JP5269741B2 - 電子部品用パッケージ及び検出装置 - Google Patents

電子部品用パッケージ及び検出装置 Download PDF

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Publication number
JP5269741B2
JP5269741B2 JP2009240077A JP2009240077A JP5269741B2 JP 5269741 B2 JP5269741 B2 JP 5269741B2 JP 2009240077 A JP2009240077 A JP 2009240077A JP 2009240077 A JP2009240077 A JP 2009240077A JP 5269741 B2 JP5269741 B2 JP 5269741B2
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JP
Japan
Prior art keywords
pad
mounting
electronic component
notch
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009240077A
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English (en)
Japanese (ja)
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JP2010171380A (ja
JP2010171380A5 (https=
Inventor
晶紀 白石
昌宏 春原
秀明 坂口
裕一 田口
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009240077A priority Critical patent/JP5269741B2/ja
Priority to US12/643,391 priority patent/US8564077B2/en
Publication of JP2010171380A publication Critical patent/JP2010171380A/ja
Publication of JP2010171380A5 publication Critical patent/JP2010171380A5/ja
Application granted granted Critical
Publication of JP5269741B2 publication Critical patent/JP5269741B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/942—Dispositions of bond pads relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
JP2009240077A 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置 Active JP5269741B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009240077A JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置
US12/643,391 US8564077B2 (en) 2008-12-24 2009-12-21 Package for electronic component, manufacturing method thereof and sensing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008328343 2008-12-24
JP2008328343 2008-12-24
JP2009240077A JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置

Publications (3)

Publication Number Publication Date
JP2010171380A JP2010171380A (ja) 2010-08-05
JP2010171380A5 JP2010171380A5 (https=) 2012-08-16
JP5269741B2 true JP5269741B2 (ja) 2013-08-21

Family

ID=42264794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009240077A Active JP5269741B2 (ja) 2008-12-24 2009-10-19 電子部品用パッケージ及び検出装置

Country Status (2)

Country Link
US (1) US8564077B2 (https=)
JP (1) JP5269741B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4342174B2 (ja) * 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
US8435802B2 (en) 2006-05-22 2013-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Conductor layout technique to reduce stress-induced void formations
US20120126793A1 (en) * 2010-11-18 2012-05-24 Elster Solutions, Llc Polyphase meter with full service disconnect switch
US8987840B2 (en) * 2011-02-01 2015-03-24 Honeywell International Inc. Edge-mounted sensor
DE112017001517T5 (de) * 2016-03-22 2019-03-07 Panasonic Intellectual Property Management Co., Ltd. Sensor
CN107768323B (zh) * 2017-11-24 2023-12-05 安徽芯动联科微系统股份有限公司 抗高过载电子器件封装管壳

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145359A (en) * 1979-04-27 1980-11-12 Fujitsu Ltd Mounting structure of semiconductor package
JPH0951199A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd 半導体装置
EP0867939A3 (en) * 1997-03-26 1999-08-18 Matsushita Electronics Corporation Wiring substrate for semiconductor device with externally wired leads
JPH10321874A (ja) * 1997-05-21 1998-12-04 Nippon Seiki Co Ltd 半導体式圧力センサ及びその製造方法
US6235551B1 (en) * 1997-12-31 2001-05-22 Micron Technology, Inc. Semiconductor device including edge bond pads and methods
JP2005044966A (ja) * 2003-07-28 2005-02-17 Toshiba Corp 光半導体モジュールと光半導体装置
JP2007132687A (ja) * 2005-11-08 2007-05-31 Sensata Technologies Japan Ltd センサ用パッケージおよびこれを用いた検出装置

Also Published As

Publication number Publication date
US20100155862A1 (en) 2010-06-24
JP2010171380A (ja) 2010-08-05
US8564077B2 (en) 2013-10-22

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