JP5212106B2 - せん断モード型圧電アクチュエータ及び液滴吐出ヘッド - Google Patents
せん断モード型圧電アクチュエータ及び液滴吐出ヘッド Download PDFInfo
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- 239000000203 mixture Substances 0.000 claims description 78
- 239000000919 ceramic Substances 0.000 claims description 49
- 239000007788 liquid Substances 0.000 claims description 47
- 238000005192 partition Methods 0.000 claims description 45
- 239000006104 solid solution Substances 0.000 claims description 16
- 229910052738 indium Inorganic materials 0.000 claims description 11
- 229910052706 scandium Inorganic materials 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229910052573 porcelain Inorganic materials 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 description 24
- 150000001875 compounds Chemical class 0.000 description 20
- 230000005684 electric field Effects 0.000 description 19
- 239000002994 raw material Substances 0.000 description 18
- 239000011734 sodium Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000010287 polarization Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000001354 calcination Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009694 cold isostatic pressing Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910013553 LiNO Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- LGRDPUAPARTXMG-UHFFFAOYSA-N bismuth nickel Chemical compound [Ni].[Bi] LGRDPUAPARTXMG-UHFFFAOYSA-N 0.000 description 1
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000028161 membrane depolarization Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- Compositions Of Oxide Ceramics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
1.
下記一般式(1)で表される主成分と、固溶体全体量に対して1mol%未満の添加量で添加されている下記一般式(2)で表される副成分との固溶体を含有する圧電磁器組成物を用いたせん断モード型圧電アクチュエータであって、
前記圧電磁器組成物の圧電d 15 定数は、前記副成分を添加しない場合の圧電d 15 定数と同等以上であることを特徴とするせん断モード型圧電アクチュエータ。
一般式(1)
{LiX(K1−YNaY)1−X}(Nb1−Z−WTaZSbW)O3
(式中、0≦x≦0.2、0≦y≦1、0<z≦0.4、0<w≦0.2)
一般式(2)
ABO3
(式中AはBiを表し、BはFe,In,Scの少なくとも1つを表す)
2.
前記固溶体はペロブスカイト構造を有することを特徴とする前記1に記載のせん断モード型圧電アクチュエータ。
3.
前記1または2に記載のせん断モード型圧電アクチュエータを備えたことを特徴とする液滴吐出ヘッド。
4.
各々が液滴吐出用のノズルを有する液体流路が隔壁で隔てられて複数配置され、該隔壁の一部また全体が前記せん断モード型圧電アクチュエータで構成されていることを特徴とする前記3に記載の液滴吐出ヘッド。
2 ノズル形成部材
3 ノズル
4,4−1,4−2・・・4−n インク流路
5,22−1,22−2・・・22−n 側壁
6 カバープレート
7 インク供給口
8 インク排出口
9 基板
一般式(1)
{LiX(K1-YNaY)1-X}(Nb1-Z-WTaZSbW)O3
(式中、0≦x≦0.2、0≦y≦1、0<z≦0.4、0<w≦0.2)
一般式(2)
ABO3
(式中AはBiを表し、BはFe,In,Scの少なくとも1つを表す)
まず、以下に、本発明に係る圧電磁器組成物の一実施形態について説明する。
BはFe,In,Scの少なくとも1つの元素を含む。副成分の添加量は、圧電磁器組成物の焼成工程において緻密な焼結体を得るために、添加後の成分全体量(主成分+副成分)100molに対して1mol未満とする。
Δ=(圧電d15定数)×H×V/(4T)
P=(圧電d15定数)×H×V/(2TW(1/B)+(1/S)(dS/dP))
ここで、図3に示すように、Hは液体流路4の深さ、Wは液体流路4の幅、Vは駆動パルス電圧、Tは圧電隔壁5の厚さ、Bは液体の体積弾性率、Sは流体流路4の断面積である。
一般式(1)
{LiX(K1-YNaY)1-X}(Nb1-Z-WTaZSbW)O3
(式中、0≦x≦0.2、0≦y≦1、0<z≦0.4、0<w≦0.2)
一般式(2)
ABO3
(式中AはBiを表し、BはFe,In,Scの少なくとも1つを表す)
本実施形態のような抗電界が高い圧電磁器組成物を圧電隔壁(せん断モード型圧電アクチュエータ)として用いることにより、該圧電隔壁に印加する駆動電圧を増加させて、最大変位量を大きくできる。また、圧電隔壁の厚みを薄くできるので、圧電隔壁の共振周波数が高められ、高周波駆動が可能になる。また、同様に圧電隔壁の厚みを薄くできるので、前述の圧電隔壁の平均変位量Δの式から明らかなように変位効率も向上する。さらに、圧電隔壁の厚みを薄くできるので、ノズルピッチP(図2参照)を狭めることができ、ノズル密度を向上させることが可能になる。
下記一般式(1)で表される主成分と、固溶体全体量に対して1mol%未満の添加量で添加されている下記一般式(2)で表される副成分との固溶体を含有する圧電磁器組成物を用いている。
一般式(1)
{LiX(K1-YNaY)1-X}(Nb1-Z-WTaZSbW)O3
(式中、0≦x≦0.2、0≦y≦1、0<z≦0.4、0<w≦0.2)
一般式(2)
ABO3
(式中AはBiを表し、BはFe,In,Scの少なくとも1つを表す)
本実施形態のような抗電界が高い圧電磁器組成物をせん断モード型圧電アクチュエータとして用いることにより、該せん断モード型圧電アクチュエータに印加する駆動電圧を増加させて、最大変位量を大きくできる。また、せん断モード型圧電アクチュエータの厚みを薄くできるので、せん断モード型圧電アクチュエータの共振周波数が高められ、高周波駆動が可能になる。また、同様にせん断モード型圧電アクチュエータの厚みを薄くできるので、変位効率も向上する。
Claims (4)
- 下記一般式(1)で表される主成分と、固溶体全体量に対して1mol%未満の添加量で添加されている下記一般式(2)で表される副成分との固溶体を含有する圧電磁器組成物を用いたせん断モード型圧電アクチュエータであって、
前記圧電磁器組成物の圧電d 15 定数は、前記副成分を添加しない場合の圧電d 15 定数と同等以上であることを特徴とするせん断モード型圧電アクチュエータ。
一般式(1)
{LiX(K1−YNaY)1−X}(Nb1−Z−WTaZSbW)O3
(式中、0≦x≦0.2、0≦y≦1、0<z≦0.4、0<w≦0.2)
一般式(2)
ABO3
(式中AはBiを表し、BはFe,In,Scの少なくとも1つを表す) - 前記固溶体はペロブスカイト構造を有することを特徴とする請求項1に記載のせん断モード型圧電アクチュエータ。
- 請求項1又は2に記載のせん断モード型圧電アクチュエータを備えたことを特徴とする液滴吐出ヘッド。
- 各々が液滴吐出用のノズルを有する液体流路が隔壁で隔てられて複数配置され、該隔壁の一部また全体が前記せん断モード型圧電アクチュエータで構成されていることを特徴とする請求項3に記載の液滴吐出ヘッド。
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JP2008533072A JP5212106B2 (ja) | 2006-09-08 | 2007-08-02 | せん断モード型圧電アクチュエータ及び液滴吐出ヘッド |
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WO2007014142A2 (en) * | 2005-07-25 | 2007-02-01 | Piezoinnovations | Ultrasonic transducer devices and methods of manufacture |
WO2007099901A1 (ja) * | 2006-02-28 | 2007-09-07 | Konica Minolta Holdings, Inc. | 圧電磁器組成物 |
JP4737726B2 (ja) * | 2009-05-01 | 2011-08-03 | セイコーエプソン株式会社 | 振動子、振動子アレイ、及び電子機器 |
JP5919775B2 (ja) * | 2011-12-01 | 2016-05-18 | コニカミノルタ株式会社 | 液滴吐出ヘッド及び記録装置 |
US9994045B2 (en) | 2014-08-01 | 2018-06-12 | Ushio Denki Kabushiki Kaisha | Light irradiation apparatus including a light shield |
CN107399165A (zh) * | 2016-05-20 | 2017-11-28 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种提高剪切式形变量的压电喷头及其制备方法 |
JP7146521B2 (ja) * | 2018-08-09 | 2022-10-04 | 東芝テック株式会社 | インクジェットヘッド、インクジェット装置、及びインクジェットヘッドの製造方法 |
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JPH11228228A (ja) * | 1998-02-18 | 1999-08-24 | Murata Mfg Co Ltd | 圧電磁器組成物 |
JP2004244300A (ja) * | 2003-01-23 | 2004-09-02 | Denso Corp | 圧電磁器組成物及びその製造方法,並びに圧電素子及び誘電素子 |
JP2004244301A (ja) * | 2003-01-23 | 2004-09-02 | Denso Corp | 圧電磁器組成物及びその製造方法並びに圧電素子及び誘電素子 |
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TW563265B (en) | 1998-02-18 | 2003-11-21 | Murata Manufacturing Co | Piezoelectric ceramic composition |
JP4156461B2 (ja) | 2002-07-16 | 2008-09-24 | 株式会社デンソー | 圧電磁器組成物及びその製造方法並びに圧電素子 |
EP1382588B9 (en) | 2002-07-16 | 2012-06-27 | Denso Corporation | Piezoelectric ceramic composition and method of production of same |
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JP2005246656A (ja) | 2004-03-02 | 2005-09-15 | Ricoh Co Ltd | 液滴吐出ヘッド、液体吐出装置及び画像形成装置 |
JP4594262B2 (ja) * | 2006-03-17 | 2010-12-08 | 日本碍子株式会社 | 吐出デバイス |
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JPH08309979A (ja) * | 1995-05-17 | 1996-11-26 | Brother Ind Ltd | インク噴射装置及びその製造方法 |
JPH11228228A (ja) * | 1998-02-18 | 1999-08-24 | Murata Mfg Co Ltd | 圧電磁器組成物 |
JP2004244300A (ja) * | 2003-01-23 | 2004-09-02 | Denso Corp | 圧電磁器組成物及びその製造方法,並びに圧電素子及び誘電素子 |
JP2004244301A (ja) * | 2003-01-23 | 2004-09-02 | Denso Corp | 圧電磁器組成物及びその製造方法並びに圧電素子及び誘電素子 |
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EP2061099B1 (en) | 2014-03-26 |
US7905579B2 (en) | 2011-03-15 |
US20100002060A1 (en) | 2010-01-07 |
EP2061099A4 (en) | 2010-03-17 |
JPWO2008029573A1 (ja) | 2010-01-21 |
EP2061099A1 (en) | 2009-05-20 |
CN101512787A (zh) | 2009-08-19 |
CN101512787B (zh) | 2010-11-10 |
WO2008029573A1 (fr) | 2008-03-13 |
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