JP5193212B2 - 電子デバイス用の絶縁ワイヤを備えたヒンジ - Google Patents

電子デバイス用の絶縁ワイヤを備えたヒンジ Download PDF

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Publication number
JP5193212B2
JP5193212B2 JP2009532383A JP2009532383A JP5193212B2 JP 5193212 B2 JP5193212 B2 JP 5193212B2 JP 2009532383 A JP2009532383 A JP 2009532383A JP 2009532383 A JP2009532383 A JP 2009532383A JP 5193212 B2 JP5193212 B2 JP 5193212B2
Authority
JP
Japan
Prior art keywords
wire
hinge
copolymer
hfp
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009532383A
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English (en)
Japanese (ja)
Other versions
JP2010507272A (ja
JP2010507272A5 (cg-RX-API-DMAC7.html
Inventor
ロバート・ディー・ケニー
フィリップ・エス・スミス
パトリシア・エイ・トゥーリー
スンダル・キルナガール・ヴェンカタラーマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2010507272A publication Critical patent/JP2010507272A/ja
Publication of JP2010507272A5 publication Critical patent/JP2010507272A5/ja
Application granted granted Critical
Publication of JP5193212B2 publication Critical patent/JP5193212B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/26—Tetrafluoroethene
    • C08F214/262—Tetrafluoroethene with fluorinated vinyl ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/26—Tetrafluoroethene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Waveguides (AREA)
  • Telephone Set Structure (AREA)
  • Communication Cables (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
JP2009532383A 2006-10-12 2007-10-10 電子デバイス用の絶縁ワイヤを備えたヒンジ Expired - Fee Related JP5193212B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US85122406P 2006-10-12 2006-10-12
US60/851,224 2006-10-12
PCT/US2007/021606 WO2008045452A2 (en) 2006-10-12 2007-10-10 Hinge with insulated wire for electronic devices

Publications (3)

Publication Number Publication Date
JP2010507272A JP2010507272A (ja) 2010-03-04
JP2010507272A5 JP2010507272A5 (cg-RX-API-DMAC7.html) 2010-11-11
JP5193212B2 true JP5193212B2 (ja) 2013-05-08

Family

ID=39125109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009532383A Expired - Fee Related JP5193212B2 (ja) 2006-10-12 2007-10-10 電子デバイス用の絶縁ワイヤを備えたヒンジ

Country Status (5)

Country Link
US (1) US7592406B2 (cg-RX-API-DMAC7.html)
EP (1) EP2074636A2 (cg-RX-API-DMAC7.html)
JP (1) JP5193212B2 (cg-RX-API-DMAC7.html)
CN (1) CN101523512A (cg-RX-API-DMAC7.html)
WO (1) WO2008045452A2 (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308505B2 (en) * 2009-12-09 2012-11-13 Scott Hatton Guarded coaxial cable assembly
US10290381B2 (en) 2011-12-30 2019-05-14 Ge-Hitachi Nuclear Energy Americas Llc Method and apparatus for a high-temperature deposition solution injector
US9761336B2 (en) 2012-12-20 2017-09-12 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector, system including the same, and method of injecting using the same
US20150175757A1 (en) 2013-12-20 2015-06-25 E I Du Pont De Nemours And Company Oriented fluoropolymer film
US10515729B2 (en) * 2015-11-04 2019-12-24 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector including an insulating liner, system including the same, and method of injecting using the same
JP6947067B2 (ja) * 2018-02-06 2021-10-13 トヨタ自動車株式会社 平型剛体配線及びこれを搭載した車両
WO2022181829A1 (ja) * 2021-02-26 2022-09-01 ダイキン工業株式会社 含フッ素共重合体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029868A (en) * 1976-03-10 1977-06-14 E. I. Du Pont De Nemours And Company Tetrafluoroethylene terpolymers
USH130H (en) * 1986-02-18 1986-09-02 E. I. Du Pont De Nemours And Company Tetrafluoroethylene hexafluoropropylene copolymer modified with perfluoropropyl vinyl ether
US5677404A (en) 1996-02-23 1997-10-14 E. I. Du Pont De Nemours And Company Tetrafluoroethylene terpolymer
US5700889A (en) * 1995-08-17 1997-12-23 E. I. Du Pont De Nemours And Company Process for polymerization of copolymers of tetrafluoroethylene and hexafluoropropylene
US7130591B2 (en) * 2000-06-30 2006-10-31 Matsushita Electric Industrial Co., Ltd. Cell phone
US7251512B2 (en) * 2002-05-13 2007-07-31 Nec Corporation Water-proof collapsible cellular terminal apparatus
US20050230145A1 (en) * 2002-08-06 2005-10-20 Toku Ishii Thin-diameter coaxial cable and method of producing the same
EP1629702A1 (en) * 2003-06-02 2006-03-01 Showa Denko K.K. Flexible wiring board and flex-rigid wiring board
JP2005322462A (ja) * 2004-05-07 2005-11-17 Fujikura Ltd 極細同軸ケーブルおよびそのケーブルのアセンブリ
US20060089108A1 (en) 2004-10-26 2006-04-27 Isaac Lagnado Mechanical latch including RF antenna

Also Published As

Publication number Publication date
JP2010507272A (ja) 2010-03-04
CN101523512A (zh) 2009-09-02
EP2074636A2 (en) 2009-07-01
US7592406B2 (en) 2009-09-22
WO2008045452A3 (en) 2008-07-24
US20080090065A1 (en) 2008-04-17
WO2008045452A2 (en) 2008-04-17

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