JP5183975B2 - エンハンスモード電界効果デバイスおよびその製造方法 - Google Patents

エンハンスモード電界効果デバイスおよびその製造方法 Download PDF

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Publication number
JP5183975B2
JP5183975B2 JP2007151238A JP2007151238A JP5183975B2 JP 5183975 B2 JP5183975 B2 JP 5183975B2 JP 2007151238 A JP2007151238 A JP 2007151238A JP 2007151238 A JP2007151238 A JP 2007151238A JP 5183975 B2 JP5183975 B2 JP 5183975B2
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Japan
Prior art keywords
layer
active layer
semiconductor device
passivation layer
active
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JP2007151238A
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English (en)
Japanese (ja)
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JP2007329483A (ja
JP2007329483A5 (enExample
Inventor
ジョフ・デルライン
ステファン・ボエイケンス
マリアンヌ・ジェルメン
フスターフ・ボルフス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Katholieke Universiteit Leuven
Interuniversitair Microelektronica Centrum vzw IMEC
Original Assignee
Katholieke Universiteit Leuven
Interuniversitair Microelektronica Centrum vzw IMEC
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Priority claimed from EP06118063A external-priority patent/EP1883115A1/en
Application filed by Katholieke Universiteit Leuven, Interuniversitair Microelektronica Centrum vzw IMEC filed Critical Katholieke Universiteit Leuven
Publication of JP2007329483A publication Critical patent/JP2007329483A/ja
Publication of JP2007329483A5 publication Critical patent/JP2007329483A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/693Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials

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  • Junction Field-Effect Transistors (AREA)
JP2007151238A 2006-06-07 2007-06-07 エンハンスモード電界効果デバイスおよびその製造方法 Active JP5183975B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US81166106P 2006-06-07 2006-06-07
US60/811,661 2006-06-07
EP06118063.4 2006-07-28
EP06118063A EP1883115A1 (en) 2006-07-28 2006-07-28 An enhancement mode field effect device and the method of production thereof

Publications (3)

Publication Number Publication Date
JP2007329483A JP2007329483A (ja) 2007-12-20
JP2007329483A5 JP2007329483A5 (enExample) 2010-03-04
JP5183975B2 true JP5183975B2 (ja) 2013-04-17

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JP2007151238A Active JP5183975B2 (ja) 2006-06-07 2007-06-07 エンハンスモード電界効果デバイスおよびその製造方法

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JP (1) JP5183975B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009081584A1 (ja) * 2007-12-26 2011-05-06 日本電気株式会社 半導体装置
US8309987B2 (en) * 2008-07-15 2012-11-13 Imec Enhancement mode semiconductor device
WO2010118087A1 (en) * 2009-04-08 2010-10-14 Efficient Power Conversion Corporation Enhancement mode gan hemt device and method for fabricating the same
JP2011082216A (ja) 2009-10-02 2011-04-21 Fujitsu Ltd 化合物半導体装置及びその製造方法
JP2011082332A (ja) * 2009-10-07 2011-04-21 National Chiao Tung Univ 高電子移動度トランジスタの構造、その構造を含んだデバイス及びその製造方法
JP5724339B2 (ja) 2010-12-03 2015-05-27 富士通株式会社 化合物半導体装置及びその製造方法
JP5596653B2 (ja) * 2011-10-11 2014-09-24 日本電信電話株式会社 電界効果トランジスタおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4663156B2 (ja) * 2001-05-31 2011-03-30 富士通株式会社 化合物半導体装置
JP3690594B2 (ja) * 2001-07-25 2005-08-31 日本電信電話株式会社 ナイトライド系化合物半導体の電界効果トランジスタ
JP4865189B2 (ja) * 2002-02-21 2012-02-01 古河電気工業株式会社 GaN系電界効果トランジスタ
JP2005086171A (ja) * 2003-09-11 2005-03-31 Fujitsu Ltd 半導体装置及びその製造方法
JP5248743B2 (ja) * 2004-06-30 2013-07-31 アイメック 半導体装置および半導体装置の製造方法

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JP2007329483A (ja) 2007-12-20

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