not_active Withdrawn
- 2008-10-26 IL IL194917A patent/IL194917A/en active IP Right Grant
- 2008-10-28 CN CNA2008101749731A patent/CN101423682A/zh active Pending
- 2008-10-28 KR KR1020080105753A patent/KR101534471B1/ko active IP Right Grant
- 2008-10-29 JP JP2008278098A patent/JP5276410B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2056352A3 (en) | 2015-11-18 |
US20090107546A1 (en) | 2009-04-30 |
IL194917A0 (en) | 2009-11-18 |
KR20090043456A (ko) | 2009-05-06 |
JP2009111390A (ja) | 2009-05-21 |
EP2056352A2 (en) | 2009-05-06 |
IL194917A (en) | 2015-07-30 |
KR101534471B1 (ko) | 2015-07-07 |
CN101423682A (zh) | 2009-05-06 |
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