JP5210439B2 - 高圧処理器及び高圧シーリング方法 - Google Patents

高圧処理器及び高圧シーリング方法 Download PDF

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Publication number
JP5210439B2
JP5210439B2 JP2011552870A JP2011552870A JP5210439B2 JP 5210439 B2 JP5210439 B2 JP 5210439B2 JP 2011552870 A JP2011552870 A JP 2011552870A JP 2011552870 A JP2011552870 A JP 2011552870A JP 5210439 B2 JP5210439 B2 JP 5210439B2
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Japan
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door
pressure
wafer
carbon dioxide
space
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Expired - Fee Related
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JP2011552870A
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English (en)
Japanese (ja)
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JP2012519392A (ja
Inventor
ガプス ハン
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エーエヌディ コーポレーション
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2011552870A 2009-03-13 2009-03-17 高圧処理器及び高圧シーリング方法 Expired - Fee Related JP5210439B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2009-0021573 2009-03-13
KR1020090021573A KR101047863B1 (ko) 2009-03-13 2009-03-13 고압 처리기 및 고압 실링방법
PCT/KR2009/001309 WO2010104231A1 (ko) 2009-03-13 2009-03-17 고압 처리기 및 고압 실링방법

Publications (2)

Publication Number Publication Date
JP2012519392A JP2012519392A (ja) 2012-08-23
JP5210439B2 true JP5210439B2 (ja) 2013-06-12

Family

ID=42728502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011552870A Expired - Fee Related JP5210439B2 (ja) 2009-03-13 2009-03-17 高圧処理器及び高圧シーリング方法

Country Status (3)

Country Link
JP (1) JP5210439B2 (ko)
KR (1) KR101047863B1 (ko)
WO (1) WO2010104231A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5708506B2 (ja) * 2011-04-20 2015-04-30 東京エレクトロン株式会社 処理装置
JP5497114B2 (ja) 2011-07-29 2014-05-21 セメス株式会社 基板処理装置及び基板処理方法
CN106935876B (zh) * 2017-04-17 2024-01-30 百睿机械（深圳）有限公司 一种电池正负压箱体装置
JP7105183B2 (ja) 2018-12-27 2022-07-22 株式会社ダイヘン インピーダンス整合装置及びインピーダンス整合方法
CN110164799B (zh) * 2019-05-31 2021-03-02 吉林建筑大学 一种基于微电子控制的定位封装机构及方法
KR102391244B1 (ko) * 2020-06-05 2022-04-28 주식회사 제우스이엔피 식각장치 및 그 제어방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289829U (ko) * 1988-12-28 1990-07-17
JPH0417333A (ja) * 1990-05-10 1992-01-22 Hitachi Ltd 基板の超臨界ガスによる洗浄方法及び洗浄システム
JP2000340540A (ja) * 1999-05-31 2000-12-08 Hitachi Koki Co Ltd 超臨界乾燥装置
JP2001077074A (ja) * 1999-08-31 2001-03-23 Kobe Steel Ltd 半導体ウエハ等の洗浄装置
JP3983015B2 (ja) * 2000-07-03 2007-09-26 東京エレクトロン株式会社 シール機構付処理装置
JP3982791B2 (ja) * 2001-05-29 2007-09-26 大日本スクリーン製造株式会社 高圧処理装置
US20040040660A1 (en) * 2001-10-03 2004-03-04 Biberger Maximilian Albert High pressure processing chamber for multiple semiconductor substrates
JP3978023B2 (ja) * 2001-12-03 2007-09-19 株式会社神戸製鋼所 高圧処理方法
JP3950084B2 (ja) * 2003-06-04 2007-07-25 株式会社神戸製鋼所 高圧処理装置
JP2005081302A (ja) * 2003-09-10 2005-03-31 Japan Organo Co Ltd 超臨界流体による電子部品部材類の洗浄方法及び洗浄装置
KR20060021637A (ko) * 2004-09-03 2006-03-08 삼성전자주식회사 웨이퍼 세정 건조 장비
KR20060108317A (ko) * 2005-04-12 2006-10-17 삼성전자주식회사 오염방지 커버가 부착된 에어 실린더를 구비한 반도체 장비
KR100713209B1 (ko) * 2007-02-06 2007-05-02 서강대학교산학협력단 세정장치에 사용되는 고압세정기

Also Published As

Publication number Publication date
KR20100103123A (ko) 2010-09-27
JP2012519392A (ja) 2012-08-23
KR101047863B1 (ko) 2011-07-08
WO2010104231A1 (ko) 2010-09-16

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