JP5224142B2 - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
- Publication number
- JP5224142B2 JP5224142B2 JP2009538992A JP2009538992A JP5224142B2 JP 5224142 B2 JP5224142 B2 JP 5224142B2 JP 2009538992 A JP2009538992 A JP 2009538992A JP 2009538992 A JP2009538992 A JP 2009538992A JP 5224142 B2 JP5224142 B2 JP 5224142B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging
- support
- optical
- lens
- optical unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title claims description 249
- 230000003287 optical effect Effects 0.000 claims description 151
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 description 29
- 238000007789 sealing Methods 0.000 description 20
- 230000004048 modification Effects 0.000 description 18
- 238000012986 modification Methods 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 125000006850 spacer group Chemical group 0.000 description 10
- 230000001186 cumulative effect Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B35/00—Stereoscopic photography
- G03B35/08—Stereoscopic photography by simultaneous recording
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
- H04N13/20—Image signal generators
- H04N13/204—Image signal generators using stereoscopic image cameras
- H04N13/239—Image signal generators using stereoscopic image cameras using two 2D image sensors having a relative position equal to or related to the interocular distance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Stereoscopic And Panoramic Photography (AREA)
- Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
- Facsimile Heads (AREA)
- Color Television Image Signal Generators (AREA)
Description
2、3 取付孔
4、5 突出部
4a、5a 段部
7、8、7A 段部
10、10A、10B 撮像装置
11、12 撮像素子
11a、12a 撮像面
11b、12b スペーサ
20 光学ユニット
21、22 レンズ
23 支持部
24 レンズ枠部材
28、28A 基板
29、29A、29B 封止部材
30、30A、30B、30C、40 撮像装置
31、32 撮像ユニット
33 光学部材
41、42 カメラユニット
43 カメラ枠部材
P1、P2 光軸
図1は、第1の実施の形態に係る撮像装置の要部断面図である。図2は、図1の撮像装置の各部材を分解して示す要部分解断面図である。
図5は、第2の実施の形態に係る撮像装置の要部断面図である。図5の撮像装置30は、各取付孔2、3に上述の光学ユニット20をそれぞれ配置するとともに、取付孔2、3に対応して各撮像ユニット31、32を配置したものである。
図11は第3の実施の形態に係る撮像装置の要部断面図である。図11の撮像装置40は、上述の光学ユニット20、20と撮像素子11、12とをカメラ枠部材43により一体化したカメラユニット41、42とし、支持体1の取付孔2、3にそれぞれ取り付けるようにしたものである。
Claims (5)
- 光電変換機能を有する複数の画素をそれぞれ備える複数の撮像素子と、
前記複数の撮像素子を取り付ける支持体と、を有し、
前記複数の撮像素子がその受光側の面でそれぞれ前記支持体に直接当接することで光軸方向の位置決めがなされていることを特徴とする撮像装置。 - 前記撮像素子上に画像を形成する光学系を備えた光学ユニットを有し、
前記光学系の一部に前記撮像素子に当接する支持部が形成され、
前記支持部が前記撮像素子に当接することで、前記光学ユニットの光軸方向の位置決めがなされている請求項1に記載の撮像装置。 - 前記撮像素子上に画像を形成する光学系を備えた光学ユニットを有し、
前記光学系の一部に前記支持体に当接する支持部が形成され、
前記支持部が前記支持体に当接することで、前記光学ユニットの光軸方向の位置決めがなされている請求項1に記載の撮像装置。 - 前記複数の撮像素子は、それぞれ前記複数の画素からなる光電変換エリア以外の領域が前記支持体に当接している請求項1乃至3のいずれか一項に記載の撮像装置。
- 前記複数の撮像素子は、それぞれ前記複数の画素からなる光電変換エリア内の画像に用いない画素領域が前記支持体に当接している請求項1乃至3のいずれか一項に記載の撮像装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009538992A JP5224142B2 (ja) | 2007-11-01 | 2008-10-10 | 撮像装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007285200 | 2007-11-01 | ||
JP2007285200 | 2007-11-01 | ||
JP2009538992A JP5224142B2 (ja) | 2007-11-01 | 2008-10-10 | 撮像装置 |
PCT/JP2008/068463 WO2009057436A1 (ja) | 2007-11-01 | 2008-10-10 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009057436A1 JPWO2009057436A1 (ja) | 2011-03-10 |
JP5224142B2 true JP5224142B2 (ja) | 2013-07-03 |
Family
ID=40590830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009538992A Expired - Fee Related JP5224142B2 (ja) | 2007-11-01 | 2008-10-10 | 撮像装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100259655A1 (ja) |
JP (1) | JP5224142B2 (ja) |
CN (1) | CN101843106B (ja) |
WO (1) | WO2009057436A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194543A (ja) * | 2008-02-13 | 2009-08-27 | Panasonic Corp | 撮像装置およびその製造方法 |
JP5158895B2 (ja) * | 2010-05-11 | 2013-03-06 | シャープ株式会社 | 撮像装置 |
US9485495B2 (en) | 2010-08-09 | 2016-11-01 | Qualcomm Incorporated | Autofocus for stereo images |
KR101149021B1 (ko) | 2010-10-08 | 2012-05-24 | 엘지이노텍 주식회사 | 3차원 촬상장치와 그 제조방법 |
JP2012220942A (ja) * | 2011-04-14 | 2012-11-12 | Sharp Corp | 3次元カメラモジュール、それを備えた携帯端末及び携帯電話機 |
US9438889B2 (en) | 2011-09-21 | 2016-09-06 | Qualcomm Incorporated | System and method for improving methods of manufacturing stereoscopic image sensors |
DE102012106834A1 (de) * | 2012-07-27 | 2014-01-30 | Conti Temic Microelectronic Gmbh | Verfahren zur Ausrichtung zweier Bildaufnahmeelemente eines Stereokamerasystems |
US9398264B2 (en) | 2012-10-19 | 2016-07-19 | Qualcomm Incorporated | Multi-camera system using folded optics |
DE102013102820A1 (de) * | 2013-03-19 | 2014-09-25 | Conti Temic Microelectronic Gmbh | Stereokameramodul sowie Verfahren zur Herstellung |
US10178373B2 (en) | 2013-08-16 | 2019-01-08 | Qualcomm Incorporated | Stereo yaw correction using autofocus feedback |
US9374516B2 (en) | 2014-04-04 | 2016-06-21 | Qualcomm Incorporated | Auto-focus in low-profile folded optics multi-camera system |
US9383550B2 (en) | 2014-04-04 | 2016-07-05 | Qualcomm Incorporated | Auto-focus in low-profile folded optics multi-camera system |
US10013764B2 (en) | 2014-06-19 | 2018-07-03 | Qualcomm Incorporated | Local adaptive histogram equalization |
US9386222B2 (en) | 2014-06-20 | 2016-07-05 | Qualcomm Incorporated | Multi-camera system using folded optics free from parallax artifacts |
US9541740B2 (en) | 2014-06-20 | 2017-01-10 | Qualcomm Incorporated | Folded optic array camera using refractive prisms |
US9819863B2 (en) | 2014-06-20 | 2017-11-14 | Qualcomm Incorporated | Wide field of view array camera for hemispheric and spherical imaging |
US9549107B2 (en) | 2014-06-20 | 2017-01-17 | Qualcomm Incorporated | Autofocus for folded optic array cameras |
US9294672B2 (en) | 2014-06-20 | 2016-03-22 | Qualcomm Incorporated | Multi-camera system using folded optics free from parallax and tilt artifacts |
US10375280B2 (en) * | 2014-07-18 | 2019-08-06 | Fuji Corporation | Imaging device with improved heat dissipation including a board section between a first and a second housing |
JP6408341B2 (ja) * | 2014-10-29 | 2018-10-17 | 京セラ株式会社 | 撮像素子実装用基板、撮像装置および撮像モジュール |
US9832381B2 (en) | 2014-10-31 | 2017-11-28 | Qualcomm Incorporated | Optical image stabilization for thin cameras |
CN105187697B (zh) * | 2015-08-04 | 2019-12-31 | 宁波舜宇光电信息有限公司 | 多镜头摄像模组连体支架和多镜头摄像模组及其应用 |
KR102335306B1 (ko) * | 2016-03-12 | 2021-12-03 | 닝보 써니 오포테크 코., 엘티디. | 어레이 이미징 모듈, 성형 감광성 어셈블리 및 그 제조 방법, 및 전자 장치 |
US10750071B2 (en) * | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
JP2018085614A (ja) * | 2016-11-23 | 2018-05-31 | 日本電産コパル株式会社 | 撮像装置 |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
Citations (6)
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JPH09130654A (ja) * | 1995-11-06 | 1997-05-16 | Konica Corp | 撮像装置 |
JP2004048287A (ja) * | 2002-07-10 | 2004-02-12 | Konica Minolta Holdings Inc | 撮像装置及び携帯端末 |
WO2006052024A1 (ja) * | 2004-11-15 | 2006-05-18 | Hitachi, Ltd. | ステレオカメラ |
JP2006165607A (ja) * | 2004-12-02 | 2006-06-22 | Omron Corp | 撮像装置及び三次元物体認識装置 |
JP2006287533A (ja) * | 2005-03-31 | 2006-10-19 | Sharp Corp | 光学装置用モジュール |
WO2007083579A1 (ja) * | 2006-01-20 | 2007-07-26 | Matsushita Electric Industrial Co., Ltd. | 複眼方式のカメラモジュール及びその製造方法 |
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-
2008
- 2008-10-10 CN CN200880113685.3A patent/CN101843106B/zh not_active Expired - Fee Related
- 2008-10-10 US US12/739,987 patent/US20100259655A1/en not_active Abandoned
- 2008-10-10 WO PCT/JP2008/068463 patent/WO2009057436A1/ja active Application Filing
- 2008-10-10 JP JP2009538992A patent/JP5224142B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09130654A (ja) * | 1995-11-06 | 1997-05-16 | Konica Corp | 撮像装置 |
JP2004048287A (ja) * | 2002-07-10 | 2004-02-12 | Konica Minolta Holdings Inc | 撮像装置及び携帯端末 |
WO2006052024A1 (ja) * | 2004-11-15 | 2006-05-18 | Hitachi, Ltd. | ステレオカメラ |
JP2006165607A (ja) * | 2004-12-02 | 2006-06-22 | Omron Corp | 撮像装置及び三次元物体認識装置 |
JP2006287533A (ja) * | 2005-03-31 | 2006-10-19 | Sharp Corp | 光学装置用モジュール |
WO2007083579A1 (ja) * | 2006-01-20 | 2007-07-26 | Matsushita Electric Industrial Co., Ltd. | 複眼方式のカメラモジュール及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101843106B (zh) | 2015-11-25 |
CN101843106A (zh) | 2010-09-22 |
JPWO2009057436A1 (ja) | 2011-03-10 |
US20100259655A1 (en) | 2010-10-14 |
WO2009057436A1 (ja) | 2009-05-07 |
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