JP5183975B2 - エンハンスモード電界効果デバイスおよびその製造方法 - Google Patents
エンハンスモード電界効果デバイスおよびその製造方法 Download PDFInfo
- Publication number
- JP5183975B2 JP5183975B2 JP2007151238A JP2007151238A JP5183975B2 JP 5183975 B2 JP5183975 B2 JP 5183975B2 JP 2007151238 A JP2007151238 A JP 2007151238A JP 2007151238 A JP2007151238 A JP 2007151238A JP 5183975 B2 JP5183975 B2 JP 5183975B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- active layer
- semiconductor device
- passivation layer
- active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
Landscapes
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81166106P | 2006-06-07 | 2006-06-07 | |
| US60/811,661 | 2006-06-07 | ||
| EP06118063.4 | 2006-07-28 | ||
| EP06118063A EP1883115A1 (en) | 2006-07-28 | 2006-07-28 | An enhancement mode field effect device and the method of production thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007329483A JP2007329483A (ja) | 2007-12-20 |
| JP2007329483A5 JP2007329483A5 (enExample) | 2010-03-04 |
| JP5183975B2 true JP5183975B2 (ja) | 2013-04-17 |
Family
ID=38929705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007151238A Active JP5183975B2 (ja) | 2006-06-07 | 2007-06-07 | エンハンスモード電界効果デバイスおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5183975B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009081584A1 (ja) * | 2007-12-26 | 2011-05-06 | 日本電気株式会社 | 半導体装置 |
| US8309987B2 (en) * | 2008-07-15 | 2012-11-13 | Imec | Enhancement mode semiconductor device |
| WO2010118087A1 (en) * | 2009-04-08 | 2010-10-14 | Efficient Power Conversion Corporation | Enhancement mode gan hemt device and method for fabricating the same |
| JP2011082216A (ja) | 2009-10-02 | 2011-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
| JP2011082332A (ja) * | 2009-10-07 | 2011-04-21 | National Chiao Tung Univ | 高電子移動度トランジスタの構造、その構造を含んだデバイス及びその製造方法 |
| JP5724339B2 (ja) | 2010-12-03 | 2015-05-27 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
| JP5596653B2 (ja) * | 2011-10-11 | 2014-09-24 | 日本電信電話株式会社 | 電界効果トランジスタおよびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663156B2 (ja) * | 2001-05-31 | 2011-03-30 | 富士通株式会社 | 化合物半導体装置 |
| JP3690594B2 (ja) * | 2001-07-25 | 2005-08-31 | 日本電信電話株式会社 | ナイトライド系化合物半導体の電界効果トランジスタ |
| JP4865189B2 (ja) * | 2002-02-21 | 2012-02-01 | 古河電気工業株式会社 | GaN系電界効果トランジスタ |
| JP2005086171A (ja) * | 2003-09-11 | 2005-03-31 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JP5248743B2 (ja) * | 2004-06-30 | 2013-07-31 | アイメック | 半導体装置および半導体装置の製造方法 |
-
2007
- 2007-06-07 JP JP2007151238A patent/JP5183975B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007329483A (ja) | 2007-12-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8399911B2 (en) | Enhancement mode field effect device and the method of production thereof | |
| KR102014328B1 (ko) | AlSiN 패시베이션층을 갖는 헤테로-구조 전력 트랜지스터 | |
| JP5785153B2 (ja) | 補償型ゲートmisfet及びその製造方法 | |
| US7956383B2 (en) | Field effect transistor | |
| US8912571B2 (en) | Compound semiconductor device including first film on compound semiconductor layer and second film on first film and method of manufacturing the same | |
| JP5071377B2 (ja) | 化合物半導体装置及びその製造方法 | |
| US9236465B2 (en) | High electron mobility transistor and method of forming the same | |
| JP5670427B2 (ja) | GaNバッファ層におけるドーパント拡散変調 | |
| US10170579B2 (en) | Surface treatment and passivation for high electron mobility transistors | |
| US8624296B1 (en) | High electron mobility transistor including an embedded flourine region | |
| KR102630424B1 (ko) | GaN 스페이서 두께의 향상된 균일성을 위한 선택적 및 비선택적 에칭 층을 갖는 인핸스먼트-모드 GaN 트랜지스터 | |
| US20110108885A1 (en) | Semiconductor device and method of manufacturing a semiconductor device | |
| KR101008272B1 (ko) | 노멀 오프 특성을 갖는 질화물계 고전자 이동도 트랜지스터및 그 제조방법 | |
| CN111883588A (zh) | 用于hemt器件的侧壁钝化 | |
| JP5183975B2 (ja) | エンハンスモード電界効果デバイスおよびその製造方法 | |
| CN110754002B (zh) | 高电子迁移率晶体管 | |
| JP5546104B2 (ja) | GaN系電界効果トランジスタ | |
| JP6966689B2 (ja) | 窒化物半導体装置及びその製造方法 | |
| CN105244377A (zh) | 一种基于硅衬底的hemt器件及其制造方法 | |
| TW201419530A (zh) | 化合物半導體裝置及其製造方法 | |
| US10629475B2 (en) | Semiconductor device with two-part insulation structure within non-active region | |
| EP1865561B1 (en) | An enhancement mode field effect device and the method of production thereof | |
| TW202329461A (zh) | 高電子遷移率電晶體及其製作方法 | |
| US20240030329A1 (en) | Semiconductor device and method for manufacturing the same | |
| TW202017181A (zh) | 增強型高電子移動率電晶體與相關之製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071004 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100115 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100115 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121026 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121030 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121212 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130108 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130116 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5183975 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160125 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |