JP5230992B2 - 貫通電極付き基板の製造方法 - Google Patents

貫通電極付き基板の製造方法 Download PDF

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Publication number
JP5230992B2
JP5230992B2 JP2007277827A JP2007277827A JP5230992B2 JP 5230992 B2 JP5230992 B2 JP 5230992B2 JP 2007277827 A JP2007277827 A JP 2007277827A JP 2007277827 A JP2007277827 A JP 2007277827A JP 5230992 B2 JP5230992 B2 JP 5230992B2
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Japan
Prior art keywords
substrate
support plate
silicon wafer
hole
electrode
Prior art date
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Expired - Fee Related
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JP2007277827A
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English (en)
Japanese (ja)
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JP2009105326A (ja
JP2009105326A5 (enExample
Inventor
昌宏 春原
秀明 坂口
光敏 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007277827A priority Critical patent/JP5230992B2/ja
Publication of JP2009105326A publication Critical patent/JP2009105326A/ja
Publication of JP2009105326A5 publication Critical patent/JP2009105326A5/ja
Application granted granted Critical
Publication of JP5230992B2 publication Critical patent/JP5230992B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2007277827A 2007-10-25 2007-10-25 貫通電極付き基板の製造方法 Expired - Fee Related JP5230992B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007277827A JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007277827A JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009105326A JP2009105326A (ja) 2009-05-14
JP2009105326A5 JP2009105326A5 (enExample) 2010-08-05
JP5230992B2 true JP5230992B2 (ja) 2013-07-10

Family

ID=40706704

Family Applications (1)

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JP2007277827A Expired - Fee Related JP5230992B2 (ja) 2007-10-25 2007-10-25 貫通電極付き基板の製造方法

Country Status (1)

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JP (1) JP5230992B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547566B2 (ja) * 2010-06-29 2014-07-16 株式会社アドバンテスト 貫通配線基板の製造方法
KR102250469B1 (ko) 2014-02-26 2021-05-12 엔지케이 인슐레이터 엘티디 관통 구멍을 갖는 절연 기판
FR3042308B1 (fr) 2015-10-13 2018-02-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Boitier pour composants microelectroniques

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JP2006287211A (ja) * 2005-03-08 2006-10-19 Sharp Corp 半導体装置、積層半導体装置およびそれらの製造方法

Also Published As

Publication number Publication date
JP2009105326A (ja) 2009-05-14

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