JP5265438B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5265438B2 JP5265438B2 JP2009089229A JP2009089229A JP5265438B2 JP 5265438 B2 JP5265438 B2 JP 5265438B2 JP 2009089229 A JP2009089229 A JP 2009089229A JP 2009089229 A JP2009089229 A JP 2009089229A JP 5265438 B2 JP5265438 B2 JP 5265438B2
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- 239000004065 semiconductor Substances 0.000 title claims description 102
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 description 68
- 239000000758 substrate Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 13
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 6
- 230000001154 acute effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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Description
また、図6(b)に示すPOP構造の半導体装置も提案されている。図6(b)に示す半導体装置は、配線基板200の一面側にフリップチップ方式によって搭載された半導体素子202から成る第1半導体装置上に積層された第2半導体装置204が、配線基板200の一面側に接続端子206,206・・によって電気的に接続されている。
かかるアンダーフィル剤108(208)は、液状のアンダーフィル剤を搭載された半導体素子102(202)の近傍にノズル(図示せず)から滴下して、半導体素子102(202)と配線基板100(200)との隙間に充填する。
しかし、図6に示す半導体装置においても、その薄層化の要望に応えるべく、搭載された半導体素子と配線基板との隙間が狭くなり、滴下された液状のアンダーフィル剤が半導体素子と配線基板との隙間に進入し難くなる。このため、滴下された液状のアンダーフィル剤が、配線基板の外周縁方向に広がり易くなって、図6に示す配線基板100(200)の外周縁近傍に設けられている、ワイヤ106の端部が接続されるパッドや接続端子206が装着されるパッドがアンダーフィル剤によって部分的又は全面が被覆され易くなる。
図7に示す半導体パッケージでは、配線基板300の一面側を被覆するソルダーレジスト302に、フリップチップ方式で搭載された半導体素子304と配線基板300の外周縁との間に、半導体素子304とソルダーレジスト302との間の隙間に充填されなかった余剰のアンダーフィル剤308が配線基板300の外周縁方向に広がることを防止する凹溝306が形成されている。
しかしながら、半導体パッケージには、薄層化の要請と共に小型化の要請があり、図7に示す半導体パッケージの如く、搭載された半導体素子304と配線基板300の外周縁との間に、凹溝306を形成する隙間がなくなりつつある。
そこで、本発明は、配線基板の外周縁近傍に形成された部材が余剰のアンダーフィル剤によって被覆されないように、余剰のアンダーフィル剤の配線基板の外周縁方向への広がりを防止する凹溝を、搭載された半導体素子と配線基板との間に形成することを要し、小型化が困難な従来の半導体パッケージの課題を解決し、配線基板の外周縁近傍に形成された部材が余剰のアンダーフィル剤によって被覆されることがなく、且つ小型化が可能な半導体パッケージを提供することを目的とする。
しかし、半導体素子404と溝部406との間のA位置に、ノズルから液状のアンダーフィル剤410の滴下を開始し、矢印の方向にノズルを移動させて、アンダーフィル剤410を半導体素子404と配線基板400との隙間に充填したところ、図8に示す如く、余剰のアンダーフィル剤410が溝部406内に進入し、アンダーフィル剤410によって部分的又は全面が被覆されたパッド408が発生した。
ところで、溝部406にアンダーフィル剤410が進入開始した箇所について調査すると、ノズルから液状のアンダーフィル剤410の滴下を開始した箇所に近い溝部406の角部縁(図8に○印で示す角部縁)であることが判明した。
このため、本発明者等は、液状のアンダーフィル剤410の滴下を開始したA位置に近い溝部406の角部を鈍角にしたところ、溝部406内へのアンダーフィル剤410の進入を防止できることを見出し、本発明に到達した。
かかる本発明において、アンダーフィル剤の滴下開始部近傍の溝部の角部縁を鈍角とし、前記アンダーフィル剤の滴下開始近傍の複数の溝部同士を、前記溝部よりも幅狭の細幅溝部によって連結することによって、アンダーフィル剤の滴下開始近傍の溝部の角部よりも配線基板の外周縁側に位置する角部縁からのアンダーフィル剤の進入を防止できる。
また、前記溝部の底部に形成された複数のパッドは、前記半導体素子の上方に配置される電子部品と電気的に接続される。これによって、例えば、多数のワイヤボンディング用パッドが形成された溝部内に、アンダーフィル剤の進入を防止できる。
この現象は、滴下されたアンダーフィル剤410は、その滴下開始部に近い溝部406の角部縁に最初に接触する。この最初にアンダーフィル剤410が接触した角部縁の角度が直角である場合、角部縁の交点部にアンダーフィル剤410の表面張力が集中して、交点部に接触するアンダーフィル剤量が増加し、遂には交点部から溝部406内にアンダーフィル剤410が進入するものと考えられる。
この点、本発明では、底面にパッド群を形成した溝部のうち、アンダーフィル剤の滴下開始部近傍の溝部の角部縁を鈍角又は円弧状に形成することによって、溝部内にアンダーフィル剤が進入することを防止できる。
この現象は、液状のアンダーフィル剤の滴下を開始した滴下開始部に近い溝部の角部縁にアンダーフィル剤が接触しても、アンダーフィル剤の表面張力が分散され、角部縁に接触するアンダーフィル剤量を平均化できることによるものと推察される。
この様に、溝部内にアンダーフィル剤が進入することを防止できる結果、溝部内に進入したアンダーフィル剤によってパッドが部分的又は全面的に被覆されることによる不良率の低下を図ることができる。
この溝部16,16・・は、図1に示す様に、台形形状であって、短辺側が半導体素子20側に位置するように形成されている。このため、溝部16の角部縁の角度θは、図2に示すように鈍角に形成されている。
この際に、ノズルからアンダーフィル剤22の滴下を開始したA位置(滴下開始部)に近い溝部16の角部縁に接触するアンダーフィル剤22は、角部縁の交点部に集中せず分散し、角部縁の交点部からアンダーフィル剤22が溝部16内に進入することを防止できる。
この現象は、A位置で滴下開始されたアンダーフィル剤22は、A位置に近い溝部16の角部縁に接触する。この溝部16の角部縁の角度θが鈍角であるため、角部縁の全体にアンダーフィル剤22の表面張力が分散され、角部縁の交点部にアンダーフィル剤22が集中することを防止できるためであると推察される。
かかるパッド18,18・・の各上面には、例えば図3(a)に示す様に、半導体素子20上に搭載される半導体素子30の電極端子に一端部が接続されたワイヤ32の他端部が接続される。
或いは、パッド18,18・・の各上面は、図3(b)に示す様に、半導体素子20の上方に搭載される半導体装置40と一端部が接続された接続端子42の他端部が接続される。
この場合、図4に示す様に、アンダーフィル剤22の滴下開始部であるA位置に近い、溝部16,16が、溝部16よりも幅狭の細幅溝部24、24によって連結することによって、長辺側の角部縁の角度θ′を鈍角とすることができる。
尚、図4に示す細幅溝部24、24が直角に交差しているが、この交差部に到達するアンダーフィル剤22の量は少なく、この交差部から細幅溝部24、24内にアンダーフィル剤22が進入するおそれはない。
また、図1〜図5に示す半導体パッケージでは、配線基板12に搭載した半導体素子20の各辺に対応して台形形状の溝部16や端部が円弧状に形成された溝部16を形成しているが、ノズルから液状のアンダーフィル剤22の滴下を開始するA位置(滴下開始部)に近い溝部16,16を、台形形状の溝部16や端部が円弧状に形成された溝部16に形成することによって、溝部16内へのアンダーフィル剤の進入を防止できる。
更に、図1〜図5に示す半導体パッケージでは、配線基板12に搭載した半導体素子20の各辺に対応して溝部16が形成されているが、図7に示す様に、配線基板12の一方側に片寄って半導体素子20を搭載し、半導体素子20の一方側のみに溝部16を形成してもよい。
また、図1〜図5に示す半導体パッケージの溝部16の角部縁に、鈍角に形成された複数の屈曲部が設けられていてもよい。
尚、半導体パッケージ10上に三次元実装する電子部品としては、半導体素子、半導体装置の他に、チップコンデンサーやチップ抵抗等を用いることができる。
12 配線基板
14 ソルダーレジスト
16 溝部
18 パッド
20,30 半導体素子
22 アンダーフィル剤
24 細幅溝部
32 ワイヤ
40 半導体装置
42 接続端子
Claims (3)
- 配線基板の一面側に形成されたフリップチップ搭載用パッドに半導体素子がフリップチップ方式で搭載され、前記半導体素子と前記配線基板との間にアンダーフィル剤が滴下されて充填された半導体装置であって、
前記配線基板の一面側を被覆するソルダーレジストに溝部が形成され、
前記溝部の底部には複数のパッドが形成され、
前記溝部は、前記半導体素子の周縁部と前記配線基板の周縁部との間に、前記配線基板の周縁部に沿って配置され、
前記アンダーフィル剤の滴下開始部は、前記半導体素子の周縁部と前記溝部との間であり、
前記アンダーフィル剤の滴下開始部近傍の前記溝部の角部縁が、滴下されたアンダーフィル剤の溝部内への進入を防止できるように、鈍角又は円弧状に形成されていることを特徴とする半導体装置。 - 前記溝部の角部縁が鈍角であって、前記アンダーフィル剤の滴下開始近傍の複数の溝部同士が、前記溝部よりも幅狭の細幅溝部によって連結されている請求項1記載の半導体装置。
- 前記溝部の底部に形成された複数のパッドは、前記半導体素子の上方に配置される電子部品と電気的に接続される請求項1又は請求項2記載の半導体装置。
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