JP5203011B2 - Commutator member for motor and motor - Google Patents

Commutator member for motor and motor Download PDF

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JP5203011B2
JP5203011B2 JP2008088642A JP2008088642A JP5203011B2 JP 5203011 B2 JP5203011 B2 JP 5203011B2 JP 2008088642 A JP2008088642 A JP 2008088642A JP 2008088642 A JP2008088642 A JP 2008088642A JP 5203011 B2 JP5203011 B2 JP 5203011B2
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commutator
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alloy
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layer
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JP2009247067A (en
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良聡 小林
智 鈴木
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THE FURUKAW ELECTRIC CO., LTD.
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本発明は、音響機器、映像機器、精密機器、自動車電装用機器等に使用されるモータに関するものであり、特に整流子の製作が容易に製造できるとともに、その整流子片と導線とを接合する、いわゆるスポット接合強度が優れ、かつ高い接合信頼性をもつモータ用整流子部材に関するものである。   The present invention relates to a motor used in audio equipment, video equipment, precision equipment, automotive electrical equipment, and the like. In particular, the commutator can be easily manufactured, and the commutator piece and a conductor are joined. The present invention relates to a commutator member for motors that has excellent so-called spot bonding strength and high bonding reliability.

従来の各整流子片と巻線コイル端部との接続について、図を参照して説明する。
図4は、小型モータの整流子部の概略斜視図である。図中、11は回転子のシャフト、12は整流子芯、13は整流子片、14は整流子足部である。このように、整流子部は樹脂製の整流子芯12の上に配置された各整流子片13、及び巻線コイル端部を接続するために各整流子片13と一体にその端部に形成された整流子足部14とから構成されている。
図5は、図4に示す整流子部の側面から見た側面図であり、巻き線コイル端部を接合した状態を示している。整流子足部14は、図示したように整流子片の方に折り曲げることにより巻き線コイル15の端部を押さえつけてスポット溶接している。
The connection between each conventional commutator piece and the winding coil end will be described with reference to the drawings.
FIG. 4 is a schematic perspective view of the commutator portion of the small motor. In the figure, 11 is a rotor shaft, 12 is a commutator core, 13 is a commutator piece, and 14 is a commutator foot. In this way, the commutator part is integrally formed with each commutator piece 13 to connect each commutator piece 13 disposed on the resin commutator core 12 and the winding coil end. The commutator foot portion 14 is formed.
FIG. 5 is a side view seen from the side of the commutator portion shown in FIG. 4 and shows a state in which the winding coil ends are joined. The commutator foot 14 is spot-welded by pressing the end of the winding coil 15 by bending it toward the commutator piece as shown.

図6は、(b)にバリスタのみを取り出して示すとともに、(a)にそのバリスタを整流子部に取り付けて接続した状態を示す図である。整流子を有する小型モータにあっては、整流子に摺接するブラシが整流子片間を通過する際にアークが発生し、このアークによって通信機器に電波障害を与えたりブラシの寿命が短くなったりする。そのため、火花消去素子としてバリスタをモータの回転子に取り付けることが従来から知られている。このようなバリスタの一例は、図6(b)示すような形状をしており、全体的にドーナツ状円板形状にして、回転子磁極数、すなわち整流子片と同数の電極を有している。このバリスタ16の各電極17は、それぞれ各整流子足部14とはんだ付けされる。このはんだ付けによって、バリスタ16は電気的に接続されるだけでなく、整流子部と同心に機械的にも固定される。   FIG. 6 is a view showing only a varistor extracted in (b) and a state in which the varistor is attached and connected to the commutator section in (a). In a small motor having a commutator, an arc is generated when the brush that is in sliding contact with the commutator passes between the commutator pieces, and this arc can cause radio interference in communication equipment and shorten the life of the brush. To do. For this reason, it is conventionally known that a varistor is attached to a rotor of a motor as a spark erasing element. An example of such a varistor has a shape as shown in FIG. 6 (b), has a donut-like disk shape as a whole, and has the same number of electrodes as the number of rotor magnetic poles, that is, commutator pieces. Yes. Each electrode 17 of the varistor 16 is soldered to each commutator foot 14. By this soldering, the varistor 16 is not only electrically connected but also mechanically fixed concentrically with the commutator portion.

このような小型モータの巻線コイルなどの電子部品に用いられる導電材としてのワイヤーには、通常ポリウレタン、ポリエステル等の絶縁材料によりコーティングされて絶縁性皮膜が形成されている。小型モータの巻線コイルは、その端部を各整流子足部と電気的、機械的に接合する必要があり、その手法として整流子足部の折り曲げた内側面に細かな凹凸(いわゆる星打ち:細かな星型の凹部を設けること)を設けた非平滑面とし、さらにスポット溶接によりヒートショックを与えることで、皮膜剥離及び接合を行っている。
図7は、モータ用整流子材を使用したときの巻線コイル端部を接合した状態を示す断面図である。整流子足部14の折り曲げた内部には、あらかじめはんだめっきあるいはSnなどの融点の低いめっきあるいはクラッド材を担持させて巻線コイル15を保持してやることで、ヒートショックによる断線を和らげ、接合を行っている。
A wire as a conductive material used for an electronic component such as a winding coil of such a small motor is usually coated with an insulating material such as polyurethane or polyester to form an insulating film. The end of the winding coil of a small motor must be electrically and mechanically joined to each commutator foot. As a technique, fine irregularities (so-called star hits) are formed on the folded inner surface of the commutator foot. : A fine star-shaped concave portion is provided), and the film is peeled off and bonded by applying a heat shock by spot welding.
FIG. 7 is a cross-sectional view showing a state in which winding coil end portions are joined when a motor commutator material is used. Inside the bent part of the commutator foot 14, solder plating or plating with a low melting point such as Sn or a clad material is supported in advance to hold the winding coil 15, thereby softening the disconnection due to heat shock and performing bonding. ing.

従来技術によって形成された整流子片材の例として、たとえば特許文献1では、銅をベースとした整流子片と導線材を接合する整流子片の折り曲げた内部において、該ベース材よりも融点が低くかつ電気抵抗が高い薄層のクラッド材を貼り付けたものを使用し、星打ちやはんだめっき工程の必要性をなくして作業工程を簡略化することを目的としている。
一方、特許文献2においては、導電性基体上にNiあるいはCoあるいはこれらの合金を第一層とし、第二層にAg系被覆層、さらに整流子片と導線との接合部にSn系金属層めっきを施すことで、接合安定性を図ったものがある。
特開2003−061314号公報 特開2006−149144号公報
As an example of the commutator piece material formed by the prior art, for example, in Patent Document 1, the melting point of the commutator piece that joins the copper-based commutator piece and the conductive wire is larger than that of the base material. The purpose is to simplify the work process by using a thin clad material with a low electrical resistance and a high electrical resistance, eliminating the need for star-casting and solder plating processes.
On the other hand, in Patent Document 2, Ni or Co or an alloy thereof is formed on a conductive substrate as a first layer, an Ag-based coating layer as a second layer, and an Sn-based metal layer at a junction between a commutator piece and a conductive wire. Some have achieved bonding stability by plating.
JP 2003-061314 A JP 2006-149144 A

しかしながら、上記特許文献1記載のクラッド材にて改善を行う方法では、はんだめっきが省略化できるが、クラッドでは薄膜化対応に限界がある。また、クラッド材の表面性状はめっきと比較すると表面汚染がひどく、クラッド材を用いてスポット接合を行っても表層の汚染によって接合信頼性に欠ける可能性があることが懸念された。
さらに上記特許文献2の手法には、Ni系またはCo系いずれか一方の拡散防止を目的とした下地層を設けることが明記されているが、発明者が検討した結果、この下地層の厚さを0.1μmを超えて形成すると、かえって整流子片と導線の接合強度が低下し、接合強度のバラツキも大きくなってしまうことが分かった。
そこで本発明の目的は、整流子片と導線との接合強度が高く、かつその強度のバラツキも少なくでき、安定かつ信頼性のあるスポット接合強度に優れたモータ用整流子部材およびそれを用いたモータを提供することにある。
However, in the method of improving with the clad material described in Patent Document 1, solder plating can be omitted, but the clad has a limit to thinning. Further, the surface property of the clad material is more serious than the plating, and there is a concern that even if spot bonding is performed using the clad material, there is a possibility that the bonding reliability may be lost due to surface contamination.
Further, in the technique of Patent Document 2, it is specified that a base layer for preventing diffusion of either Ni-based or Co-based is provided. It has been found that when the thickness of the wire is formed to exceed 0.1 μm, the bonding strength between the commutator piece and the conductive wire is decreased, and the variation in bonding strength is increased.
Accordingly, an object of the present invention is to provide a commutator member for a motor that has high joint strength between a commutator piece and a conductor, can reduce variations in the strength, and has excellent stable and reliable spot joint strength, and the same. It is to provide a motor.

発明者は、上記課題に鑑み整流子片と導線との接合部について検討を行ったところ、Cu基体とSn層との中間層として設けた下地皮膜が0.1μmを超えて形成されると、中間層による基体成分のバリア効果でSn中にCuが拡散しにくくなって、Sn層内での破断が発生し、その強度が低いことからスポット接合強度が低下してしまうことを突き止めた。
また、下地皮膜を施さずにSnめっきを施すことでCu−Sn拡散層を成長させる手法も検討したが、中間層なしで摺接部に従来より利用されているAg若しくはAg合金のめっきまたはクラッド加工を施すと、Ag形成後におけるAg摺接部の変色がCuの拡散によって顕著となり、接触抵抗が上昇してモータ特性を損なう可能性が高いことが分かった。さらにはスポット溶接部はCu−Sn拡散層が完全に形成されてしまい、接合強度の安定性や信頼性が低い結果となることが分かった。
このため、スポット接合強度を安定してかつ高強度に保つためには、適度なCu−Sn拡散層の成長とSn層の残存が重要であるものと考えた。
The inventor examined the joint between the commutator piece and the conductive wire in view of the above problems, and when the undercoat provided as an intermediate layer between the Cu base and the Sn layer is formed to exceed 0.1 μm, It was ascertained that Cu became difficult to diffuse into Sn due to the barrier effect of the base component due to the intermediate layer, causing breakage in the Sn layer, and the strength of the spot bonding being lowered due to its low strength.
In addition, a method of growing a Cu-Sn diffusion layer by applying Sn plating without applying an undercoat was also examined. However, Ag or Ag alloy plating or cladding conventionally used for sliding contact portions without an intermediate layer When processed, it was found that the discoloration of the Ag sliding contact portion after the formation of Ag becomes conspicuous due to the diffusion of Cu, and the contact resistance increases and the motor characteristics are likely to be impaired. Furthermore, it was found that the Cu—Sn diffusion layer was completely formed in the spot welded portion, resulting in low joint strength stability and reliability.
For this reason, in order to keep the spot bonding strength stable and high, it was considered that proper growth of the Cu—Sn diffusion layer and the remaining of the Sn layer are important.

すなわち本発明は、
(1)CuまたはCu合金からなる基体上に、巻線コイルとの接合部にSnまたはSn合金からなる皮膜が形成されたモータ用整流子部材であって、CuまたはCu合金からなる基体とSnまたはSn合金からなる皮膜の中間に、Ni若しくはNi合金またはCo若しくはCo合金が中間層として設けられ、その中間層厚さが0.01〜0.05μmであることを特徴とするモータ用整流子部材、
(2)前記基体上に形成される中間層およびSnまたはSn合金からなる皮膜がめっき法で形成されていることを特徴とする、(1)記載のモータ用整流子部材、
(3)前記形成されたSnまたはSn合金からなる皮膜が、溶融処理を施されていることを特徴とする、(1)または(2)記載のモータ用整流子部材、および、
(4)前記(1)〜(3)のいずれか1項記載のモータ用整流子部材を搭載したモータ、
を提供するものである。
That is, the present invention
(1) A motor commutator member in which a coating made of Sn or Sn alloy is formed on a joint made of Cu or Cu alloy on a base made of Cu or Cu alloy, and the base made of Cu or Cu alloy and Sn Alternatively, a commutator for a motor, wherein Ni or Ni alloy or Co or Co alloy is provided as an intermediate layer in the middle of a film made of Sn alloy, and the intermediate layer thickness is 0.01 to 0.05 μm. Element,
(2) The commutator member for a motor according to (1), wherein the intermediate layer formed on the substrate and the film made of Sn or Sn alloy are formed by a plating method,
(3) The motor commutator member according to (1) or (2), wherein the formed film of Sn or Sn alloy is subjected to a melting treatment, and
(4) A motor equipped with the motor commutator member according to any one of (1) to (3),
Is to provide.

本発明のモータ用整流子部材は、従来技術のものと比べて整流子片と導線との接合強度が高く、かつそのバラツキも少なくでき、安定かつ信頼性のあるスポット接合強度に優れたモータ用整流子部材である。また、中間バリア層が存在していることで、整流子の摺接面においても良好なモータ寿命特性が得られ、低い接触抵抗といったモータ要求特性をも満足する整流子部材が得られる。
また、中間層およびSn皮膜の形成にめっき法を利用することで、クラッド材よりも安価にかつリードタイムを短く製造することができる。
さらに、SnまたはSn合金からなる皮膜を溶融処理することで、拡散層の形成をより促進できるとともに、ヒゲ状生成物(ウイスカ)の発生する危険性を低減させることができ、さらには整流子片に打ち抜く際の粉落ちを抑制することができる。
The commutator member for a motor of the present invention has a higher bonding strength between a commutator piece and a conductive wire than that of the prior art, and can reduce the variation thereof, and is excellent for a stable and reliable spot bonding strength. A commutator member. In addition, since the intermediate barrier layer is present, good motor life characteristics can be obtained even on the sliding contact surface of the commutator, and a commutator member that satisfies the required motor characteristics such as low contact resistance can be obtained.
Further, by using a plating method for forming the intermediate layer and the Sn coating, it is possible to manufacture at a lower cost and with a shorter lead time than the clad material.
Further, by melting the film made of Sn or Sn alloy, the formation of the diffusion layer can be further promoted, the risk of the generation of whiskers (whiskers) can be reduced, and the commutator piece It is possible to suppress the powder falling off when punching into the mold.

本発明のモータ用整流子部材の好ましい実施形態について、下記に詳細に説明する。
本発明のモータ用整流子に使用する整流子部材を図1に模式的に断面図で示す。整流子部材の基体1には、CuまたはCu合金からなる基体が用いられる。この基体としては、例えば純Cu系のほか、Cu−Sn系、Cu−Zn系、Cu−Sn−P系など、Cuを主成分とする合金を挙げることができる。使用される基体の厚さについては特に規定を設けないが、0.1〜0.5mm程度が実用上の板厚である。
A preferred embodiment of the commutator member for a motor of the present invention will be described in detail below.
A commutator member used in the motor commutator of the present invention is schematically shown in a sectional view in FIG. A substrate made of Cu or a Cu alloy is used as the substrate 1 of the commutator member. Examples of the substrate include alloys containing Cu as a main component, such as Cu—Sn, Cu—Zn, and Cu—Sn—P, in addition to pure Cu. The thickness of the substrate to be used is not particularly specified, but a practical thickness is about 0.1 to 0.5 mm.

上記CuまたはCu合金からなる基体表面に形成される、図1中のSnまたはSn合金からなる皮膜3には、例えば純Sn、Sn−Pb系、Sn−Zn系、Sn−Cu系、Sn−Bi系、Sn−In系、Sn−Ag系、Sn−Pd系、Sn−Ni系、その他Sn−Ag−Cuなどの3元系合金等が挙げられる。形成される被覆厚さには特に規定を設けないが、例えば0.5〜10μmの厚さが好ましく、接続信頼性向上、プレス時の粉落ち防止、及び経済性を考慮すると、1.0〜6.0μmの範囲で形成することが特に好ましい。   The film 3 made of Sn or Sn alloy in FIG. 1 formed on the surface of the substrate made of Cu or Cu alloy includes, for example, pure Sn, Sn—Pb, Sn—Zn, Sn—Cu, Sn— Bi-based, Sn-In-based, Sn-Ag-based, Sn-Pd-based, Sn-Ni-based, and other ternary alloys such as Sn-Ag-Cu are included. The coating thickness to be formed is not particularly specified. For example, a thickness of 0.5 to 10 μm is preferable, and considering the improvement of connection reliability, prevention of powder falling off during pressing, and economic efficiency, 1.0 to It is particularly preferable to form in the range of 6.0 μm.

図1に示すように上記二層の中間に中間層2として形成されるNi若しくはNi合金またはCo若しくはCo合金には、例えばNi系では純Ni、Ni−Co、Ni−Zn、Ni−Sn、Ni−Fe、Ni−P、Ni−B等があり、Co系では純Co、Co−Ni、Co−Zn、Co−Sn、Co−Fe、Co−P、Co−B等がある。
形成される中間層2の被覆厚は、0.01〜0.05μmの範囲で制御することが必要である。厚さが薄すぎると、Cu−Sn拡散層が全体的に形成されてしまい、金属間化合物の脆化が原因となって接合強度の低下やバラツキが大きくなり、逆に被覆厚が厚すぎると、中間層によって基体の拡散が抑制されすぎてしまうために、スポット接合部が破壊されるとSnまたはSn合金層内での破壊となり、Snの引張強度が弱いためにかえってスポット接合強度が低下してしまう。
As shown in FIG. 1, Ni or Ni alloy or Co or Co alloy formed as the intermediate layer 2 between the two layers includes, for example, pure Ni, Ni—Co, Ni—Zn, Ni—Sn, Ni— There are Ni-Fe, Ni-P, Ni-B, and the like, and Co-based materials include pure Co, Co-Ni, Co-Zn, Co-Sn, Co-Fe, Co-P, and Co-B.
It is necessary to control the coating thickness of the intermediate layer 2 to be formed in the range of 0.01 to 0.05 μm. If the thickness is too thin , the Cu—Sn diffusion layer is formed as a whole, resulting in a decrease in bonding strength and variation due to the embrittlement of the intermetallic compound, and conversely, if the coating thickness is too thick. In addition, since the diffusion of the substrate is suppressed too much by the intermediate layer, if the spot bonded portion is broken, it will be broken in the Sn or Sn alloy layer, and the spot bonded strength is lowered because the tensile strength of Sn is weak. End up.

中間層の厚さは0.01〜0.05μmに制御する必要性があるが、これは、中間層のピンホールから基材のCuをSn中に適度に拡散させることによって、適度なCu−Sn拡散層とSn層の残存といった双方の要求を満足することができる。
その結果、スポット接合強度を高く維持でき、かつ中間層が僅かにあることで変色が防止され、低接触抵抗等のモータ要求特性を満足するモータ用整流子材を作製できる。
特にモータ特性およびスポット接合強度の双方を十分に満足する特性を得られる範囲として、中間層の被覆厚は0.01〜0.05μmとする
なお、図中の4は、整流子摺接部であり、巻き線コイルとの接合部ではないので、その層は、SnまたはSn合金である必要は無く、ストライプ状のAu、Pd、Agまたはこれらの合金層である。この層厚は、特に限定するものではなく、0.1〜10μm程度である。以下の図2および図3においても同様である。
It is necessary to control the thickness of the intermediate layer to 0.01 to 0.05 μm. This is achieved by appropriately diffusing Cu of the base material into the Sn from the pinhole of the intermediate layer, so that moderate Cu− Both requirements of Sn diffusion layer and remaining Sn layer can be satisfied.
As a result, it is possible to produce a commutator material for a motor that can maintain high spot-bonding strength, prevent discoloration due to the slight presence of an intermediate layer, and satisfy required motor characteristics such as low contact resistance.
Particularly in the motor characteristic and the spot bonding strength both that obtained sufficiently satisfactory characteristics range of the coating thickness of the intermediate layer is set to 0.01 to 0.05 [mu] m.
In addition, 4 in the figure is a commutator sliding contact portion, and is not a joint portion with the winding coil. Therefore, the layer does not need to be Sn or Sn alloy, and stripe-shaped Au, Pd, Ag or These alloy layers. This layer thickness is not particularly limited, and is about 0.1 to 10 μm. The same applies to FIGS. 2 and 3 below.

図2は、本発明の別の実施形態にかかるモータ用整流子に使用する整流子部材を模式的に示す断面図であるが、ここに示すように中間層を2および5のように複数層設けることも可能であり、その被覆層厚が総計で0.01〜0.05μmとなれば本発明の効果を発揮する。
また図3は、本発明のさらに別の実施形態にかかるモータ用整流子部材を模式的に示す断面図である。このように、巻線コイルとの接合部に形成されたSnまたはSn合金からなる皮膜3の箇所における中間層2の厚さが0.01〜0.05μmの範囲に入っていればよく、スポット接合部以外の中間層厚は上記範囲の限りではない。
FIG. 2 is a cross-sectional view schematically showing a commutator member used in a motor commutator according to another embodiment of the present invention. As shown in FIG. The effect of the present invention is exhibited when the coating layer thickness is 0.01 to 0.05 μm in total.
FIG. 3 is a cross-sectional view schematically showing a motor commutator member according to still another embodiment of the present invention. Thus, it is sufficient that the thickness of the intermediate layer 2 at the location of the coating 3 made of Sn or Sn alloy formed at the junction with the winding coil is in the range of 0.01 to 0.05 μm. The intermediate layer thickness other than the joint is not limited to the above range.

上記中間層およびSn層は、厚さ調整や均一に形成するのが容易であり、かつ酸化膜や大気汚染等を極力抑えるよう形成する必要があるため、めっき法で形成するのが望ましい。めっき法においては、例えば溶融めっき、電気めっき、無電解めっき等が挙げられるが、膜厚制御性、生産リードタイム、製造コスト、生産の容易性などを考慮すると、電気めっき法で行うのが最も好ましい。電気めっき法であれば、上記被覆厚においてもバラツキの程度が少なくでき、表面汚染が少ないために低接触抵抗といったモータ特性が良好であり、特にスポット接合強度が安定した信頼性のある整流子片を製造することができる。   The intermediate layer and the Sn layer are preferably formed by a plating method because it is easy to adjust the thickness and to be formed uniformly and to form an oxide film and air pollution as much as possible. Examples of the plating method include hot-dip plating, electroplating, electroless plating, etc. In consideration of film thickness controllability, production lead time, manufacturing cost, ease of production, etc., the most preferable method is electroplating. preferable. If the electroplating method is used, the degree of variation in the coating thickness can be reduced, and since the surface contamination is small, the motor characteristics such as low contact resistance are good, and particularly a reliable commutator piece with stable spot bonding strength. Can be manufactured.

最表面にあるSn層に関して、層形成のままの状態で整流子部材にプレス成形することももちろん可能であるが、Sn層を形成後に溶融処理を施すことも有効である。溶融処理を行うことによって、Sn皮膜から出現しやすいヒゲ状生成物(ウイスカ)の発生する危険性を低減させることができ、またプレス時の粉落ち抑制の効果がある。
このようにして形成された整流子材料をモータに使用することによって、モータ特性を損なうことなくスポット接合強度が高く、かつ信頼性の高いモータを提供することができる。
Of course, the Sn layer on the outermost surface can be press-molded into the commutator member while the layer is still formed, but it is also effective to perform a melting treatment after forming the Sn layer. By performing the melting treatment, it is possible to reduce the risk of generation of a whisker-like product (whisker) that is likely to appear from the Sn film, and there is an effect of suppressing powder falling during pressing.
By using the commutator material formed in this way for a motor, it is possible to provide a motor with high spot junction strength and high reliability without impairing motor characteristics.

本発明を実施例等に基づいてさらに詳細に説明するが、本発明はこれに制限されるものではない。
[実施例1〜12および比較例1〜4]
連続的に条材にめっきを施すラインにおいて、基体とする厚さ0.3mm、幅21mmのCDA合金規格C14410の銅基合金条を通板して、電解脱脂、酸洗の前処理を行った後、表1に示しためっきを施し、各実施例および比較例のモータ用整流子材料を得た。
Sn層の溶融処理方法としては、LPGを0.3l/min.、大気を6l/min.の流量で混合したガスをバーナーで燃焼させ、不活性ガス雰囲気中でSn層を溶融した後、25℃水中にて凝固した。
また従来例については、同上基体にSnをクラッド法によって形成したモータ用整流子材を得た。
The present invention will be described in more detail based on examples and the like, but the present invention is not limited thereto.
[Examples 1 to 12 and Comparative Examples 1 to 4]
In a line for continuously plating the strip material, a copper based alloy strip of CDA alloy standard C14410 having a thickness of 0.3 mm and a width of 21 mm as a base plate was passed through, and pretreatment for electrolytic degreasing and pickling was performed. Then, the plating shown in Table 1 was performed to obtain commutator materials for motors of Examples and Comparative Examples.
As a melting method of the Sn layer, a gas in which LPG is mixed at a flow rate of 0.3 l / min. And air at a flow rate of 6 l / min. Is burned with a burner, and the Sn layer is melted in an inert gas atmosphere. Solidified in water at 0 ° C.
As for the conventional example, a commutator material for motors was obtained in which Sn was formed on the substrate by the clad method.

上記の材料をモータ用整流子部材にプレス加工し、整流子部材とエナメル被覆導線とを下記の条件においてスポット接合を行った。
[スポット接合条件]
第1加圧時の荷重:95N
第2加圧時の荷重:9.8N
スポット接合加熱量:0.65kW
The above material was pressed into a commutator member for a motor, and the commutator member and the enamel-coated conductive wire were spot-bonded under the following conditions.
[Spot welding conditions]
Load at first pressurization: 95N
Load during second pressurization: 9.8N
Spot bonding heating amount: 0.65 kW

その接合強度について、JIS Z3136に記載の方法で各実施例、比較例および従来例の接合強度の測定を5回行い、その測定結果(平均強度)およびバラツキの指標である標準偏差について、あわせて表1に示した。
ここで、実用的にモータ整流子部材として使用できるスポット強度は0.15MPa以上であり、評価は(接合強度−標準偏差)の値が0.15以上のものが実用レベルである。
Regarding the bonding strength, the bonding strength of each example, comparative example and conventional example was measured five times by the method described in JIS Z3136, and the measurement results (average strength) and the standard deviation which is an index of variation were combined. It is shown in Table 1.
Here, the spot strength that can be practically used as a motor commutator member is 0.15 MPa or more, and the evaluation is (practical level) having a value of (joining strength-standard deviation) of 0.15 or more.

使用した各めっきのめっき液組成およびめっき条件は下記に示す。
[Niめっき]
めっき液:NiSO 240g/l、NiCl 45g/l、HBO 30g/l
めっき条件:電流密度 5A/dm、温度 50℃
[Coめっき]
めっき液:CoSO 400g/l、NaCl 20g/l、HBO 40g/l
めっき条件:電流密度 5A/dm、温度 30℃
The plating solution composition and plating conditions for each plating used are shown below.
[Ni plating]
Plating solution: NiSO 4 240 g / l, NiCl 2 45 g / l, H 3 BO 3 30 g / l
Plating conditions: current density 5 A / dm 2 , temperature 50 ° C.
[Co plating]
Plating solution: CoSO 4 400 g / l, NaCl 20 g / l, H 3 BO 3 40 g / l
Plating conditions: current density 5 A / dm 2 , temperature 30 ° C.

[Snめっき]
めっき液:SnSO 80g/l、HSO 80g/l、添加剤513Y(商品名、石原薬品(株)製) 30ml/l
めっき条件:電流密度 2A/dm、温度 40℃
[光沢Snめっき]
めっき液:SnSO 40g/l、HSO 100g/l、添加剤513Y(商品名、石原薬品(株)製) 30ml/l
めっき条件:電流密度 2A/dm、温度 20℃
[Sn plating]
Plating solution: SnSO 4 80 g / l, H 2 SO 4 80 g / l, additive 513Y (trade name, manufactured by Ishihara Pharmaceutical Co., Ltd.) 30 ml / l
Plating conditions: current density 2 A / dm 2 , temperature 40 ° C.
[Glossy Sn plating]
Plating solution: SnSO 4 40 g / l, H 2 SO 4 100 g / l, additive 513Y (trade name, manufactured by Ishihara Pharmaceutical Co., Ltd.) 30 ml / l
Plating conditions: current density 2 A / dm 2 , temperature 20 ° C.

Figure 0005203011
Figure 0005203011

表1によれば、Ni下地めっき厚が0.01〜0.05μmの範囲では、整流子のスポット接合強度が大きく、バラツキも少なく接合強度が安定していることが分かる。
一方、下地めっき厚が薄すぎたり厚すぎたりすると、接合強度が小さかったり、バラツキ度合いが大きくなったりしており、実用レベルの1.5kgを安定して超えないと判断できる。さらに、従来例では、接合強度は十分確保されているものの、バラツキ度合いが大きく接合信頼性にかける。
この結果、本発明の実施例はスポット接合強度に優れ、信頼性の高い整流子材料が得られることが分かる。
According to Table 1, it can be seen that when the Ni base plating thickness is in the range of 0.01 to 0.05 μm, the spot bonding strength of the commutator is large, the variation is small, and the bonding strength is stable.
On the other hand, if the base plating thickness is too thin or too thick , the bonding strength is small or the degree of variation is large, and it can be determined that the practical level of 1.5 kg is not stably exceeded. Further, in the conventional example, although the bonding strength is sufficiently ensured, the degree of variation is large and the bonding reliability is applied.
As a result, it can be seen that the embodiment of the present invention provides a highly reliable commutator material having excellent spot bonding strength.

図1は、本発明の実施形態にかかるモータ用整流子部材を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing a motor commutator member according to an embodiment of the present invention. 図2は、本発明の別の実施形態にかかるモータ用整流子部材を模式的に示す断面図である。FIG. 2 is a cross-sectional view schematically showing a commutator member for a motor according to another embodiment of the present invention. 図3は、本発明のさらに別の実施形態にかかるモータ用整流子部材を模式的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing a commutator member for a motor according to still another embodiment of the present invention. 図4は、小型モータの整流子部の概略斜視図である。FIG. 4 is a schematic perspective view of the commutator portion of the small motor. 図5は、図4に示す整流子部の側面から見た側面図であり、巻き線コイル端部を接合した状態を示している。FIG. 5 is a side view seen from the side of the commutator portion shown in FIG. 4 and shows a state in which the winding coil ends are joined. 図6(a)は、バリスタを取り付けた整流子部の側面図で、図6(b)はバリスタのみの斜視図である。FIG. 6A is a side view of the commutator portion to which the varistor is attached, and FIG. 6B is a perspective view of only the varistor. 図7は、巻線コイル端部を接合した状態を示す断面図である。FIG. 7 is a cross-sectional view showing a state in which winding coil end portions are joined.

符号の説明Explanation of symbols

1 基体
2 中間層
3 SnまたはSn合金の皮膜
4 整流子摺接部
5 二層目中間層
11 シャフト
12 整流子芯
13 整流子片
14 整流子足部
15 巻線コイル端部
16 バリスタ
17 電極
DESCRIPTION OF SYMBOLS 1 Substrate 2 Intermediate layer 3 Sn or Sn alloy film 4 Commutator sliding contact portion 5 Second layer intermediate layer 11 Shaft 12 Commutator core 13 Commutator piece 14 Commutator foot 15 Winding coil end 16 Varistor 17 Electrode

Claims (4)

CuまたはCu合金からなる基体上に、巻線コイルとの接合部にSnまたはSn合金からなる皮膜が形成されたモータ用整流子部材であって、CuまたはCu合金からなる基体とSnまたはSn合金からなる皮膜の中間に、Ni若しくはNi合金またはCo若しくはCo合金が中間層として設けられ、その中間層厚さが0.01〜0.05μmであることを特徴とするモータ用整流子部材。
A commutator member for a motor in which a coating made of Sn or Sn alloy is formed on a joint made with Cu or Cu alloy on a base made of Cu or Cu alloy, and the base made of Cu or Cu alloy and Sn or Sn alloy A motor commutator member, wherein Ni or a Ni alloy or Co or a Co alloy is provided as an intermediate layer in the middle of a film made of a material, and the intermediate layer thickness is 0.01 to 0.05 μm.
前記基体上に形成される中間層およびSnまたはSn合金からなる皮膜がめっき法で形成されていることを特徴とする、請求項1記載のモータ用整流子部材。   2. The commutator member for a motor according to claim 1, wherein the intermediate layer formed on the substrate and the film made of Sn or Sn alloy are formed by a plating method. 前記SnまたはSn合金からなる皮膜が、溶融処理を施されていることを特徴とする、請求項1または2記載のモータ用整流子部材。   The commutator member for a motor according to claim 1 or 2, wherein the film made of Sn or an Sn alloy is melt-treated. 請求項1〜3のいずれか1項記載のモータ用整流子部材を搭載したモータ。   The motor carrying the commutator member for motors of any one of Claims 1-3.
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