JP5217163B2 - 圧力センサ - Google Patents
圧力センサ Download PDFInfo
- Publication number
- JP5217163B2 JP5217163B2 JP2006513032A JP2006513032A JP5217163B2 JP 5217163 B2 JP5217163 B2 JP 5217163B2 JP 2006513032 A JP2006513032 A JP 2006513032A JP 2006513032 A JP2006513032 A JP 2006513032A JP 5217163 B2 JP5217163 B2 JP 5217163B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- base
- diaphragm
- pressure
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010453 quartz Substances 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 27
- 239000013078 crystal Substances 0.000 claims description 23
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- 238000001514 detection method Methods 0.000 description 50
- 239000010408 film Substances 0.000 description 34
- 238000005530 etching Methods 0.000 description 12
- 230000035945 sensitivity Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000005259 measurement Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009530 blood pressure measurement Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
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- 239000010409 thin film Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
- G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006513032A JP5217163B2 (ja) | 2004-05-12 | 2005-05-10 | 圧力センサ |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004142958 | 2004-05-12 | ||
| JP2004142958 | 2004-05-12 | ||
| PCT/JP2005/008537 WO2005108946A1 (ja) | 2004-05-12 | 2005-05-10 | 圧力センサ |
| JP2006513032A JP5217163B2 (ja) | 2004-05-12 | 2005-05-10 | 圧力センサ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011256246A Division JP5353996B2 (ja) | 2004-05-12 | 2011-11-24 | 圧力センサー |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2005108946A1 JPWO2005108946A1 (ja) | 2008-07-31 |
| JP5217163B2 true JP5217163B2 (ja) | 2013-06-19 |
Family
ID=35320320
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513032A Expired - Fee Related JP5217163B2 (ja) | 2004-05-12 | 2005-05-10 | 圧力センサ |
| JP2011256246A Expired - Fee Related JP5353996B2 (ja) | 2004-05-12 | 2011-11-24 | 圧力センサー |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011256246A Expired - Fee Related JP5353996B2 (ja) | 2004-05-12 | 2011-11-24 | 圧力センサー |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP5217163B2 (https=) |
| WO (1) | WO2005108946A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2001637C2 (nl) * | 2008-05-30 | 2009-12-01 | Nedap Nv | Druksensor voor een melktransportstelsel. |
| JP5865184B2 (ja) * | 2012-06-13 | 2016-02-17 | Ntn株式会社 | 磁気式荷重センサおよび電動ブレーキ装置 |
| JP5708674B2 (ja) | 2013-01-24 | 2015-04-30 | トヨタ自動車株式会社 | 内燃機関の制御装置 |
| US10104270B2 (en) | 2014-03-24 | 2018-10-16 | Hideep Inc. | Method for operating camera underwater |
| KR101933049B1 (ko) * | 2017-06-23 | 2018-12-27 | 주식회사 하이딥 | 카메라의 수중 조작방법 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136675A (ja) * | 1986-11-28 | 1988-06-08 | Sanken Electric Co Ltd | ダイヤフラム式半導体圧力センサ−の製造方法 |
| JPH02256278A (ja) * | 1987-04-10 | 1990-10-17 | Mitsubishi Electric Corp | 半導体圧力センサ |
| JPH07501142A (ja) * | 1991-11-15 | 1995-02-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 圧力センサ内に使用するシリコンチップ |
| JPH0982984A (ja) * | 1995-09-19 | 1997-03-28 | Denso Corp | 半導体力学量センサおよびその製造方法 |
| JP2000214007A (ja) * | 1999-01-21 | 2000-08-04 | Polymatech Co Ltd | 感圧センサ |
| JP2002107254A (ja) * | 2000-09-28 | 2002-04-10 | Kyocera Corp | 圧力検出装置用パッケージ |
| JP2002195903A (ja) * | 2000-12-26 | 2002-07-10 | Fujikura Ltd | 圧力センサ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5134887A (en) * | 1989-09-22 | 1992-08-04 | Bell Robert L | Pressure sensors |
| US5333504A (en) * | 1992-09-01 | 1994-08-02 | Rosemount Inc. | High overpressure low range pressure sensor |
| JP4744088B2 (ja) * | 2004-02-24 | 2011-08-10 | 京セラ株式会社 | 圧力検出装置用パッケージ |
-
2005
- 2005-05-10 JP JP2006513032A patent/JP5217163B2/ja not_active Expired - Fee Related
- 2005-05-10 WO PCT/JP2005/008537 patent/WO2005108946A1/ja not_active Ceased
-
2011
- 2011-11-24 JP JP2011256246A patent/JP5353996B2/ja not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136675A (ja) * | 1986-11-28 | 1988-06-08 | Sanken Electric Co Ltd | ダイヤフラム式半導体圧力センサ−の製造方法 |
| JPH02256278A (ja) * | 1987-04-10 | 1990-10-17 | Mitsubishi Electric Corp | 半導体圧力センサ |
| JPH07501142A (ja) * | 1991-11-15 | 1995-02-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 圧力センサ内に使用するシリコンチップ |
| JPH0982984A (ja) * | 1995-09-19 | 1997-03-28 | Denso Corp | 半導体力学量センサおよびその製造方法 |
| JP2000214007A (ja) * | 1999-01-21 | 2000-08-04 | Polymatech Co Ltd | 感圧センサ |
| JP2002107254A (ja) * | 2000-09-28 | 2002-04-10 | Kyocera Corp | 圧力検出装置用パッケージ |
| JP2002195903A (ja) * | 2000-12-26 | 2002-07-10 | Fujikura Ltd | 圧力センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012063363A (ja) | 2012-03-29 |
| WO2005108946A1 (ja) | 2005-11-17 |
| JP5353996B2 (ja) | 2013-11-27 |
| JPWO2005108946A1 (ja) | 2008-07-31 |
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