JP5190696B2 - フレキシブルプリント配線板シートの製造方法 - Google Patents
フレキシブルプリント配線板シートの製造方法 Download PDFInfo
- Publication number
- JP5190696B2 JP5190696B2 JP2008262028A JP2008262028A JP5190696B2 JP 5190696 B2 JP5190696 B2 JP 5190696B2 JP 2008262028 A JP2008262028 A JP 2008262028A JP 2008262028 A JP2008262028 A JP 2008262028A JP 5190696 B2 JP5190696 B2 JP 5190696B2
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- frame portion
- sheet
- flexible printed
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 238000007747 plating Methods 0.000 claims description 162
- 239000000047 product Substances 0.000 claims description 74
- 229910052802 copper Inorganic materials 0.000 claims description 68
- 239000010949 copper Substances 0.000 claims description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 43
- 230000008569 process Effects 0.000 claims description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 28
- 239000010931 gold Substances 0.000 claims description 28
- 229910052737 gold Inorganic materials 0.000 claims description 28
- 239000010408 film Substances 0.000 claims description 27
- 239000010409 thin film Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000013067 intermediate product Substances 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000004080 punching Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008262028A JP5190696B2 (ja) | 2008-10-08 | 2008-10-08 | フレキシブルプリント配線板シートの製造方法 |
TW98133782A TWI430723B (zh) | 2008-10-08 | 2009-10-06 | 可撓性印刷配線板片及其製造方法 |
CN200910179036.XA CN101720170B (zh) | 2008-10-08 | 2009-10-09 | 挠性印刷布线板片及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008262028A JP5190696B2 (ja) | 2008-10-08 | 2008-10-08 | フレキシブルプリント配線板シートの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010093074A JP2010093074A (ja) | 2010-04-22 |
JP5190696B2 true JP5190696B2 (ja) | 2013-04-24 |
Family
ID=42255521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008262028A Active JP5190696B2 (ja) | 2008-10-08 | 2008-10-08 | フレキシブルプリント配線板シートの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5190696B2 (zh) |
CN (1) | CN101720170B (zh) |
TW (1) | TWI430723B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5494128B2 (ja) * | 2010-03-31 | 2014-05-14 | 大日本印刷株式会社 | 支持枠付回路基板およびその製造方法 |
KR101141358B1 (ko) * | 2010-07-29 | 2012-05-03 | 삼성전기주식회사 | 인쇄 회로 기판 및 인쇄 회로 기판의 제조 방법 |
CN102776551B (zh) * | 2012-07-04 | 2015-11-25 | 中国电子科技集团公司第四十一研究所 | 一种硬质微带电路电镀夹具 |
CN105792509A (zh) * | 2014-12-22 | 2016-07-20 | 北大方正集团有限公司 | 一种阻抗线的制作方法、阻抗线以及线路板 |
CN106102317A (zh) * | 2016-06-28 | 2016-11-09 | 广东欧珀移动通信有限公司 | Pcb板及具有其的移动终端 |
JP6943617B2 (ja) * | 2017-05-16 | 2021-10-06 | 住友電気工業株式会社 | プリント配線板用基材及びプリント配線板の製造方法 |
CN109496080B (zh) * | 2018-10-08 | 2021-04-09 | 江苏长电科技股份有限公司 | 一种线路板电镀工艺方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003253496A (ja) * | 2002-02-26 | 2003-09-10 | Toppan Printing Co Ltd | 電気めっき治具および電気めっき方法 |
JP3843027B2 (ja) * | 2002-03-12 | 2006-11-08 | 日東電工株式会社 | プリント配線板の製造方法 |
JP4312758B2 (ja) * | 2005-12-27 | 2009-08-12 | 日本特殊陶業株式会社 | 配線基板の製造方法、配線基板の中間製品 |
-
2008
- 2008-10-08 JP JP2008262028A patent/JP5190696B2/ja active Active
-
2009
- 2009-10-06 TW TW98133782A patent/TWI430723B/zh not_active IP Right Cessation
- 2009-10-09 CN CN200910179036.XA patent/CN101720170B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2010093074A (ja) | 2010-04-22 |
TWI430723B (zh) | 2014-03-11 |
CN101720170A (zh) | 2010-06-02 |
TW201021644A (en) | 2010-06-01 |
CN101720170B (zh) | 2014-03-12 |
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