JP5218593B2 - ELECTRO-OPTICAL DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - Google Patents

Description

  The present invention belongs to a technical field of an electro-optical device such as a liquid crystal device having a built-in driving circuit in which a peripheral driving circuit is formed on an element substrate, and an electronic apparatus including the electro-optical device.

  In an electro-optical device such as this type of liquid crystal device, a plurality of pixel portions driven for image display are arranged in a matrix in the image display region. In each pixel portion, for example, a pixel electrode and a thin film transistor (hereinafter, referred to as “TFT” as appropriate) for controlling switching of each pixel electrode are arranged, and a gap between adjacent pixel electrodes vertically and horizontally is arranged. A wiring such as a scanning line, a data line, and a capacitor line is provided along the line. In particular, in the case of a built-in driving circuit, a scanning line driving circuit and a data line driving circuit for driving a scanning line and a data line are formed in a peripheral region on the same element substrate. Therefore, usually, various wirings such as a power signal line, a clock signal line, an image signal line, and a control signal line from a plurality of external circuit connection terminals arranged along one side of the element substrate to the peripheral drive circuit are provided. A planar layout is provided in the peripheral area.

  Here, in accordance with the demand for miniaturization of the electro-optical device or the element substrate, a large number of various wirings from the external circuit connection terminal to the peripheral circuit are accommodated in the limited peripheral region, or the limited peripheral region There has also been proposed a technique for devising a planar layout of various wirings so as to reduce mutual noise between various wirings arranged close to each other (see Patent Documents 1 and 2).

JP-A-11-202367 Japanese Patent Application Laid-Open No. 11-223832

  In this type of electro-optical device, there is an extremely strong demand in practice for improving the image quality by improving the driving frequency and the definition while reducing the size of the device or the element substrate.

  However, according to the technique of providing various wirings in the conventional peripheral region described above, a plurality of wirings each having one end connected to a plurality of external circuit connection terminals (referred to as “ Referred to as "main wiring"). Moreover, the number of main wirings or the number of external circuit connection terminals tends to increase as the driving system becomes more complex. For this reason, at least some of the main wirings have to cross other main wirings while the other ends reach the peripheral drive circuit and the vertical conduction terminals. At the crossing point, in the laminated structure constructed on the element substrate, a relay wiring portion made of another conductive film laminated below or above the conductive film constituting the at least one main wiring must be passed. I must. In view of the fact that the main wiring is usually formed from the conductive film having the lowest resistance in the laminated structure constructed on the element substrate such as aluminum, in this way, from the other conductive film, that is, the lowest resistance. There is a technical problem that forming the relay wiring portion from a non-conductive film significantly increases the wiring resistance in the main wiring. An increase in wiring resistance in the main wiring may cause various image quality degradations depending on the use of the main wiring.

  Thus, it is extremely difficult in practice to achieve both the downsizing of the device by narrowing the peripheral region and the improvement of the image quality by miniaturization of the pixel pitch or the wiring pitch. In addition, if the relay wiring portion as described above is made, the resistance increases due to contact resistance and contact hole resistance, and further, the laminated structure on the element substrate and the manufacturing process become complicated. There is also a technical problem that can lead to a decline.

  The present invention has been made in view of the above problems, for example, and can reduce the resistance of the main wiring efficiently and suppress the mutual interference of signals between the main wiring, thereby enabling high-quality image display. An object is to provide an electro-optical device and an electronic apparatus including the electro-optical device.

In order to solve the above-described problems, an electro-optical device according to the present invention is provided so as to surround an element substrate, a counter substrate bonded to the element substrate via a sealing material, and an image display region inside the sealing material. A frame light shielding film, a pixel electrode provided in a pixel portion of the image display region, a counter electrode facing the pixel electrode, and a plurality of externals arranged in a first direction along a first side of the element substrate The frame light shielding film is disposed along a circuit connection terminal, a plurality of external circuit connection terminals, and a data line driving circuit between the plurality of external circuit connection terminals and the image display region , along a second side intersecting with the first side of the element substrate. A scanning line driving circuit disposed so as to overlap, a counter electrode potential line connected to a first external circuit connection terminal of the plurality of external circuit connection terminals and supplying a counter electrode potential to the counter electrode, Multiple external circuit connection terminals And supplies a scan line driver circuit wiring connected to the second external circuit connection terminals and said scanning line driving circuit Chino, an image signal input from the third external circuit connection terminals of the plurality of external circuit connection terminals The counter electrode potential line, the scanning line driving circuit wiring, and the image signal line in the first direction between the data line driving circuit and the first side of the element substrate, respectively. And extending between the data line driving circuit and the second side of the element substrate in a second direction intersecting the first direction, and the counter electrode potential line is used for the scanning line driving circuit. The scanning line driving circuit wiring is disposed between the counter electrode potential line and the image signal line .
And a data line driving circuit wiring for connecting a fourth external circuit connecting terminal of the plurality of external circuit connecting terminals and the data line driving circuit, wherein the image signal line is for the scanning line driving circuit. The wiring is arranged between the wiring and the data line driving circuit wiring.
The first external circuit connection terminal is disposed closer to the second side of the element substrate than the second external circuit connection terminal.
A data line driving circuit for supplying a video signal to the pixel portion between the plurality of external circuit connection terminals and the image display region; and a third external circuit of the plurality of external circuit connection terminals. A data line driving circuit wiring connecting the connection terminal and the data line driving circuit, wherein the second external circuit connecting terminal is between the first external circuit connecting terminal and the third external circuit connecting terminal. Has been placed.
The scanning line driving circuit wiring includes a pair of clock signal lines that supply a clock signal and an inverted signal thereof and do not cross the counter electrode potential line.
The scanning line driving circuit wiring includes a pair of clock signal lines for supplying a clock signal and an inverted signal thereof, and a power supply wiring for supplying a power signal, and the pair of clock signal lines, Do not cross the power supply wiring.
The counter electrode potential line and the scanning line driving circuit wiring are laid out in a plane so as to meander while avoiding crossing each other.
The counter electrode potential line and the scanning line driving circuit wiring at least partially include a redundant wiring made of another conductive film formed in another layer.

  According to the electro-optical device of the present invention, during the operation, for example, an image signal, a clock signal, an inverted signal thereof, a power supply signal, a control signal, etc. are connected via the external circuit connection terminal and the main wiring connected to one end thereof. Various electrical signals are respectively supplied to the peripheral drive circuits connected to the other end of the main wiring. Alternatively, for example, the counter electrode potential is supplied to the vertical conduction terminal provided in the peripheral region through the external circuit connection terminal and the main wiring connected to one end thereof, and the counter substrate side is further provided through the vertical conduction material. To the counter electrode provided in Such a main wiring is, for example, driven by a peripheral driving circuit such as a scanning line driving circuit, a data line driving circuit, etc., by driving the scanning line and the data line based on the various electric signals supplied as described above. An image is displayed by the method. For example, a plurality of pixel portions are driven in an active matrix.

  Here, particularly in the electro-optical device of the present invention, the plurality of main wirings are formed of the same conductive film and are planarly laid out in the peripheral region so as not to cross each other. For this reason, if the conductive film excellent in conductivity is included in the laminated structure constructed on the element substrate and adopted as the same conductive film as described above, or in the laminated structure constructed on the element substrate. If the conductive film having the highest conductivity is employed as the above-described same conductive film, a plurality of main wirings can be constructed as wirings having excellent conductivity. Furthermore, even if the number of main wirings or the number of external circuit connection terminals increases as the drive system becomes more sophisticated, the plurality of main wirings are laid out in a plane so as not to cross each other. There is no need to route through the relay wiring part. If the main wiring is formed from the conductive film having the lowest resistance in the laminated structure constructed on the element substrate such as aluminum, it is usually formed from the other conductive film in the laminated structure that is not lower in resistance. Compared with the case where the relay wiring portion is used, the wiring resistance in the main wiring can be significantly reduced. Therefore, various kinds of image quality deterioration due to an increase in the wiring resistance of the main wiring can be effectively prevented. In other words, it is possible to achieve both the downsizing of the device by narrowing the peripheral area and the improvement of the image quality by the miniaturization of the pixel pitch or the wiring pitch.

  In addition, since it is not necessary to make a relay wiring portion in the main wiring as described above, an increase in resistance due to contact resistance or contact hole resistance in the main wiring can be avoided, and further, the laminated structure on the element substrate and the manufacturing process can be simplified. . Therefore, it is possible to ultimately reduce the device yield and improve the reliability. In addition, mutual interference of two types of electrical signals between the two main wirings, such as that seen when two main wirings cross through a thin interlayer insulating film, is prevented from crossing a plurality of main wirings. In addition, it is possible to reduce significantly by performing a planar layout.

  As a result, according to the electro-optical device of the present invention, the resistance of the main wiring can be efficiently reduced and the mutual interference of signals between the main wirings can be suppressed, thereby enabling high-quality image display.

  In one aspect of the electro-optical device of the present invention, at least one of the internal wiring of the peripheral driving circuit, the leading wiring drawn out from the peripheral driving circuit toward the pixel portion, and the branch wiring branched from the main wiring. Is formed of another conductive film different from the same conductive film in the first portion, and crosses the main wiring through the interlayer insulating film, and the same in the second portion. A planar layout is formed in the peripheral region so as to be formed of a conductive film so as not to cross the main wiring.

  According to this aspect, sub wiring such as internal wiring, lead-out wiring, and branch wiring is provided in the peripheral region. Among these, the internal wiring of the peripheral drive circuit is a wiring that connects between a plurality of arranged circuits constituting, for example, a shift register in the peripheral drive circuit.

  The lead-out wiring is a wiring for drawing out a scanning line, a data line, a capacitor line, and the like from the image display area to the peripheral area. The branch wiring is a wiring for supplying various electric signals that are commonly used in a plurality of locations of the peripheral drive circuit, such as a power supply signal and a clock signal.

  Such a sub-wiring is, for example, a metal film or a conductive material that has a second conductive property, a second conductive property, a third conductive property, or the like that is laminated with an interlayer insulating film on the conductive material having the highest conductivity. Made of a conductive polysilicon film and the like, and is laid out in a plane so as to intersect with the main wiring. Further, in the second part, such a sub-wiring is made of a conductive film having the highest conductivity like the main wiring, for example, and is planarly laid out so as not to cross the main wiring. Therefore, the conductivity of the sub-wiring can be improved as long as it does not conflict with the main wiring.

  In this aspect, the first portion and the second portion may be electrically connected via a contact hole opened in the interlayer insulating film.

  If comprised in this way, a subwiring can function as one wiring which cross | intersects through a contact hole so that a main wiring may be avoided, and includes the 1st part and the 2nd part. In addition, you may connect between these 1st parts and 2nd parts by systems other than a contact hole.

  In another aspect of the electro-optical device according to the aspect of the invention, the peripheral region on the counter substrate disposed to face the element substrate may further include a counter electrode, and the plurality of main wirings may be provided in the peripheral region on the element substrate. A counter electrode potential line for supplying a counter electrode potential to at least one of the counter electrodes, and a vertical conduction terminal for establishing vertical conduction between the counter electrode and the counter electrode potential. The line is located near the edge of the element substrate in the plurality of main wirings in the peripheral region, and the peripheral drive circuit is located in the peripheral region more than the vertical conduction terminal and the counter electrode potential line in the peripheral region. Located near the center of the board.

  According to this aspect, during the operation, for example, the counter electrode potential is supplied to the vertical conduction terminal provided in the peripheral region via the external circuit connection terminal and the main wiring having one end connected to the external circuit connection terminal. It is supplied to a counter electrode provided on the counter substrate side through a conductive material. Thus, by generating a vertical electric field between the counter electrode and, for example, a pixel electrode provided in the pixel portion, an electro-optical material such as liquid crystal sandwiched between both substrates can be driven. In particular, in the peripheral region, the counter electrode potential line is located near the edge of the element substrate in the plurality of main wirings. For example, the counter electrode potential line extends from the external connection terminal along the edge of the element substrate. On the other hand, since the peripheral drive circuit is located closer to the center of the element substrate than the vertical conduction terminal and the counter electrode potential line, the planar layout in which the main wiring excluding the counter electrode potential line and the counter electrode potential line do not intersect is compared. Can be obtained easily.

  Preferably, the counter electrode potential line is located closest to the edge of the element substrate among the plurality of main wirings in the peripheral region. As a result, a planar layout in which all the main wirings except the counter electrode potential lines do not intersect with the counter electrode potential lines can be obtained relatively easily.

  In this aspect, the plurality of external circuit connection terminals are arranged along one side of the element substrate, and one of the plurality of external circuit connection terminals is connected to one end of the counter electrode potential line. May be configured to be positioned closer to the end in the array of the plurality of external circuit connection terminals.

  With this configuration, in the peripheral region, the counter electrode potential line extends from the external circuit connection terminal near the edge and is positioned near the edge of the element substrate. Therefore, a planar layout in which the main wiring excluding the counter electrode potential line and the counter electrode potential line do not intersect can be obtained very easily.

  Preferably, the external circuit connection terminal to which one end of the counter electrode potential line is connected is located at the end in the array of the plurality of external circuit connection terminals in the peripheral region. For example, when viewed from the side where a plurality of external circuit connection terminals are arranged, the tip of the counter electrode potential line extending along the right edge of the element substrate is connected to the rightmost external circuit connection terminal. A tip of a counter electrode potential line extending along the left edge of the element substrate is connected to the circuit connection terminal. As a result, even in the peripheral region in the vicinity of the external circuit connection terminal, a planar layout in which all the main wirings except the counter electrode potential line do not intersect with the counter electrode potential line can be obtained relatively easily.

  Alternatively, in another aspect of the electro-optical device of the present invention, the peripheral region on the counter substrate disposed to face the element substrate is further provided with a counter electrode, and the plurality of main wirings are provided in the peripheral region on the element substrate. A counter electrode potential line for supplying a counter electrode potential to the counter electrode which is at least one of the counter electrode, and a vertical conduction terminal for establishing vertical conduction between the counter electrode, and the counter electrode In the peripheral region, the potential line is located closer to the edge of the element substrate than the one or more main wirings excluding the counter electrode potential line, and from one or more main wirings other than the counter electrode potential line Is located near the center of the element substrate, and a part of the peripheral drive circuit is partially closer to the center of the element substrate than the vertical conduction terminal and the counter electrode potential line in the peripheral region. Position, and the other portion of the peripheral driving circuit, in the peripheral region, partially located in the vertical conduction terminal and edge nearer the counter electrode potential line the element substrate than.

  According to this aspect, during the operation, for example, the counter electrode potential is supplied to the vertical conduction terminal provided in the peripheral region via the external circuit connection terminal and the main wiring having one end connected to the external circuit connection terminal. It is supplied to a counter electrode provided on the counter substrate side through a conductive material. Here, in particular, in the peripheral region, the counter electrode potential line is located closer to the edge of the element substrate than one or a plurality of main wirings excluding the counter electrode potential line. On the other hand, in the peripheral region, the counter electrode potential line is located closer to the center of the element substrate than one or more main wirings other than the counter electrode potential line. Therefore, a planar layout in which the main wiring excluding the counter electrode potential line and the counter electrode potential line do not intersect can be obtained relatively easily.

  In this aspect, the plurality of external circuit connection terminals are arranged along one side of the element substrate, and one or more main wirings other than the counter electrode potential line among the plurality of external circuit connection terminals. The external circuit connection terminal to which one end of the external circuit connection terminal is connected may be positioned closer to the end in the array of the plurality of external circuit connection terminals.

  With this configuration, in the peripheral region, the one or more main wirings other than the counter electrode potential line extend from the external circuit connection terminal near the edge and are located near the edge of the element substrate. On the other hand, one or a plurality of main wirings excluding the counter electrode potential line extends from the external circuit connection terminal closer to the center and is positioned closer to the center of the element substrate. Accordingly, a planar layout in which the main wiring excluding the counter electrode potential line and the counter electrode potential line do not intersect can be easily obtained.

  In the various aspects including the counter electrode described above, the plurality of main wirings include a pair of clock signal lines that respectively supply a clock signal and its inverted signal as the electric signal and do not cross the counter electrode potential line. It may be configured.

  If configured in this manner, the clock signal line and the counter electrode potential line, where mutual interference is remarkable if they cross each other, do not cross each other, so that the potential of the clock signal fluctuates according to the fluctuation of the counter electrode potential. Thus, it is possible to effectively avoid the counter electrode potential from fluctuating according to the fluctuation of the potential of the clock signal. As a result, a high-quality image display image becomes possible.

  In another aspect of the electro-optical device of the present invention, the plurality of main wirings supply a pair of clock signal lines for supplying a clock signal and its inverted signal as the electric signal, and a power signal as the electric signal. The pair of signal lines and the power supply wiring do not cross each other.

  According to this aspect, since the clock signal line and the power supply wiring, where the mutual interference is conspicuous if crossed, do not cross, the potential of the clock signal varies according to the variation of the potential of the power signal, It can be effectively avoided that the potential of the signal fluctuates according to the fluctuation of the potential of the clock signal. As a result, a high-quality image display image becomes possible.

  In another aspect of the electro-optical device of the present invention, the plurality of main wirings are laid out in a plane so as to meander while avoiding crossing each other.

  According to this aspect, the meandering of the main wiring avoids a situation in which the main wiring intersects while sacrificing an increase in the wiring length. Here, by reducing the resistance of the same conductive film constituting the main wiring, the wiring resistance according to the wiring length can be kept low, and on the other hand, by not using the relay wiring necessary for crossing You can enjoy the benefits.

  In this aspect, it is preferable to mathematically or geometrically arrange the plane so as to reduce the number of intersections as much as possible, and reduce the number of intersections even if meandering. On the other hand, the above-described sub-wirings may cross each other, so that the main wiring and the sub-wiring can be planarly laid out in the peripheral region while increasing the wiring pitch and avoiding the crossing of the main wiring.

  In another aspect of the electro-optical device according to the aspect of the invention, the plurality of main wirings include at least partially a redundant wiring made of another conductive film formed in a different layer from the same conductive film.

  According to this aspect, by adopting a redundant structure in which the main wiring includes a redundant wiring made of another conductive film formed in a layer different from the wiring portion made of the same conductive film, the wiring resistance of the main wiring is increased. Can be further reduced. In addition, even if one of the two wiring portions forming the redundant structure is disconnected, there is a possibility that the wiring function can be achieved, so that the reliability of the electro-optical device can be improved.

  The electro-optical device of the present invention includes a plurality of external circuit connection terminals in a plurality of pixel units provided in an image display area on an element substrate and a peripheral area positioned around the image display area on the element substrate. A scanning line driving circuit, a data line driving circuit, a scanning line driving circuit wiring having one end connected to the external circuit connecting terminal and the other end connected to the scanning line driving circuit, and the external circuit connecting terminal. A data line driving circuit wiring having one end connected and the other end connected to the data line driving circuit, and an image signal wiring connected to one end of the external circuit connection terminal to supply image signals of the plurality of pixel portions The scanning line driving circuit wiring, the data line driving circuit wiring, and the image signal wiring are planarly laid out in the peripheral region so as not to cross each other.

  In the electro-optical device according to the aspect of the invention, it is preferable that the image signal wiring is disposed between the scanning line driving circuit wiring and the data line driving circuit wiring.

  In the electro-optical device according to another aspect of the invention, the counter electrode may be connected to the peripheral region on the counter substrate disposed to face the element substrate, and the other end may be connected to the external circuit connection terminal. A counter electrode potential line for supplying a counter potential to the counter electrode, and the counter electrode potential line may be disposed so as to surround the scanning line driving circuit wiring.

  In order to solve the above-described problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  Since the electronic apparatus of the present invention includes the above-described electro-optical device of the present invention, a high-quality image display image can be displayed by appropriately supplying various electric signals through the main wiring. Various electronic devices such as electronic notebooks, word processors, viewfinder type or monitor direct-view type video tape recorders, workstations, videophones, POS terminals and touch panels can be realized. Further, as the electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper can be realized.

  Such an operation and other advantages of the present invention will become apparent from the embodiments described below.

1 is a plan view illustrating an overall configuration of an electro-optical device according to an embodiment. It is H-H 'sectional drawing of FIG. FIG. 3 is an equivalent circuit diagram of various elements and wirings in a plurality of pixels formed in a matrix that forms an image display region of the electro-optical device. It is an equivalent circuit diagram showing the configuration of various drive circuits and various signal wirings formed on the TFT array substrate. It is an equivalent circuit diagram showing the configuration of various drive circuits and various signal wirings formed on the TFT array substrate. 4 is a plan view of a plurality of pixel groups adjacent to each other on a TFT array substrate on which data lines, scanning lines, pixel electrodes, and the like are formed in the electro-optical device according to the embodiment of the invention. FIG. It is A-A 'sectional drawing of FIG. FIG. 6 is a B-B ′ sectional view of FIG. 4 or FIG. 5. FIG. 6 is a cross-sectional view taken along the line C-C ′ of FIG. 4 or FIG. 5. It is one sectional drawing of the main wiring and redundant wiring which concern on a deformation | transformation form. It is other sectional drawing of the main wiring and redundant wiring which concern on a deformation | transformation form. 1 is a schematic cross-sectional view showing a color liquid crystal projector as an example of a projection type color display device which is an embodiment of an electronic apparatus of the present invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the electro-optical device of the present invention is applied to a TFT active matrix driving type liquid crystal device.

(Overall configuration of electro-optical device)
First, the overall configuration of the electro-optical device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the overall configuration of the electro-optical device according to this embodiment, and FIG. 2 is a cross-sectional view taken along line HH ′ of FIG. Here, a TFT active matrix driving type liquid crystal device with a built-in driving circuit, which is an example of an electro-optical device, is taken as an example.

  1 and 2, in the electro-optical device according to the present embodiment, a TFT array substrate 10 and a counter substrate 20 are disposed to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are provided with a sealing material provided in a seal region 52a located around the image display region 10a. 52 are bonded to each other.

  The sealing material 52 is made of, for example, a photo-curing resin, a thermosetting resin, or the like for bonding both substrates, and after being applied on the TFT array substrate 10 in the manufacturing process, it is cured by ultraviolet irradiation, heating, or the like. Is. Further, in the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the distance between the TFT array substrate 10 and the counter substrate 20 (inter-substrate gap) to a predetermined value is dispersed. However, instead of or in addition to spraying in the sealing material 52 as described above, the gap material may be sprayed in the liquid crystal layer 50 in the case of a particularly large electro-optical device.

  A light-shielding frame light-shielding film 53 that defines the frame area of the image display area 10a is provided on the counter substrate 20 side in parallel with the inside of the seal area 52a in which the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  In the present embodiment, a peripheral area is defined around the image display area 10a. That is, when viewed from the center of the TFT array substrate 10, a portion closer to the edge than the frame light shielding film 53 is defined as a peripheral region.

  In the peripheral region, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 (that is, the lower side in FIG. 1) in the region located outside the seal region 52a. Yes. The scanning line driving circuit 104 is provided so as to be covered with the frame light-shielding film 53 along two sides adjacent to the one side (that is, both the left and right sides in FIG. 1). Further, in order to connect the two scanning line driving circuits 104 provided on both sides of the image display area 10a in this way, the remaining light is shielded along the remaining side of the TFT array substrate 10 (that is, the upper side in FIG. 1). A plurality of wirings 105 are provided so as to be covered with the film 53. Particularly in the present embodiment, a plurality of main wirings 108 each having one end connected to the external circuit connection terminal 102 are wired in the peripheral region. The other end of the main wiring 108 is connected to the data line driving circuit 101, the scanning line driving circuit 104, and the like. The circuit configuration and operation on the TFT array substrate 10 and the planar layout of the main wiring 108 will be described in detail later.

  In FIG. 2, on the TFT array substrate 10, an alignment film is formed on the pixel electrode 9a after the pixel switching TFT, the scanning line, the data line and the like are formed. On the other hand, on the counter substrate 20, in addition to the counter electrode 21, a lattice-shaped or striped light-shielding film 23 and an alignment film are formed on the uppermost layer portion. Further, the liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  In FIG. 1, vertical conduction terminals 106 t connected to a counter electrode potential line which is one of main wirings 108 laid out on the TFT array substrate 10 are provided near the four corners of the TFT array substrate 10. It has been. A vertical conduction member 106 is disposed on each of the vertical conduction terminals 106t. The vertical conduction member 106 is in surface contact with the four corners of the counter electrode 21, and is configured to supply the counter electrode potential from the external circuit connection terminal 102 to the counter electrode 21 via the main wiring 108.

(Configuration of pixel part)
Next, the configuration of the pixel portion of the electro-optical device according to the present embodiment will be described with reference to FIG. FIG. 3 is an equivalent circuit of various elements, wirings, and the like in a plurality of pixels formed in a matrix that forms the image display area of the electro-optical device.

  In FIG. 3, the pixel electrodes 9a and the pixel electrodes 9a are respectively subjected to switching control in a plurality of pixel portions formed in a matrix in the image display region 10a (see FIG. 1) of the electro-optical device according to the present embodiment. The TFT 30 is formed, and a data line 6a to which image signals S1, S2,..., Sn described later are supplied is electrically connected to the source of the TFT 30.

  Further, the scanning line 3a is electrically connected to the gate of the TFT 30, and the scanning signals G1, G2,..., Gm are applied to the scanning line 3a in a pulse-sequential manner in this order at a predetermined timing. It is configured. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the image signal S1, S2,..., Sn supplied from the data line 6a is obtained by closing the switch of the TFT 30 as a switching element for a certain period. Write at a predetermined timing.

  Image signals S1, S2,..., Sn written in a liquid crystal as an example of an electro-optical material via the pixel electrode 9a are held for a certain period with the counter electrode 21 formed on the counter substrate. . The liquid crystal modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. In the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel, and in the normally black mode, the light is incident according to the voltage applied in units of each pixel. The light transmittance is increased, and light having a contrast corresponding to the image signal is emitted from the electro-optical device as a whole.

  In order to prevent the image signal held here from leaking, a storage capacitor 70 is added in parallel with the liquid crystal capacitor formed between the pixel electrode 9a and the counter electrode 21 (see FIGS. 1 and 2). The storage capacitor 70 is provided side by side with the scanning line 3a, and includes a fixed potential side capacitor electrode and a capacitor line 300 having a predetermined potential. The storage capacitor 70 improves the charge retention characteristics of each pixel electrode. Note that the potential of the capacitor line 300 may be constantly fixed to one voltage value, or may be fixed while being swung to a plurality of voltage values at a predetermined period.

  Next, the circuit configuration on the TFT array substrate of the electro-optical device according to this embodiment and the planar layout of the main wiring will be described with reference to FIGS. 4 and 5. FIG. 4 is an equivalent circuit diagram showing the configuration of various drive circuits and various signal lines formed on the TFT array substrate. FIG. 5 is an equivalent circuit diagram showing configurations of various drive circuits and various signal wirings more specifically showing FIG. In the following description, a signal name input to the TFT array substrate 10 via the external circuit connection terminal 102 and its signal wiring are referred to by giving the same alphabetical symbol after the signal and the wiring L, respectively. . That is, for example, for the signal name “clock signal CLX”, the signal wiring is referred to as “clock signal line LCLX”.

  As shown in FIGS. 4 and 5, on the TFT array substrate 10, a data line driving circuit 101 and a sampling circuit 301 that constitute an example of a means for supplying an image signal to the data line 6a as a driving circuit of the electro-optical device. And a scanning line driving circuit 104 that constitutes an example of means for supplying a scanning signal to the scanning line 3a. In addition, an external circuit connection terminal 102 including a plurality of terminals for inputting various signals supplied to these drive circuits from the external control circuit is formed along one side of the TFT array substrate 10 (FIG. 1). A main wiring 108 is provided from the external circuit connection terminal 102.

  The data line driving circuit 101 includes a shift register circuit 101a, a waveform selection circuit 101b, and a buffer circuit 101c as main components.

The shift register circuit 101a uses a negative power source VSSX and a positive power source VDDX supplied from the external control circuit via the external circuit connection terminal 102 and the main line 108 via the wiring LVSSX and the wiring LVDDX as power sources. The transfer operation is started in response to the supplied start signal SPX. Subsequently, the clock signal CLX and the reverse phase clock signal CLX _INV for the shift register circuit 101a supplied through the external circuit connection terminal 102 and the clock signal line LCLX and the reverse phase clock signal line LCLX _INV of the main wiring 108. The transfer signal is sequentially output to the waveform selection circuit 101b at a predetermined timing.

  The waveform selection circuit 101b is also referred to as an “enable circuit”, and the pulse widths of the transfer signals sequentially output from the shift register circuit 101a are set as the enable signals ENB1 to ENB4 input from the external control circuit via the external circuit connection terminal 102. Each sampling period is defined in the sampling circuit 301 to be described later. More specifically, the waveform selection circuit 101b includes, for example, a NAND circuit and an inverter provided corresponding to each stage of the above-described shift register circuit 101a, and outputs sequentially from the shift register circuit 101a. Selection control of the waveform on the time axis so that the data line 114 is driven only when the transfer signal to be transmitted is at a high level and one of the enable signals ENB1 to ENB4 is at a high level. I do.

  The buffer circuit 101c buffers the transfer signal for which the waveform has been selected in this way, and then supplies it to the sampling circuit 301 via the sampling circuit drive signal line 114 as a sampling circuit drive signal. The buffer circuit 101c may perform signal processing such as level shift processing and inverting processing.

  The sampling circuit 301 includes a plurality of TFTs 202 which are examples of switching circuit elements for sampling an image signal. However, this switching circuit element is a first conductive channel type TFT as shown in the figure, and may be an n channel type TFT or a p channel type TFT. Further, it may be constituted by a complementary TFT or the like. 3 is connected to the drain of the TFT 202 in FIG. 3, the image signal line 115 is connected to the source of the TFT 202 via the lead-out wiring 116, and the gate of the TFT 202 is connected to the gate of the TFT 202. A sampling circuit drive signal line 114 connected to the data line drive circuit 101 is connected. The image signals VID1 to VID6 on the image signal line 115 are sampled by the sampling circuit 301 in response to the sampling circuit drive signal supplied from the data line drive circuit 101 through the sampling circuit drive signal line 114, and each data It is configured to be supplied to the line 6a.

  The image signals S1, S2,..., Sn supplied from the external circuit connection terminal 102 via the main wiring 108 and written to the data line 6a by the sampling circuit 301 as described above may be supplied line-sequentially in this order. In this embodiment, the image signals S1, S2,..., Sn correspond to each of the image signals VID1 to VID6 that are serial-parallel-developed in six phases, with respect to a set of six data lines 6a. It is configured to be supplied for each group. Note that the number of phase expansions of the image signal is not limited to six phases. For example, the number of image signals expanded in a plurality of phases, such as nine phases, twelve phases, and twenty-four phases, corresponds to the number of expansions. You may comprise so that it may supply with respect to the group of the data line 6a made into one set.

The scan line driver circuit 104 includes a shift register circuit and a buffer circuit as components. Then, the negative power supply VSSY and the positive power supply VDDY supplied from the external control circuit via the external circuit connection terminal 102 and the main wiring 108 via the wiring LVSSY and the wiring LVDDY are used as power supplies, and the start is also supplied from the external control circuit. In response to the signal SPY, the transfer operation of the built-in shift register circuit is started. Subsequently, the clock signal CLY and the anti-phase clock signal CLY _INV for the built-in shift register circuit, which are supplied via the external circuit connection terminal 102 and the clock signal line LCLY and the anti-phase clock signal line LCLY _INV of the main wiring 108. Based on the above, a scanning signal is applied in a pulse-sequential manner to the scanning line 3a at a predetermined timing.

  On the TFT array substrate 10, a counter electrode potential line LLCCOM, which is one of the main wirings 108, is connected to the vertical conduction terminal 106 t and passes through the four corners on the TFT array substrate 10. Wired. Then, a predetermined potential is supplied to the counter electrode 21 via the vertical conductive member 106, the vertical conductive terminal 106t, and the counter electrode potential line LLCCOM. By supplying these potentials, the liquid crystal sandwiched between the pixel electrode 9a and the counter electrode 21 as described above can be driven.

  In the present embodiment, in particular, the scanning line driving circuit 104 is disposed inside the seal region 52a shown in FIG. That is, in FIG. 4 and FIG. 5, the counter electrode potential line LLCCOM that passes through the four vertical conduction terminals 106 t and is routed along the edge of the TFT array substrate 10 so as to surround the image display region 10 a and various drive circuits. It is arranged near the center of the TFT array substrate 10. By arranging in this way, the space of the peripheral area on the TFT array substrate 10 can be reduced as compared with the case where the scanning line driving circuit 104 is arranged outside the seal area 52a in the peripheral area and the device. The overall size is reduced, and a group of a plurality of main wirings 108a including various signal wirings leading to the counter electrode potential line LLCCOM and the scanning line driving circuit 104 and various signal wirings leading to the data line driving circuit 101 are arranged. A group of a plurality of main wirings 108b included can be planarly laid out without crossing each other. In addition, the main wiring 108a leading to the scanning line driving circuit 104 can be planarly laid out without crossing between the groups. Further, even between groups of main wirings 108b leading to the data line driving circuit 101, without crossing each other except for the crossing portions necessary for connection to the shift register 101a, the waveform shaping circuit 101b, and the buffer circuit 101c. Planar layout is possible. In addition, the main wiring 108c leading to the sampling circuit 301, that is, the image signal line 115 can be planarly laid out without crossing each other except for an intersection necessary for connection to the sampling circuit 301.

(External circuit connection terminal and signal wiring arrangement)
Next, the detailed configuration of the external circuit connection terminal 102 and various signal wirings connected to the external circuit connection terminal 102 will be described below with reference to FIGS. In the following description, the name of a signal input into the TFT array substrate 10 via the external circuit connection terminal 102 and the input terminal are referred to by giving the same alphabetical symbol after the signal and the terminal T, respectively. . That is, for example, the input terminal of the signal name “clock signal CLX” is referred to as “terminal TCLX”.

As described above, the external circuit connection terminal 102 provided along one side of the TFT array substrate 10 is used for four purposes of the counter electrode potential line, the scanning line driving circuit, the image signal, and the data line driving circuit. A plurality of terminal groups that are broadly classified are provided. More specifically, the external circuit connection terminal 102 includes the terminal TLCCOM for the counter electrode potential line LLCCOM, the terminal TSPY, the terminal TVSSY, the terminal TVDDY, the terminal TCLX, the terminal TCLX _INV , and the image signals VID1 to VSC1 for the scanning line driving circuit 104. terminal TVID1~TVID6 for the VID6, and terminal TVSSX for the data line driving circuit 101, terminal TSPX, terminal TVDDX, terminal TCLX, and is configured to include terminal TCLX _INV, terminals TENB1～TENB4, and terminal TVSSX.

  In this embodiment, particularly, as shown in FIGS. 4 and 5, the two terminals TLCCOM for supplying the counter electrode potential LCCOM among the external circuit connection terminals 102 are arranged at both ends of the right end and the left end. Yes. The counter electrode potential line LLCCOM connected at both ends to the two terminals TLCCOM is connected to the four vertical conduction terminals 106t as described above and wired so as to surround the outer periphery of the seal region 52a. Note that the number of upper and lower conductive terminals 106t may be one.

Next, the terminal TCLY, the terminal TCLY _INV , the terminal TVDDY, and the terminal TSPY for driving the scanning line driving circuit 104 are arranged in this order from the right side after the terminal TLCCOM arranged at both ends. On the other hand, from the left side, a terminal TSPY and a terminal TVSSY for driving the scanning line driving circuit 104 are also arranged in this order.

By arranging and arranging the terminal TLCCOM for the counter electrode potential line and the terminal group for the scanning line driving circuit 104 in such a positional relationship, a plurality of main wirings connected to the terminal group for the scanning line driving circuit 104 are arranged. 108a, that is, a plurality of signal wirings for driving the scanning line driving circuit 104 are all arranged inside the counter electrode potential line LLCCOM connected to the terminal TLCCOM (that is, closer to the center of the TFT array substrate 10). Is possible. As shown in FIG. 5, the clock signal line LCLY, the antiphase clock signal line LCLY _INV and the wiring LVDDY which is a constant potential line are electrically connected to the left and right scanning line driving circuits 104 from the right side in the figure. In this manner, they are arranged outside the right scanning line driving circuit 104 and the left scanning line driving circuit 104 and along the inside of the counter electrode potential line LLCCOM. That is, when the scanning line driving circuit 104 is disposed inside the seal region 52a as in the present embodiment, the counter electrode potential line LLCCOM and the signal wiring for driving the scanning line driving circuit 104 described above. The group does not intersect on the substrate plane. Therefore, the counter electrode potential line LLCCOM and the signal wiring group 108a for driving the scanning line driving circuit 104 can be formed as the same wiring layer formed simultaneously in these manufacturing process steps.

  Temporarily forming the counter electrode potential line LLCCOM and the signal wiring group for the scanning line driving circuit 104 by separate wiring layers with an interlayer insulating film or the like interposed therebetween so as to intersect with each other in plan view. In particular, there is a possibility that problems such as interference with each other due to noise of signals generated from the respective signal wirings may occur at the intersection. On the other hand, as described above, in the present embodiment, the counter electrode potential line LLCCOM and the signal wiring group for the scanning line driving circuit 104 are formed in the same wiring layer without intersecting in plan view. Therefore, such a problem is prevented in advance.

  In addition, it is assumed that the terminal TLCCOM, which is the external circuit connection terminal 102 for supplying the counter electrode potential LCCOM, and the terminal group for driving the scanning line driving circuit 104 are opposite to those shown in FIG. 4 or FIG. If the terminals TLCCOM are located closer to the center, the wirings connected to the respective terminals need to cross each other on the substrate plane, and any of the main wirings 108 is connected to the middle. Therefore, it is necessary to take measures such as switching to another wiring layer. In this case, separate wiring layers are connected to each other, for example, through contact holes or the like drilled in an interlayer insulating film, thereby complicating the manufacturing process. There is a high possibility that problems such as increased resistance will occur. On the other hand, by adopting the arrangement configuration of the external circuit connection terminals 102 as shown in FIGS. 4 and 5 as in this embodiment, that is, by arranging the terminal TLCCOM closer to the end, the counter electrode potential line The plurality of main wirings 108a for driving the LLCCOM and the scanning line driving circuit 104 can be formed relatively easily in the manufacturing process, and problems such as signal delay due to wiring resistance are preferably prevented. Will be.

  When the scanning line driving circuit 104 is formed in a region outside the seal region 52a, the terminal TLCCOM that supplies the counter electrode potential and the terminal group for the scanning line driving circuit 104 are used in the above example. On the other hand, they may be arranged oppositely so that they do not cross each other on the substrate plane. By configuring in this way, as in the case described above, the main wirings 108 do not cross each other on the substrate plane, and it is possible to prevent an increase in wiring resistance due to switching. There is no.

  In this embodiment, the main electrode 108a for driving the counter electrode potential line LLCCOM and the scanning line driving circuit 104 is preferably made of a low-resistance metal film or alloy film containing aluminum or the like. With this configuration, the time constants of these signal wirings can be lowered, and signal delay due to wiring routing can be prevented. In addition, if the main wiring 108a is formed of a low-resistance metal film or alloy film, it is easy to adopt a configuration in which a plurality or a plurality of main wirings 108 including the counter electrode potential line LLCCOM meander so as not to cross each other. It becomes. That is, the wiring length increases due to meandering, and the wiring resistance increases accordingly. However, by forming from a low-resistance metal film or alloy film, the disadvantage caused by meandering is hardly or not obvious. On the contrary, since the crossing of the main wirings 108 can be avoided by meandering, a larger number of main wirings 108 can be planarly laid out in a limited peripheral region.

Further, in the external circuit connection terminal 102, from the left side following the terminal TSSPY and the terminal TVSSY for the scanning line driving circuit 104, the image signal terminals TVID1 to TVID6, the terminal TVSSX for the data line driving circuit 101, the terminal TSPX, the terminal TVDDX, terminal TCLX, terminal TCLX _INV , terminals TENB1 to TENB4, and terminal TVSSX are arranged in this order.

  Here, the six image signal lines 115 that are the main wirings 108c connected to the terminals TVID1 to TVID6 do not intersect with each other on the substrate plane and are connected to the external circuit connection terminal 102. All of the signal wirings are wired up to a region between the sampling circuit 301 and the data line driving circuit 101 without crossing each other on the substrate plane. Specifically, the image signal line 115 is arranged between the wiring LVSSY of the main wiring 108 a for driving the scanning line driving circuit 104 and the wiring LVSSX of the main wiring 108 b for driving the data line driving circuit 101. . Each image signal line 115 is connected to the lead wiring 116 through a contact hole (not shown) in order to be electrically connected to each sampling circuit 301. The lead-out wiring 116 is arranged so as to intersect with the other image signal lines 115.

In addition, a plurality of main wirings 108b connected to each terminal for the data line driving circuit, that is, a wiring LVSSX that is a constant potential line and a wiring LVDDX that is a constant potential line, a start signal line LSPX, a clock signal line LCLX, and an opposite phase The clock signal line LCLX _INV and the enable signal lines LENB1 to LENB4 also do not intersect with each other on the substrate plane and are connected to any other main wiring 108 connected to the external circuit connection terminal 102. Wiring is performed so as to reach the data line driving circuit 101 without intersecting on the substrate plane. Specifically, the wiring LVSSX is arranged inside the main wiring 108 a and the main wiring 108 c and so as to surround the data line driving circuit 101. The start signal line LSPX, the clock signal line LCLX, the anti-phase clock signal line LCLX _INV , and the enable signal lines LENB1 to LENB4, which are the other main wirings 108b, are arranged inside the wiring LVSSX. The shift register 101a, the waveform shaping circuit 101b, and the buffer circuit 101c of the data line driving circuit 101 are connected to the lead wiring through a contact hole for electrical connection. The lead-out wiring is arranged so as to intersect with the other main wiring 108b.

  Since the external circuit connection terminals 102 are arranged as described above, according to the present embodiment, the plurality of main wirings 108 connected to the respective terminals are wired without intersecting on the substrate plane. Thus, all the main wirings 108 connected to the external circuit connection terminals 102 can be formed as the same wiring layer formed simultaneously in these manufacturing process steps. For this reason, it is possible to simplify the manufacturing process. Moreover, as already described, it is possible to prevent problems such as interference between the intersecting main wirings 108, and to prevent problems such as contact resistance generated in contact holes in the middle of wiring and signal delays due to wiring resistance. It is also possible to prevent it.

In the present embodiment, the image signal terminals TVID1 to TVID6 are preferably arranged so that both sides thereof are sandwiched between terminals for constant potential lines or signal wirings belonging to a low frequency control signal, and high frequency control is performed. They are arranged as far as possible from the signal wiring terminals belonging to the signals. More specifically, as shown in FIG. 4 or 5, the image signal terminals TVID <b> 1 to TVID <b> 6 are arranged so as to be sandwiched between the terminal TVSSY and the terminal TVSSX for constant potential lines, and the data lines They are arranged at positions distant from wiring terminals TCLX _INV , terminals TCLX, and terminals TENB 1 to TENB 4 belonging to the high-frequency control signal for driving the drive circuit 101. In general, electromagnetic waves decrease in accordance with the distance and the presence of an obstacle. Therefore, the arrangement of the present embodiment makes it possible to reduce the jumping of high-frequency clock noise or the like into the image signal line 115. That is, the image signal line 115 is arranged at a distance from the high-frequency control signal wiring group to reduce the influence of noise, and is electrically shielded from the high-frequency control signal wiring by the interposition of a constant potential line. It has become a form. Accordingly, it is possible to maintain high-quality image display without deterioration of image quality due to the influence of noise.

(Detailed configuration of pixel unit)
Hereinafter, an actual configuration of the pixel portion of the electro-optical device in which the circuit operation as described above is realized by the data line 6a, the scanning line 3a, the TFT 30, and the like will be described with reference to FIGS. FIG. 6 is a plan view of a plurality of pixel groups adjacent to each other on the TFT array substrate on which the data lines, scanning lines, pixel electrodes, and the like are formed in the electro-optical device of this embodiment. FIG. It is -A 'sectional drawing.

  In FIG. 6, a plurality of pixel electrodes 9a are provided in a matrix on the TFT array substrate 10 (the outline is indicated by a dotted line portion 9a ′), and data along the vertical and horizontal boundaries of the pixel electrode 9a is provided. Line 6a and scanning line 3a are provided. The data line 6a is made of, for example, a metal film such as an aluminum film or an alloy film, and the scanning line 3a is made of, for example, a conductive polysilicon film. Further, the scanning line 3a is disposed so as to face the channel region 1a 'indicated by the hatched region rising to the right in the drawing in the semiconductor layer 1a, and the scanning line 3a functions as a gate electrode. In other words, each of the intersections of the scanning lines 3a and the data lines 6a is provided with a pixel switching TFT 30 in which the main line portion of the scanning line 3a is disposed opposite to the channel region 1a 'as a gate electrode.

  As shown in FIG. 7, the electro-optical device includes a transparent TFT array substrate 10 and a transparent counter substrate 20 disposed to face the TFT array substrate 10. The TFT array substrate 10 is made of, for example, a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of, for example, a glass substrate or a quartz substrate. A pixel electrode 9a is provided on the TFT array substrate 10, and an alignment film 16 that has been subjected to a predetermined alignment process such as a rubbing process is provided above the pixel electrode 9a. Among these, the pixel electrode 9a is made of a transparent conductive film such as an ITO (Indium Tin Oxide) film. On the other hand, a counter electrode 21 is provided over the entire surface of the counter substrate 20, and an alignment film 22 subjected to a predetermined alignment process such as a rubbing process is provided below the counter electrode 21. Among these, the counter electrode 21 is made of a transparent conductive film such as an ITO film, for example, and the alignment films 16 and 22 are made of a transparent organic film such as a polyimide film, for example, in the same manner as the pixel electrode 9a. The liquid crystal layer 50 takes a predetermined alignment state by the alignment films 16 and 22 in a state where an electric field from the pixel electrode 9a is not applied.

  As shown in FIG. 7, the TFT 30 has an LDD (Lightly Doped Drain) structure, and, as described above, the scanning line 3a functioning as a gate electrode, for example, a polysilicon film is used as a constituent element. The channel region 1a ′ of the semiconductor layer 1a in which a channel is formed by an electric field from 3a, the insulating film 2 including a gate insulating film that insulates the scanning line 3a from the semiconductor layer 1a, the low-concentration source region 1b in the semiconductor layer 1a, and the low A concentration drain region 1c, a high concentration source region 1d, and a high concentration drain region 1e are provided.

  The TFT 30 preferably has an LDD structure as shown in FIG. 7, but may have an offset structure in which impurities are not implanted into the low concentration source region 1b and the low concentration drain region 1c, or a part of the scanning line 3a. A self-aligned TFT may be used in which a high concentration source region and a high concentration drain region are formed in a self-aligned manner by implanting impurities at a high concentration using a gate electrode made of In the present embodiment, only one gate electrode of the pixel switching TFT 30 is disposed between the high-concentration source region 1d and the high-concentration drain region 1e. However, two or more gates are interposed between these gate electrodes. An electrode may be arranged. If the TFT is configured with dual gates or triple gates or more in this way, leakage current at the junction between the channel and the source and drain regions can be prevented, and the off-time current can be reduced. Further, the semiconductor layer 1a constituting the TFT 30 may be a non-single crystal layer or a single crystal layer. A known method such as a bonding method can be used for forming the single crystal layer. By making the semiconductor layer 1a a single crystal layer, it is possible to improve the performance of peripheral circuits in particular.

  On the other hand, in FIG. 7, the storage capacitor 70 includes a relay layer 71 as a pixel potential side capacitor electrode connected to the high concentration drain region 1e of the TFT 30 and the pixel electrode 9a, and a capacitor line 300 as a fixed potential side capacitor electrode. A part thereof is formed so as to be opposed to each other through the dielectric film 75.

  The capacitor line 300 includes, for example, at least one of refractory metals such as Ti (titanium), Cr (chromium), W (tungsten), Ta (tantalum), and Mo (molybdenum). It consists of silicide, polysilicide, or a laminate of these. Alternatively, it can be formed from an Al (aluminum) film.

  The relay layer 71 is made of, for example, a conductive polysilicon film and functions as a pixel potential side capacitor electrode. However, the relay layer 71 may be composed of a single layer film or a multilayer film containing a metal or an alloy, similarly to the capacitor line 300 described later. The relay layer 71 has a function of relaying and connecting the pixel electrode 9a and the high-concentration drain region 1e of the TFT 30 via the contact holes 83 and 85, in addition to the function as a pixel potential side capacitor electrode.

  The capacitor line 300 functions as a fixed potential side capacitor electrode disposed to face the relay layer 71. When viewed in a plan view, the capacitor line 300 is formed so as to overlap the region where the scanning line 3a is formed, as shown in FIG. More specifically, the capacitor line 300 includes a main line portion that extends along the scanning line 3a, a protruding portion that protrudes upward along the data line 6a from each location that intersects the data line 6a, and a contact hole. A portion corresponding to 85 is provided with a constricted portion slightly constricted. Of these, the protruding portion contributes to an increase in the formation region of the storage capacitor 70 using the region above the scanning line 3a and the region below the data line 6a. In addition, the capacitor line 300 preferably extends from the image display region 10a where the pixel electrode 9a is disposed to the periphery thereof, and is electrically connected to a constant potential source to be a fixed potential. As such a constant potential source, for example, a constant potential source such as a positive power supply VDDX or a negative power supply VSSX supplied to the data line driving circuit 101 as described above may be used, or supplied to the counter electrode 21 of the counter substrate 20. The counter electrode potential LCCOM may be used.

  As shown in FIG. 7, the dielectric film 75 is, for example, a relatively thin silicon oxide film such as an HTO (High Temperature Oxide) film, an LTO (Low Temperature Oxide) film, or a silicon nitride film having a thickness of about 5 to 200 nm. Consists of From the viewpoint of increasing the storage capacitor 70, the thinner the dielectric film 75 is, the better as long as the reliability of the film is sufficiently obtained.

  6 and 7, in addition to the above, a lower light-shielding film 11 a is provided below the TFT 30. The lower light-shielding film 11a is patterned in a lattice pattern, thereby defining an opening area of each pixel. The lower light-shielding film 11a is composed of a single layer film or a multilayer film containing a metal or an alloy, like the capacitance line 300 described above. The opening area is also defined by the data line 6a in FIG. 6 and the capacitor line 300 formed so as to intersect with the data line 6a. Similarly to the case of the capacitance line 300, the lower light-shielding film 11a is also extended from the image display area to the periphery thereof in order to prevent the potential fluctuation from adversely affecting the TFT 30. It may be connected to a potential source.

  A base insulating film 12 is provided under the TFT 30. In addition to the function of interlayer insulating the TFT 30 from the lower light-shielding film 11a, the base insulating film 12 is formed on the entire surface of the TFT array substrate 10 so that the surface of the TFT array substrate 10 is roughened during the surface polishing or remains after cleaning. For example, the pixel switching TFT 30 has a function of preventing characteristic changes.

  In addition, a first interlayer insulating film 41 in which a contact hole 81 leading to the high-concentration source region 1d and a contact hole 83 leading to the high-concentration drain region 1e are respectively formed on the scanning line 3a is formed.

  A relay layer 71 and a capacitor line 300 are formed on the first interlayer insulating film 41, and a contact hole 81 that leads to the high-concentration source region 1d and a contact hole 85 that leads to the relay layer 71 are formed on each of them. An opened second interlayer insulating film 42 is formed.

  In addition, data lines 6a are formed on the second interlayer insulating film 42, and a third interlayer insulating film 43 in which a contact hole 85 leading to the relay layer 71 is formed is formed thereon. Yes.

(Cross-sectional configuration of signal wiring)
Next, in correspondence with the cross-sectional structure of the pixel portion described with reference to FIG. 7, the cross-sectional configuration of various signal wirings connected to the external circuit connection terminals according to the present embodiment will be described below. 8 is a cross-sectional view taken along the line BB ′ of FIG. 4 or FIG. 5, and FIG. 9 is a cross-sectional view taken along the line CC ′ of FIG. 4 or FIG.

As shown in FIG. 8, all of the main wirings 108 connected to the terminals TCLV _INV to TLCCOM corresponding to the right half of the plurality of terminals of the external circuit connection terminal 102 shown in FIG. 4 or FIG. On the second interlayer insulating film 42 shown, they are configured as the same wiring layer that is simultaneously formed in the manufacturing process stage. On the other hand, as shown in FIG. 9, among the plurality of terminals of the external circuit connection terminal 102, the main wiring 108 connected to the terminal TVDDX to the terminal TLCCOM corresponding to the remaining half of the left side shown in FIG. On the second interlayer insulating film 42 shown in FIG. 7, the same wiring layers are formed at the same time in the manufacturing process. That is, all the main wirings 108 connected to the external circuit connection terminals 102 are the same wiring formed simultaneously with the wiring layer of the data line 6a formed on the second interlayer insulating film described above with reference to FIG. Configured as a layer. This is because the terminals of the external circuit connection terminals 102 are arranged in the order shown in FIG. 4 or FIG. 5, and the main wirings 108 connected to these terminals do not cross each other on the substrate plane. Has been realized.

  As described above, since the various main wirings 108 connected to the external circuit connection terminal 102 can be configured as the same wiring layer, they can be formed relatively easily in these manufacturing processes. Since it can be configured as the same wiring layer as the data line 6a, the manufacturing process can be further simplified. In addition, since the data line 6a is made of a low-resistance metal film such as an aluminum film or an alloy film as described above, various main wirings 108 connected to the external circuit connection terminal 102 formed at the same time are used. However, it can be configured as a low-resistance signal wiring, and it is possible to prevent problems such as signal delay.

(Deformation)
Next, a modification of the above-described embodiment will be described with reference to FIGS. 10 and 11 are cross-sectional views of the main wiring and the redundant wiring according to the modification, respectively, and FIG. 10 is a cross-section perpendicular to the extending direction thereof, that is, FIG. 4 or FIG. FIG. 11 is a cross-sectional view taken along a section corresponding to the CC ′ cross section, and FIG. 11 is a cross-sectional view taken along a cross section along the extending direction.

  As shown in FIGS. 10 and 11, in the modification, the plurality of main wirings 108, LVDDX, LSPX, LVSSX, etc., each formed from an aluminum film or the like as in FIG. The redundant wiring 600 is a separate layer from the main wiring 108 and is formed of the same conductive film as the capacitor line 300 such as a refractory metal film. In addition, each redundant wiring 600 extends so as to overlap with the corresponding main wiring 108 in a plan view, and is formed so as to have a planar layout substantially the same as that of the main wiring 108 in a region having a redundant structure. . Further, the redundant wiring 600 is electrically connected to the corresponding main wiring 108 through a plurality of contact holes 601 and functions as a redundant wiring of the connected main wiring 108. About another structure, it is the same as that of the above-mentioned embodiment demonstrated with reference to FIGS.

  Therefore, according to this modification, the wiring resistance of the main wiring 108 can be further reduced by adopting the redundant structure. In addition, even if one of the main wiring 108 and the redundant wiring having a redundant structure is disconnected, there is still a possibility that the function as the wiring can be achieved, so that the possibility that the device becomes defective can be reduced. It is also possible to improve the yield.

(Electronics)
Next, an overall configuration, particularly an optical configuration, of an embodiment of a projection color display device as an example of an electronic apparatus using the electro-optical device described in detail as a light valve will be described. FIG. 12 is a schematic cross-sectional view of the projection type color display device.

  In FIG. 12, a liquid crystal projector 1100, which is an example of a projection type color display device according to the present embodiment, prepares three liquid crystal modules including a liquid crystal device having a drive circuit mounted on a TFT array substrate, each of which is a light valve for RGB. It is configured as a projector used as 100R, 100G, and 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, the light components R, G, and R corresponding to the three primary colors of RGB are obtained by three mirrors 1106 and two dichroic mirrors 1108. The light is divided into B and led to the light valves 100R, 100G and 100B corresponding to the respective colors. In particular, the B light is guided through a relay lens system 1121 including an incident lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are synthesized again by the dichroic prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification. Devices and electronic devices are also included in the technical scope of the present invention.

  DESCRIPTION OF SYMBOLS 10 ... TFT array substrate, 10a ... Image display area, 20 ... Counter substrate, 21 ... Counter electrode, 50 ... Liquid crystal layer, 52 ... Sealing material, 52a ... Seal area, 70 ... Storage capacity, 101 ... Data line drive circuit, 102 DESCRIPTION OF SYMBOLS ... External circuit connection terminal, 104 ... Scanning line drive circuit, 106 ... Vertical conduction material, 106t ... Vertical conduction terminal, 108 ... Main wiring, 300 ... Capacitance line.

Claims (9)

An element substrate;
A counter substrate bonded to the element substrate via a sealing material;
A frame light-shielding film provided to surround the image display area inside the sealing material;
A pixel electrode provided in a pixel portion of the image display region and a counter electrode facing the pixel electrode;
A plurality of external circuit connection terminals arranged in a first direction along a first side of the element substrate;
A data line driving circuit between the plurality of external circuit connection terminals and the image display region;
A scanning line driving circuit disposed along a second side intersecting the first side of the element substrate and disposed so as to overlap the frame light shielding film;
A counter electrode potential line connected to a first external circuit connection terminal of the plurality of external circuit connection terminals and supplying a counter electrode potential to the counter electrode;
A scanning line driving circuit wiring connecting a second external circuit connecting terminal of the plurality of external circuit connecting terminals and the scanning line driving circuit ;
An image signal line for supplying an image signal input from a third external circuit connection terminal among the plurality of external circuit connection terminals;
The counter electrode potential line, the scanning line driving circuit wiring, and the image signal line extend in the first direction between the data line driving circuit and the first side of the element substrate, respectively, and the data Extending between a line drive circuit and the second side of the element substrate in a second direction intersecting the first direction,
The counter electrode potential line is disposed on the edge side of the element substrate with respect to the scanning line driving circuit wiring, and the scanning line driving circuit wiring is disposed between the counter electrode potential line and the image signal line. electro-optical apparatus characterized by being. A data line drive circuit wiring for connecting a fourth external circuit connection terminal of the plurality of external circuit connection terminals and the data line drive circuit;
2. The electro-optical device according to claim 1, wherein the image signal line is disposed between the scanning line driving circuit wiring and the data line driving circuit wiring.   2. The electro-optical device according to claim 1, wherein the first external circuit connection terminal is disposed closer to a second side of the element substrate than the second external circuit connection terminal.   The electro-optical device according to claim 2, wherein the second external circuit connection terminal is disposed between the first external circuit connection terminal and the third external circuit connection terminal. The wiring scanning line driver circuit, a clock signal and said any one of to include a pair of clock signal lines do not cross the counter electrode potential line from claim 1, wherein 4 with the respective supply the inverted signal The electro-optical device according to 1. The scanning line driving circuit wiring includes a pair of clock signal lines for supplying a clock signal and its inverted signal, and a power wiring for supplying a power signal,
It said pair of electro-optical device according to any one of claims 1, wherein the non-intersecting 4 the clock signal line and the power supply line. The opposite electrode for potential lines and the scan line driver circuit wiring, electrical according to any one of claims 1 6, characterized in that it is planar layout as meandering avoiding cross each other Optical device. The counter electrode potential lines and the scan line driver circuit wiring, at least in part, in any one of claims 1 to 7, characterized in that it comprises a redundancy line consisting of other conductive films formed on different layers The electro-optical device described. An electronic device characterized by being provided with the electro-optical device according to any one of claims 1 to 8.

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