JP5253237B2 - プラズマ処理装置およびプラズマ処理方法 - Google Patents

プラズマ処理装置およびプラズマ処理方法 Download PDF

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Publication number
JP5253237B2
JP5253237B2 JP2009051856A JP2009051856A JP5253237B2 JP 5253237 B2 JP5253237 B2 JP 5253237B2 JP 2009051856 A JP2009051856 A JP 2009051856A JP 2009051856 A JP2009051856 A JP 2009051856A JP 5253237 B2 JP5253237 B2 JP 5253237B2
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plasma
removal liquid
temperature
liquid vapor
processed
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Japanese (ja)
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JP2010206068A5 (enExample
JP2010206068A (ja
Inventor
茂 渡辺
浩司 武石
哲也 境
真 武藤
大輔 松嶋
裕規 白濱
大輔 渡邉
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of JP2010206068A5 publication Critical patent/JP2010206068A5/ja
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  • Cleaning Or Drying Semiconductors (AREA)
JP2009051856A 2009-03-05 2009-03-05 プラズマ処理装置およびプラズマ処理方法 Active JP5253237B2 (ja)

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JP2009051856A JP5253237B2 (ja) 2009-03-05 2009-03-05 プラズマ処理装置およびプラズマ処理方法

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JP2009051856A JP5253237B2 (ja) 2009-03-05 2009-03-05 プラズマ処理装置およびプラズマ処理方法

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JP2010206068A JP2010206068A (ja) 2010-09-16
JP2010206068A5 JP2010206068A5 (enExample) 2012-04-19
JP5253237B2 true JP5253237B2 (ja) 2013-07-31

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102107256B1 (ko) * 2012-05-23 2020-05-06 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
KR20220097202A (ko) 2020-12-31 2022-07-07 세메스 주식회사 기판 처리 방법 및 기판 처리 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496226A (ja) * 1990-08-03 1992-03-27 Fujitsu Ltd 半導体装置の製造方法
US5282925A (en) * 1992-11-09 1994-02-01 International Business Machines Corporation Device and method for accurate etching and removal of thin film
JP3335705B2 (ja) * 1993-04-15 2002-10-21 富士フイルムマイクロデバイス株式会社 気相分解方法および分解装置

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