JP5204998B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5204998B2 JP5204998B2 JP2007165106A JP2007165106A JP5204998B2 JP 5204998 B2 JP5204998 B2 JP 5204998B2 JP 2007165106 A JP2007165106 A JP 2007165106A JP 2007165106 A JP2007165106 A JP 2007165106A JP 5204998 B2 JP5204998 B2 JP 5204998B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- circuit
- substrate
- region
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007165106A JP5204998B2 (ja) | 2006-06-30 | 2007-06-22 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006181885 | 2006-06-30 | ||
| JP2006181885 | 2006-06-30 | ||
| JP2007165106A JP5204998B2 (ja) | 2006-06-30 | 2007-06-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008035498A JP2008035498A (ja) | 2008-02-14 |
| JP2008035498A5 JP2008035498A5 (enExample) | 2010-07-22 |
| JP5204998B2 true JP5204998B2 (ja) | 2013-06-05 |
Family
ID=39124378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007165106A Expired - Fee Related JP5204998B2 (ja) | 2006-06-30 | 2007-06-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5204998B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101570993B1 (ko) * | 2008-09-23 | 2015-11-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| JP5484109B2 (ja) * | 2009-02-09 | 2014-05-07 | 三菱電機株式会社 | 電気光学装置 |
| JP5784479B2 (ja) * | 2010-12-28 | 2015-09-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5916030B2 (ja) * | 2012-02-14 | 2016-05-11 | セイコーエプソン株式会社 | 温度センサー及び電気光学装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3637706B2 (ja) * | 1996-11-27 | 2005-04-13 | ソニー株式会社 | ディジタル遅延回路およびそれを用いたディジタル制御発振回路 |
| CA2224767A1 (en) * | 1996-12-31 | 1998-06-30 | Huang Chaogang | Variable cmos vernier delay |
| JPH1115934A (ja) * | 1997-06-24 | 1999-01-22 | Nippon Steel Corp | 無電池方式のrfid |
| JPH11168362A (ja) * | 1997-12-02 | 1999-06-22 | Oki Micro Design Miyazaki Co Ltd | 遅延回路 |
| JP3748857B2 (ja) * | 2002-01-25 | 2006-02-22 | 松下電器産業株式会社 | 半導体集積回路とこれを搭載したデータキャリア |
-
2007
- 2007-06-22 JP JP2007165106A patent/JP5204998B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008035498A (ja) | 2008-02-14 |
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