JP5206940B2 - ウエハの配置の簡略化 - Google Patents
ウエハの配置の簡略化 Download PDFInfo
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- JP5206940B2 JP5206940B2 JP2007509691A JP2007509691A JP5206940B2 JP 5206940 B2 JP5206940 B2 JP 5206940B2 JP 2007509691 A JP2007509691 A JP 2007509691A JP 2007509691 A JP2007509691 A JP 2007509691A JP 5206940 B2 JP5206940 B2 JP 5206940B2
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- wafer
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- radiation beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (12)
- 一つのシャフト、
上記シャフト上に回転可能に取り付けられる一つのスリーブ、
上記シャフトの一端に取り付けられ、粒子汚染を軽減するために、その頂部上に配置されるウエハの裏側表面のみを支持するように適応する1以上の支持ピン、
及び、
上記スリーブに操作可能に結合される一つのアーム部材を含み、上記アーム部材の端部は、ウエハが上記1以上の支持ピンの頂部上にある時、ウエハの方に伸び、かつビーム放射が上記ウエハの周縁と交わることができるように操作可能であり、
上記ウエハは、ウエハの周縁の周りにアーム部材を回転させることによってスキャンされ、そして、マーキングが、ウエハを通過する放射ビーム量の変化によって確認され得る、半導体ウエハ上に配列されたマーキングを設けるように適したシステム。 - 上記アームの運動を制御し、かつ、ウエハの周りで種々の位置で、ウエハを通過する放射ビーム量に関して、1以上のセンサからのスキャンデータを取得するために、上記アームに操作可能に結合されている制御器を、さらに含む請求項1記載のシステム。
- 上記制御器は、また、ピン上にウエハを配置し、かつ、ピンからウエハを移動して上記ウエハを半導体処理装置へ移送するように適応されるロボットアームに操作可能に結合されている請求項2記載のシステム。
- 上記制御器は、また、そこへデータを転送する処理装置へ操作可能に結合され、上記処理装置は、ロボットアーム及びスキャンデータからウエハの方向に応じて、そこでウエハを適切に方向付けることができる請求項3記載の移送システム。
- ユーザにスキャンデータを見せるように適応したディスプレイを、さらに含む請求項1記載の移送システム。
- ウエハの中心は、また、ウエハの周りの種々の位置で、ウエハを通過する放射ビーム量が徐々に変化することを観察することによって確認できる請求項1記載のシステム。
- 放射ビームは、約1cmの幅を有する請求項1記載のシステム。
- 放射ビームは、実質的に断面積が楕円である請求項1記載のシステム。
- 放射ビームは、ウエハの上方あるいは下方にある突出部上に設けられた放射源から得られる請求項2記載のシステム。
- 1以上のセンサが、上記アーム部材の端部から出る他の突出部内に設けられ、そして、ウエハの上方あるいは下方で、上記放射源を含む上記突出部の反対側に据えられている請求項9記載のシステム。
- 上記アームと、上記アームの端部がウエハに接近しあるいは離れるように移動することを可能とする上記スリーブとの間に、1以上の枢着部をさらに含む請求項1記載のシステム。
- 配置されたマーキングは、ウエハの周縁内のノッチを含む請求項1記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/830,734 US7453160B2 (en) | 2004-04-23 | 2004-04-23 | Simplified wafer alignment |
US10/830,734 | 2004-04-23 | ||
PCT/US2005/013916 WO2005106925A1 (en) | 2004-04-23 | 2005-04-25 | Simplified wafer alignment |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007535148A JP2007535148A (ja) | 2007-11-29 |
JP5206940B2 true JP5206940B2 (ja) | 2013-06-12 |
Family
ID=34967693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007509691A Active JP5206940B2 (ja) | 2004-04-23 | 2005-04-25 | ウエハの配置の簡略化 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7453160B2 (ja) |
EP (1) | EP1741126B1 (ja) |
JP (1) | JP5206940B2 (ja) |
KR (1) | KR20070007946A (ja) |
CN (1) | CN100468617C (ja) |
DE (1) | DE602005023972D1 (ja) |
WO (1) | WO2005106925A1 (ja) |
Families Citing this family (22)
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US7453160B2 (en) * | 2004-04-23 | 2008-11-18 | Axcelis Technologies, Inc. | Simplified wafer alignment |
US7371663B2 (en) * | 2005-07-06 | 2008-05-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three dimensional IC device and alignment methods of IC device substrates |
JP4522360B2 (ja) * | 2005-12-02 | 2010-08-11 | 日東電工株式会社 | 半導体ウエハの位置決定方法およびこれを用いた装置 |
US20080023654A1 (en) * | 2006-07-28 | 2008-01-31 | Michael Graf | Method of reducing transient wafer temperature during implantation |
US7812325B2 (en) * | 2006-09-28 | 2010-10-12 | Varian Semiconductor Equipment Associates, Inc. | Implanting with improved uniformity and angle control on tilted wafers |
US7808657B2 (en) * | 2007-06-28 | 2010-10-05 | International Business Machines Corporation | Wafer and stage alignment using photonic devices |
TW200917401A (en) * | 2007-10-12 | 2009-04-16 | Youngtek Electronics Corp | Wafer testing system |
JP4766156B2 (ja) * | 2009-06-11 | 2011-09-07 | 日新イオン機器株式会社 | イオン注入装置 |
CN102103335B (zh) * | 2009-12-18 | 2012-10-10 | 和舰科技(苏州)有限公司 | 一种检验晶片对准的方法 |
JP5477133B2 (ja) * | 2010-04-09 | 2014-04-23 | 日新イオン機器株式会社 | ウェーハハンドリング方法およびイオン注入装置 |
CN102315086B (zh) * | 2010-06-30 | 2013-09-25 | 中芯国际集成电路制造(北京)有限公司 | 一种提高机械手臂运动准确性的装置及其使用方法 |
CN104249992B (zh) * | 2013-06-28 | 2016-08-10 | 上海华虹宏力半导体制造有限公司 | 晶片与晶片之间的对准方法 |
CN103531509A (zh) * | 2013-09-26 | 2014-01-22 | 苏州经贸职业技术学院 | 一种工作台上精确定位圆心的方法 |
JP6685213B2 (ja) * | 2016-09-29 | 2020-04-22 | 株式会社Screenホールディングス | 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法 |
CN106289199B (zh) * | 2016-11-08 | 2021-06-08 | 佛山科学技术学院 | 一种定位对准仪 |
CN108333298B (zh) * | 2017-01-19 | 2021-03-09 | 上海新昇半导体科技有限公司 | 晶片放置装置和晶片定向仪 |
JP6633782B1 (ja) | 2017-01-31 | 2020-01-22 | イラミーナ インコーポレーテッド | ウェハーの整列方法及び整列システム |
TWI800544B (zh) | 2017-10-25 | 2023-05-01 | 美商艾克塞利斯科技公司 | 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器 |
KR102217780B1 (ko) | 2018-06-12 | 2021-02-19 | 피에스케이홀딩스 (주) | 정렬 장치 |
US10720354B2 (en) * | 2018-08-28 | 2020-07-21 | Axcelis Technologies, Inc. | System and method for aligning light-transmitting birefringent workpieces |
EP3921123A4 (en) | 2019-02-08 | 2022-10-26 | Yaskawa America, Inc. | THROUGH-BEAM MACHINE LEARNING |
CN112713107B (zh) * | 2020-12-16 | 2022-12-27 | 华虹半导体(无锡)有限公司 | 半导体晶片切口识别装置和识别方法 |
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JPS59147444A (ja) * | 1983-02-14 | 1984-08-23 | Hitachi Ltd | 板状物体の位置合わせ方法およびその装置 |
US6624433B2 (en) * | 1994-02-22 | 2003-09-23 | Nikon Corporation | Method and apparatus for positioning substrate and the like |
DE69516035T2 (de) * | 1994-05-23 | 2000-08-31 | Sumitomo Electric Industries | Verfharen zum Herstellen eines mit hartem Material bedeckten Halbleiters |
JP3003088B2 (ja) | 1994-06-10 | 2000-01-24 | 住友イートンノバ株式会社 | イオン注入装置 |
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WO1999028220A1 (fr) * | 1997-12-03 | 1999-06-10 | Nikon Corporation | Dispositif et procede de transfert de substrats |
JP2000068357A (ja) * | 1998-08-25 | 2000-03-03 | Kobe Steel Ltd | ウェーハ切欠部位置検出装置及びウェーハ特性測定装置 |
US6727980B2 (en) * | 1998-09-17 | 2004-04-27 | Nikon Corporation | Apparatus and method for pattern exposure and method for adjusting the apparatus |
JP3072484B2 (ja) * | 1998-10-28 | 2000-07-31 | ローツェ株式会社 | ウエハ位置決め装置 |
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US7453160B2 (en) * | 2004-04-23 | 2008-11-18 | Axcelis Technologies, Inc. | Simplified wafer alignment |
JP2007019379A (ja) * | 2005-07-11 | 2007-01-25 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
-
2004
- 2004-04-23 US US10/830,734 patent/US7453160B2/en active Active
-
2005
- 2005-04-25 DE DE602005023972T patent/DE602005023972D1/de active Active
- 2005-04-25 CN CN200580012844.7A patent/CN100468617C/zh active Active
- 2005-04-25 KR KR1020067024618A patent/KR20070007946A/ko not_active Application Discontinuation
- 2005-04-25 JP JP2007509691A patent/JP5206940B2/ja active Active
- 2005-04-25 EP EP05742593A patent/EP1741126B1/en not_active Expired - Fee Related
- 2005-04-25 WO PCT/US2005/013916 patent/WO2005106925A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2005106925A1 (en) | 2005-11-10 |
CN1947223A (zh) | 2007-04-11 |
US20050251279A1 (en) | 2005-11-10 |
DE602005023972D1 (de) | 2010-11-18 |
EP1741126B1 (en) | 2010-10-06 |
KR20070007946A (ko) | 2007-01-16 |
CN100468617C (zh) | 2009-03-11 |
JP2007535148A (ja) | 2007-11-29 |
US7453160B2 (en) | 2008-11-18 |
EP1741126A1 (en) | 2007-01-10 |
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