JP5186908B2 - 加圧システム - Google Patents

加圧システム Download PDF

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Publication number
JP5186908B2
JP5186908B2 JP2007321463A JP2007321463A JP5186908B2 JP 5186908 B2 JP5186908 B2 JP 5186908B2 JP 2007321463 A JP2007321463 A JP 2007321463A JP 2007321463 A JP2007321463 A JP 2007321463A JP 5186908 B2 JP5186908 B2 JP 5186908B2
Authority
JP
Japan
Prior art keywords
chamber
substrate
wafer
pressurizing
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007321463A
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English (en)
Japanese (ja)
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JP2009147033A5 (es
JP2009147033A (ja
Inventor
重人 泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2007321463A priority Critical patent/JP5186908B2/ja
Publication of JP2009147033A publication Critical patent/JP2009147033A/ja
Publication of JP2009147033A5 publication Critical patent/JP2009147033A5/ja
Application granted granted Critical
Publication of JP5186908B2 publication Critical patent/JP5186908B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Wire Bonding (AREA)
JP2007321463A 2007-12-13 2007-12-13 加圧システム Expired - Fee Related JP5186908B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007321463A JP5186908B2 (ja) 2007-12-13 2007-12-13 加圧システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007321463A JP5186908B2 (ja) 2007-12-13 2007-12-13 加圧システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013009694A Division JP5557170B2 (ja) 2013-01-23 2013-01-23 ウエハ張り合わせ装置及びウエハ張り合わせ方法

Publications (3)

Publication Number Publication Date
JP2009147033A JP2009147033A (ja) 2009-07-02
JP2009147033A5 JP2009147033A5 (es) 2011-04-07
JP5186908B2 true JP5186908B2 (ja) 2013-04-24

Family

ID=40917327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007321463A Expired - Fee Related JP5186908B2 (ja) 2007-12-13 2007-12-13 加圧システム

Country Status (1)

Country Link
JP (1) JP5186908B2 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5653232B2 (ja) * 2010-01-19 2015-01-14 秋田県 基板の接合方法および基板接合装置
JP6046007B2 (ja) * 2013-08-29 2016-12-14 東京エレクトロン株式会社 接合システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3497078B2 (ja) * 1998-03-31 2004-02-16 株式会社日立ハイテクインスツルメンツ ダイボンダ
JP2003115503A (ja) * 2001-10-05 2003-04-18 Ricoh Co Ltd 高温処理部品の調整組立装置

Also Published As

Publication number Publication date
JP2009147033A (ja) 2009-07-02

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