JP5271921B2 - 金属表面、ガラス表面、及びセラミック表面上の微細干渉顔料含有ガラス層、及びその製造方法 - Google Patents
金属表面、ガラス表面、及びセラミック表面上の微細干渉顔料含有ガラス層、及びその製造方法 Download PDFInfo
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- JP5271921B2 JP5271921B2 JP2009549834A JP2009549834A JP5271921B2 JP 5271921 B2 JP5271921 B2 JP 5271921B2 JP 2009549834 A JP2009549834 A JP 2009549834A JP 2009549834 A JP2009549834 A JP 2009549834A JP 5271921 B2 JP5271921 B2 JP 5271921B2
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1212—Zeolites, glasses
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1241—Metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
- C23C18/127—Preformed particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1275—Process of deposition of the inorganic material performed under inert atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1279—Process of deposition of the inorganic material performed under reactive atmosphere, e.g. oxidising or reducing atmospheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/60—Efficient propulsion technologies, e.g. for aircraft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24901—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material including coloring matter
Landscapes
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- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Nanotechnology (AREA)
- Paints Or Removers (AREA)
- Surface Treatment Of Glass (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Glass Compositions (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
・粒径1μm以下への顔料の粉砕は追加的で極めて複雑であり、殆どの場合不可能である。
・極めて微細な顔料は、通常、粒径1μmを超えると、顔料と異なる色彩効果(増白化)が起きる。
a)湿式細砕により、少なくとも1つの誘電干渉層を有する顔料を粉砕する、好ましくは粒径が6μm以下になるまで粉砕する工程、
b)前記粉砕された干渉顔料を珪酸塩含有懸濁液に分散させ、塗工組成物を得る工程、
c)湿式塗布により前記塗工組成物を前記金属表面、ガラス表面、又はセラミック表面に塗布する工程、及び
d)650℃以下の温度で前記塗工組成物を高密化させ、前記粉砕干渉顔料を含む前記ガラス状層を形成する工程
前記アルコール類としては、例えば、メタノール、エタノール、n−プロパノール、i−プロパノール、ブタノール、オクタノール、シクロヘキサノール等の炭素数1から8のアルコール類が挙げられる。
前記ケトン類としては、例えば、アセトン、ブタノン、シクロヘキサノン等の炭素数1から8のケトン類が挙げられる。
前記エステル類としては、エチルアセテート及びグリコールエステル類が挙げられる。
前記エーテル類としては、ジメチルエーテル、ジエチルエーテル、ジブチルエーテル、アニソール、ジオキサン、テトラヒドロフラン、及びテトラヒドロピランが挙げられる。
前記グリコールエーテル類としては、モノグリコールエーテル、ジグリコールエーテル、トリグリコールエーテル、及びポリグリコールエーテルが挙げられる。
前記グリコール類としては、エチレングリコール、ジエチレングリコール、及びプロピレングリコールが挙げられる。
前記アミド類及び他の窒素化合物としては、ジメチルアセトアミド、ピリジン、及びアセトニトリルが挙げられる。
前記脂肪族、脂環式、又は芳香族炭化水素類としては、例えば、ペンタン、ヘキサン、ヘプタン、オクタン、シクロヘキサン、ベンジン、石油エーテル、メチルシクロヘキサン、デカリン、テルペン溶剤、ベンゼン、トルエン、キシレン等の炭素数5から15のものが挙げられる。
前記ハロゲン化炭水化物類としては、ジクロロメタン、クロロホルム、四塩化炭素、及び塩化エチレンが挙げられる。
好ましい溶剤としては、アルコール類、水、及びこれらの組み合わせが挙げられる。
RnSiX4−n (I)
前記一般式(I)において、X基はそれぞれ同じでも異なっていてもよく、それぞれ加水分解性基又は水酸基であり、R基はそれぞれ同じでも異なっていてもよく、それぞれ水素、炭素数4までのアルキル基、炭素数4までのアルケニル基、炭素数4までのアルキニル基、炭素数6から10のアリール基、炭素数6から10のアラルキル基、及び炭素数6から10のアルカリル基であり、nは0、1、又は2であって、nが1又は2のシランが少なくとも1つ用いられる。
ナノスケールのSiO2粒子は、平均粒径が100nm以下のSiO2粒子であると解釈されるのが好ましく、より好ましくは平均粒径が50nm以下のSiO2粒子、更に好ましくは平均粒径が30nm以下のSiO2粒子である。明記されていない限り、本明細書中において、前記平均粒径は体積平均粒径(d50価)を意味し、該体積平均粒径は超微粒子分析装置UPA(Ultrafine Particle Analyzer, Leeds Northrup社製(レーザー光学系、動的光散乱))により測定することができる。例えば、市販品のシリカを用いることができる。該市販品としては、Levasils(登録商標)、Bayer AG製のシリカゾル等のシリカゾル、デグサ製のエアロジル(Aerosil)製品等のヒュームドシリカが挙げられる。ナノスケールのSiO2粒子が添加される場合、前記一般式(I)のシランにおける全てのSi原子と、該ナノスケールのSiO2粒子における全てのSi原子との比は、5:1から1:2の範囲であるのが好ましく、3:1から1:1の範囲であるのがより好ましい。
(珪酸塩含有塗工ゾルの製造)
珪酸ナトリウム含有ゾルが国際公開第2005/066388号パンフレットに記載されている方法と同様に製造された。このため、25mL(124.8mmol)のメチルトリエトキシシラン(MTEOS)を7mL(31.4mmol)のテトラエトキシシラン(TEOS)及び0.8g(20mmol)の水酸化ナトリウムと共に、全ての水酸化ナトリウムが溶解し、且つ、溶液が透明黄色になるまで、一晩中(少なくとも12時間)室温で攪拌した。
250gの真珠光沢顔料の混合物(イリオジン(Iriodin(登録商標))323及びイリオジン(Iriodin(登録商標))120、混合比率=1:1)を3Lのエタノールに添加し及び懸濁させ、回転ボールミルを用いて1,500rpmで3時間循環しながら粉砕した。湿式細砕は、DISPERBYK101、トリエタノールアミン、又はγ−アミノプロピルトリエトキシシラン等の一般的な分散剤を2g更に加えて懸濁にも行うことができる。次に、事前にエタノールを取り除くことなく、粉砕された顔料混合物を上述で調整された珪酸塩塗工ゾルに添加した。顔料の含有量は前記塗工ゾルの質量に対して3重量%であった。
この顔料含有塗工ゾルはステンレス鋼板(10×10cm2)に手動のスプレー法により塗布され、室温で溶剤を蒸発させた後、また、475℃で30分待った後、塗工層を酸素雰囲気中で熱密度化させた。加熱速度は2K/min.であり、475℃での保留時間は1時間であり、290℃までの冷却は圧縮空気をオーブン内に吹きこみ、2.5時間以内で行った。オーブンから取り出された後、前記板は室温まで冷却された。輝くシャンパンカラーの塗工膜が得られ、該塗工膜は、粗面性及びスライド特性の点では、同様に製造された顔料含有していない塗工膜と変わらなかった。
(直角の角を有すプレス加工されたステンレス鋼成形体上の干渉顔料含有塗工膜)
実施例1の顔料含有塗工ゾルを用い、該顔料含有塗工ゾルは直角の角を有すプレス加工されたステンレス鋼成形体に手動のスプレー法により塗布し、室温で溶剤を蒸発させた後、また、400℃で30分待った後、塗工層を酸素雰囲気中で熱固化させた。加熱速度は2K/min.であり、400℃での保留時間は1時間であり、290℃までの冷却は圧縮空気をオーブン内に吹きこみ、2.5時間以内で行った。その後、塗工されたステンレス鋼成形体はオーブンから取り出され、45分以内で室温まで冷却された。輝くシャンパンカラーの塗工膜が得られ、該塗工膜は、触感及び耐指紋付着特性の点では、同様に製造された顔料含有していない塗工膜と変わらなかった。
原料顔料の懸濁液の粒径は5μmから25μmであった。この干渉顔料の懸濁液は湿式細砕により、平均粒径が約2μmから5μmになるように粉砕された。肉眼では、原料サンプルと粉砕サンプルとの間に色彩効果における違いは確認されなかった。
Claims (23)
- 金属表面、ガラス表面、又はセラミック表面を有し、且つ、干渉顔料含有ガラス状層が付与された基板の製造方法であって、該方法が、
a)湿式細砕により、少なくとも1つの誘電干渉層を有する顔料を粉砕する工程、
b)前記粉砕された干渉顔料を珪酸塩含有懸濁液に分散させ、塗工組成物を得る工程、
c)湿式塗布により前記塗工組成物を前記金属表面、前記ガラス表面、又は前記セラミック表面に塗布する工程、及び
d)650℃以下の温度で前記塗工組成物を高密化させ、前記粉砕干渉顔料を含む前記ガラス状層を形成する工程、を含むことを特徴とする基板の製造方法。 - a)の工程において、少なくとも1つの誘電干渉層を有する顔料が湿式細砕により粒径6μm以下になるまで粉砕される、請求項1に記載の製造方法。
- 干渉顔料がボールミルにより粉砕され、該ボールミルが回転ボールミルである、請求項1及び2のいずれかに記載の製造方法。
- 誘電干渉層を有する顔料が無機支持体を有する顔料である、請求項1から3のいずれかに記載の製造方法。
- 無機支持体が、マイカ、SiO2ガラス、及び金属箔のいずれかである、請求項4に記載の製造方法。
- 誘電干渉層を有する顔料が1つ以上の酸化金属層で覆われているマイカである効果顔料である、請求項1から5のいずれかに記載の製造方法。
- 干渉顔料を粉砕するため、該干渉顔料を含む懸濁液が回転ボールミルで1時間から6時間に亘り処理される、請求項1から6のいずれかに記載の製造方法。
- 湿式細砕後、干渉顔料が懸濁液の状態で珪酸塩含有懸濁液に直接添加される、又は、粉砕に用いられた液相から取り除かれ、乾燥され、粉体の状態で珪酸塩含有懸濁液に添加される、請求項1から7のいずれかに記載の製造方法。
- 珪酸塩含有懸濁液が、有機基で変性された珪酸塩粒子を含む塗工ゾルである、請求項1から8のいずれかに記載の製造方法。
- 珪酸塩含有懸濁液が、a)アルカリ金属の酸化物、アルカリ金属の水酸化物、アルカリ土類金属の酸化物、及びアルカリ土類金属の水酸化物から選択される少なくとも1つの化合物、及びb)ナノスケールのSiO2粒子の少なくともいずれかの存在下で、少なくとも1つの一般式(I)で示されるシラン、又は該シランから誘導される少なくとも1つのオリゴマーを加水分解及び重縮合することにより得られた塗工ゾルである、請求項1から9のいずれかに記載の製造方法。
RnSiX4−n (I)
(前記一般式(I)において、X基はそれぞれ同じでも異なっていてもよく、それぞれ加水分解性基又は水酸基であり、R基はそれぞれ同じでも異なっていてもよく、それぞれ水素、炭素数4までのアルキル基、炭素数4までのアルケニル基、炭素数4までのアルキニル基、炭素数6から10のアリール基、炭素数6から10のアラルキル基、及び炭素数6から10のアルカリル基であり、nは0、1、又は2であり、但し、nが1又は2のシランが少なくとも1つ用いられる。) - アルカリ金属酸化物、アルカリ土類金属酸化物、アルカリ金属水酸化物、及びアルカリ土類金属水酸化物のいずれかが、Siに対するアルカリ金属及びアルカリ土類金属のいずれかの原子比で20:1から7:1の範囲になる量で使用される、請求項10に記載の製造方法。
- 一般式(I)で示されるシラン原料におけるnの平均価が0.2から1.5である、請求項10及び11のいずれかに記載の製造方法。
- 塗布される塗工組成物の全重量に占める干渉顔料の割合が0.1重量%から15重量%である、請求項1から12のいずれかに記載の製造方法。
- 塗工組成物が金属表面、ガラス表面、及びセラミック表面のいずれかに未乾燥膜厚4μmから20μmで塗布される、請求項1から13のいずれかに記載の製造方法。
- 塗布された塗工組成物が300℃から650℃の範囲の最大高密化温度で固化される、請求項1から14のいずれかに記載の製造方法。
- 熱固化が酸素雰囲気下、不活性ガス雰囲気下、及び還元雰囲気下のいずれかで行われ、且つ、雰囲気及び温度条件の少なくともいずれかが異なる複数の段階を設けてもよい、請求項1から15のいずれかに記載の製造方法。
- 高密化が2段階の熱処理により行われ、該熱処理において、第1段階が、(A)酸素雰囲気下又は(B)残圧が5mbarから15mbarの真空下で行われ、第2段階が、高密化が完了しガラス状層を形成するまで低酸素雰囲気下で行われる、請求項1から16のいずれかに記載の製造方法。
- 熱処理された基板の冷却が酸素雰囲気下、及び低酸素雰囲気下のいずれかで行われる、請求項1から17のいずれかに記載の製造方法。
- 金属表面、ガラス表面、及びセラミック表面のいずれかを有し、且つ、湿式細砕により粉砕され、粒径が6μm以下の干渉顔料を含むガラス状珪酸塩層を有することを特徴とする基板。
- 基板が、スチール、ステンレス鋼、アルミニウム、及び黄銅のいずれかからなる金属部であるか、該金属部を含む、請求項19に記載の基板。
- 基板が、輸送手段の金属部であり、陸上輸送手段、水上及び水中のいずれかの輸送手段、空中輸送手段、及び宇宙輸送手段の金属部であり、排気システム、家庭用品及びオフィス用品のいずれか、容器、電気スイッチ、家具、電子器具及び電気器具のいずれかの筐体、メディカルテクノロジーの機械及びシステムのいずれか、機械類及び工場建設の機械及びシステムのいずれか、建物、建築外面、建築外面外装材、手摺、壁及び床のいずれかの構成要素、又はスポーツ用品及びレジャー用品のいずれかである請求項19及び20のいずれかに記載の基板。
- 請求項19から21のいずれかに記載の金属表面、ガラス表面、及びセラミック表面のいずれかを有する基板の、装飾目的又は視覚識別目的での使用。
- 珪酸塩組成物と、湿式細砕により粉砕され、粒径が6μm以下である干渉顔料とを含有することを特徴とする印刷インク組成物。
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