JP5244390B2 - Soiウェーハで作ったバック照明式cmos撮像素子(imager)の製造方法 - Google Patents
Soiウェーハで作ったバック照明式cmos撮像素子(imager)の製造方法 Download PDFInfo
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- 239000010410 layer Substances 0.000 claims description 130
- 229910052710 silicon Inorganic materials 0.000 claims description 107
- 239000010703 silicon Substances 0.000 claims description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 106
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- 125000006850 spacer group Chemical group 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 description 1
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Description
本出願は、Bedabrata PainおよびThomas J Cunninghamによって2004年9月17日に出願された米国仮特許出願通し番号60/610,830「Back-Illuminated Visible Imager」およびBedabrata Painによって2004年9月17日に出願された米国仮特許出願番号60/610,831「Architecture and Methods for High-Efficiency Visible Imager Implementation」の利益を主張する。これらの米国仮特許出願すべての開示内容は本書の一部としてここに組み込まれるものである。本出願は、同じ出願日に出願された米国特許出願(代理人事件番号622737−5)「Structure for Implementation of Back-Illuminated CMOS or CCD Imagers」にも関連している。この米国特許出願の全内容も本書の一部としてここに組み込まれるものである。
(連邦利害関係の陳述)
(分野)
第1の態様によれば、ここに開示する撮像構造を製作するウェーハ−レベル・プロセス(wafer-level process)は、シリコン・ウェーハと素子シリコン(device silicon)のと間に埋められた酸化物層を含み、この酸化物層が撮像構造に不活性化層を形成するように用いられるようになるというウェーハを用意する工程と、素子層と層間絶縁膜を形成する工程と、シリコン・ウェーハを除去して酸化物層を露出させる工程と、から成る。
図2は、本開示によるCMOS/CCD撮像素子のためのバックサイド照明式ピクセルの集光部の断面を示している。
図3は、吸収深さの関数としての波長を示している。
図4は、従来技術によるバックサイド照明式構造を示している。
図5は、本開示の一実施形態によるバックサイド照明式構造を示している。
図6は、撮像構造を製作する従来技術のフローチャートを示している。
図7は、撮像構造を製作する従来技術の断面図を示している。
図8は、本開示による撮像構造を製作する技術のフローチャートを示している。
図9A〜9Eは、本開示による撮像構造を製作する技術の断面図を示している。
図10は、ウェーハ・レベルで見た図2、9Eの組み合わせの概略図を示している。
図11は、撮像素子アレイを製作するための、ウェーハ・レベルでのSOIバルクCMOS組み合わせプロセスの断面図を示している。
図12は、図11の構造の回路図を示している。
2.拡散によるキャリア収集の最小化のための構造の形成。
3.光を浴びるシリコン表面の不活性化、すなわち、ダングリング・ボンド(dangling bonds)およびインタフェース・トラップ密度を、撮像に相応したレベルまで低減すること。 シンニング(thinning)した後に、露出したシリコン表面には高密度のインタフェース・トラップができ、これが、暗電流におけるマグニチュード増加の程度および青色量子効率の損失(より短い波長光の吸収深さが非常に小さいので)を招くことになる。ウェーハのフロントサイドに低融点の金属が存在するせいで、インプラントをアニーリング(annealing)するために高温工程を使用することができないので、これらのトラップを不活性化するためには、従来とは違う技術を使用する必要がある。しかし、ウェーハ−スケールでは、従来形とは違う不活性化技術を使用しないでもすむ。
4.ダイ−レベル処理(die-level processing)の代わりのウェーハ−レベル処理(wafer-level processing)。
この表に示すドーピング濃度は、概算であり、使用される特定の製作法に基づいて変わることになる。素子シリコン830のドーピング濃度は、素子シリコンの厚さに基づいて選択される。素子シリコンの厚さは、ここでも、必要な赤色反応の程度に基づいている。素子シリコン厚さが増大するにつれて、空乏領域厚さを増大させ、非空乏シリコンの量を最小限に抑えるためにドーピング濃度は減らすことになる。非空乏シリコンの最小化は、量子効率(それ故、感度)およびクロストーク性能の両方の改善にとって重要である。したがって、出発材料は、シリコンの厚さおよびそのドーピング濃度を変えることによって必要な赤色反応について最適化できる。
Claims (14)
- シリコン・ウェーハと素子シリコン層との間に埋設された、前記素子シリコン層表面に熱酸化により形成されたSiO2である、絶縁体層を含んだSOIウェーハを提供する工程と、
バルクCMOSプロセス・フローにより前記素子シリコン層を処理することにより、複数のフォトダイオードを包含する素子層を形成する工程と、
前記素子層と結合されるべき層間絶縁層を形成する工程と、
前記素子シリコン層の上に、前記フォトダイオードの量子効率(QE)を維持しつつ暗電流を下げるように構成された不活性化層を形成する前記絶縁体層を露出させるために、前記シリコン・ウェーハを除去する工程と、
前記フォトダイオードのそれぞれに対応して配置されるようにして、前記不活性化層の上に、マイクロレンズを提供する工程とからなる、
ことを特徴とする、絶縁体上シリコン(SOI;silicon-on-insulator)プロセスとCMOSプロセスとを組み合わせたプロセス。 - 前記素子シリコン層は、3μm〜10μmの厚さを有することを特徴とする請求項1に記載のプロセス。
- 前記素子シリコン層のドーピング濃度は、前記素子シリコン層の空乏領域の厚さと相反する関係となることを特徴とする請求項1又は2に記載のプロセス。
- 前記フォトダイオードがLOCOSまたはSTI構造によって互いに分離されていることを特徴とする請求項1〜3のいずれかに記載のプロセス。
- 前記素子シリコン層が、前記複数のフォトダイオードを含む撮像領域と、CMOS信号処理回路を含む信号処理領域とを含むことを特徴とする請求項1〜4のいずれかに記載のプロセス。
- 前記不活性化層と前記マイクロレンズとの間に反射防止コーティングを形成する工程をさらに含むことを特徴とする請求項1に記載のプロセス。
- 前記不活性化層と前記マイクロレンズとの間にカラーフィルタを形成する工程をさらに含むことを特徴とする請求項1に記載のプロセス。
- 前記反射防止コーティングと前記マイクロレンズとの間にカラーフィルタを形成する工程をさらに含むことを特徴とする請求項6に記載のプロセス。
- 前記複数のフォトダイオードの各々は対応するMOSゲートに接続されていることを特徴とする請求項1に記載のプロセス。
- シリコン・ウェーハと素子シリコン層との間に埋設された、前記素子シリコン層表面に熱酸化により形成されたSiO2である、絶縁体層を含んだSOIウェーハを提供する工程と、
バルクCMOSプロセス・フローにより前記素子シリコン層を処理することにより、複数のフォトダイオードを包含する素子層を形成する工程と、
前記素子層と結合されるべき層間絶縁層を形成する工程と、
前記素子シリコン層の上に、前記フォトダイオードの量子効率(QE)を維持しつつ暗電流を下げるように構成された不活性化層を形成する前記絶縁体層を露出させるために、前記シリコン・ウェーハを除去する工程と、
前記フォトダイオードのそれぞれに対応して配置されるようにして、前記不活性化層の上に、カラーフィルタを提供する工程とからなる、
ことを特徴とする、絶縁体上シリコン(SOI;silicon-on-insulator)プロセスとCMOSプロセスとを組み合わせたプロセス。 - 前記不活性化層と前記カラーフィルタとの間に反射防止コーティングを形成する工程をさらに含むことを特徴とする請求項10に記載のプロセス。
- 前記カラーフィルタの上にマイクロレンズを形成する工程をさらに含むことを特徴とする請求項10に記載のプロセス。
- 前記複数のフォトダイオードの各々は対応するMOSゲートに接続されていることを特徴とする請求項10に記載のプロセス。
- シリコン・ウェーハと素子シリコン層との間に埋設された、前記素子シリコン層表面に熱酸化により形成されたSiO2である、絶縁体層を含んだSOIウェーハを提供する工程と、
バルクCMOSプロセス・フローにより前記素子シリコン層を処理することにより、複数のフォトダイオードを包含する素子層を形成する工程と、
前記素子層と結合されるべき層間絶縁層を形成する工程と、
前記素子シリコン層の上に、前記フォトダイオードの量子効率(QE)を維持しつつ暗電流を下げるように構成された不活性化層を形成する前記絶縁体層を露出させるために、前記シリコン・ウェーハを除去する工程と、
前記フォトダイオードに対応して配置されるようにして、前記不活性化層の上に、それぞれレンズ及び/又はフィルタを含む光学撮像素子を提供する工程とからなる、
ことを特徴とする、絶縁体上シリコン(SOI;silicon-on-insulator)プロセスとCMOSプロセスとを組み合わせたプロセス。
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