JP5190696B2 - フレキシブルプリント配線板シートの製造方法 - Google Patents

フレキシブルプリント配線板シートの製造方法 Download PDF

Info

Publication number
JP5190696B2
JP5190696B2 JP2008262028A JP2008262028A JP5190696B2 JP 5190696 B2 JP5190696 B2 JP 5190696B2 JP 2008262028 A JP2008262028 A JP 2008262028A JP 2008262028 A JP2008262028 A JP 2008262028A JP 5190696 B2 JP5190696 B2 JP 5190696B2
Authority
JP
Japan
Prior art keywords
outer frame
frame portion
sheet
flexible printed
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008262028A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010093074A (ja
Inventor
哲也 下村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Printed Circuits Inc
Priority to JP2008262028A priority Critical patent/JP5190696B2/ja
Priority to TW98133782A priority patent/TWI430723B/zh
Priority to CN200910179036.XA priority patent/CN101720170B/zh
Publication of JP2010093074A publication Critical patent/JP2010093074A/ja
Application granted granted Critical
Publication of JP5190696B2 publication Critical patent/JP5190696B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2008262028A 2008-10-08 2008-10-08 フレキシブルプリント配線板シートの製造方法 Active JP5190696B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008262028A JP5190696B2 (ja) 2008-10-08 2008-10-08 フレキシブルプリント配線板シートの製造方法
TW98133782A TWI430723B (zh) 2008-10-08 2009-10-06 可撓性印刷配線板片及其製造方法
CN200910179036.XA CN101720170B (zh) 2008-10-08 2009-10-09 挠性印刷布线板片及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008262028A JP5190696B2 (ja) 2008-10-08 2008-10-08 フレキシブルプリント配線板シートの製造方法

Publications (2)

Publication Number Publication Date
JP2010093074A JP2010093074A (ja) 2010-04-22
JP5190696B2 true JP5190696B2 (ja) 2013-04-24

Family

ID=42255521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008262028A Active JP5190696B2 (ja) 2008-10-08 2008-10-08 フレキシブルプリント配線板シートの製造方法

Country Status (3)

Country Link
JP (1) JP5190696B2 (zh)
CN (1) CN101720170B (zh)
TW (1) TWI430723B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5494128B2 (ja) * 2010-03-31 2014-05-14 大日本印刷株式会社 支持枠付回路基板およびその製造方法
KR101141358B1 (ko) * 2010-07-29 2012-05-03 삼성전기주식회사 인쇄 회로 기판 및 인쇄 회로 기판의 제조 방법
CN102776551B (zh) * 2012-07-04 2015-11-25 中国电子科技集团公司第四十一研究所 一种硬质微带电路电镀夹具
CN105792509A (zh) * 2014-12-22 2016-07-20 北大方正集团有限公司 一种阻抗线的制作方法、阻抗线以及线路板
CN106102317A (zh) * 2016-06-28 2016-11-09 广东欧珀移动通信有限公司 Pcb板及具有其的移动终端
JP6943617B2 (ja) * 2017-05-16 2021-10-06 住友電気工業株式会社 プリント配線板用基材及びプリント配線板の製造方法
CN109496080B (zh) * 2018-10-08 2021-04-09 江苏长电科技股份有限公司 一种线路板电镀工艺方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003253496A (ja) * 2002-02-26 2003-09-10 Toppan Printing Co Ltd 電気めっき治具および電気めっき方法
JP3843027B2 (ja) * 2002-03-12 2006-11-08 日東電工株式会社 プリント配線板の製造方法
JP4312758B2 (ja) * 2005-12-27 2009-08-12 日本特殊陶業株式会社 配線基板の製造方法、配線基板の中間製品

Also Published As

Publication number Publication date
JP2010093074A (ja) 2010-04-22
TWI430723B (zh) 2014-03-11
CN101720170A (zh) 2010-06-02
TW201021644A (en) 2010-06-01
CN101720170B (zh) 2014-03-12

Similar Documents

Publication Publication Date Title
JP5190696B2 (ja) フレキシブルプリント配線板シートの製造方法
CN110551973B (zh) 蒸镀掩模
CN100392725C (zh) 带电路的悬浮支架基板的制造方法
CN102006716B (zh) 布线电路基板及其制造方法
JP6085168B2 (ja) 回路付きサスペンション基板およびその製造方法
US20150382451A1 (en) Printed circuit board and method of manufacturing printed circuit board
US9955579B2 (en) Printed circuit board having reduced loss of electric signal and method of manufacturing the same
JP2011023063A (ja) サスペンション用基板およびその製造方法
US9295160B2 (en) Printed circuit board and method of manufacturing the same
US20200236791A1 (en) Printed wiring board production method and printed wiring board production apparatus
US20120111608A1 (en) Wired circuit board
TW202207767A (zh) 配線電路基板集合體片材及其製造方法
JP2006253574A (ja) 配線基板の製造方法
JP2016500133A (ja) 電気部品及び電気部品を製造する方法
JP2009117600A (ja) バンプ付き回路配線板の製造方法
JP7203939B2 (ja) 配線回路基板の製造方法
WO2023276510A1 (ja) フレキシブルプリント回路基板及びフレキシブルプリント回路基板の製造方法
JP3340663B2 (ja) 配線一体型板ばねの製造方法
JP4541782B2 (ja) フィルムプローブ及びその製造方法
JP7019657B2 (ja) 配線回路基板の製造方法
US20200378026A1 (en) Substrate plating method
JP5766432B2 (ja) メッキ金属膜基板とその製造方法、及び半導体装置
JP2014038681A (ja) 配線回路基板
CN112788866A (zh) 线路板及表面处理方法
KR20080068157A (ko) 전자회로 기판의 연속패턴 도금방법

Legal Events

Date Code Title Description
A625 Written request for application examination (by other person)

Free format text: JAPANESE INTERMEDIATE CODE: A625

Effective date: 20110527

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120517

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120727

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130117

R150 Certificate of patent or registration of utility model

Ref document number: 5190696

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160208

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250