JP5178561B2 - パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法 - Google Patents
パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法 Download PDFInfo
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- JP5178561B2 JP5178561B2 JP2009025473A JP2009025473A JP5178561B2 JP 5178561 B2 JP5178561 B2 JP 5178561B2 JP 2009025473 A JP2009025473 A JP 2009025473A JP 2009025473 A JP2009025473 A JP 2009025473A JP 5178561 B2 JP5178561 B2 JP 5178561B2
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009025473A JP5178561B2 (ja) | 2009-02-06 | 2009-02-06 | パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法 |
TW099101362A TWI413768B (zh) | 2009-02-06 | 2010-01-19 | 圖案檢查方法、圖案檢查裝置、光罩製造方法、及圖案轉寫方法 |
KR1020100010807A KR101216803B1 (ko) | 2009-02-06 | 2010-02-05 | 패턴 검사 방법, 패턴 검사 장치, 포토마스크 제조 방법, 및 패턴 전사 방법 |
CN201010113612.3A CN101799433B (zh) | 2009-02-06 | 2010-02-05 | 图案检查方法及装置、光掩模制造方法以及图案转印方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009025473A JP5178561B2 (ja) | 2009-02-06 | 2009-02-06 | パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010181296A JP2010181296A (ja) | 2010-08-19 |
JP5178561B2 true JP5178561B2 (ja) | 2013-04-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009025473A Active JP5178561B2 (ja) | 2009-02-06 | 2009-02-06 | パターン検査方法、パターン検査装置、フォトマスク製造方法、およびパターン転写方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5178561B2 (zh) |
KR (1) | KR101216803B1 (zh) |
CN (1) | CN101799433B (zh) |
TW (1) | TWI413768B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5593209B2 (ja) * | 2010-11-30 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | 検査装置 |
KR101306289B1 (ko) * | 2011-09-15 | 2013-09-09 | (주) 인텍플러스 | 평판 패널 검사방법 |
KR102097342B1 (ko) | 2013-06-21 | 2020-04-07 | 삼성디스플레이 주식회사 | 증착 마스크의 바코드 인식 방법 및 그 인식 장치 |
TWI557407B (zh) * | 2014-03-05 | 2016-11-11 | 晶元光電股份有限公司 | 晶粒檢測方法 |
CN106290390B (zh) * | 2015-05-24 | 2019-11-26 | 上海微电子装备(集团)股份有限公司 | 缺陷检测装置及方法 |
JP6669481B2 (ja) * | 2015-12-04 | 2020-03-18 | 株式会社ブイ・テクノロジー | 検査装置 |
US10295477B2 (en) * | 2017-01-26 | 2019-05-21 | Shin-Etsu Chemical Co., Ltd. | Methods for defect inspection, sorting, and manufacturing photomask blank |
KR102037395B1 (ko) * | 2017-09-25 | 2019-10-28 | 동우 화인켐 주식회사 | 투과 광학계 검사 장치 및 이를 이용한 필름 결함 검사 방법 |
CN110412052B (zh) * | 2019-08-12 | 2022-02-15 | 艾尔玛科技股份有限公司 | 一种曲面热压印质量检测方法及系统 |
CN114445402B (zh) * | 2022-04-02 | 2022-06-24 | 深圳市龙图光电有限公司 | 半导体芯片用掩模版贴膜精度检测方法及检测装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3443197B2 (ja) * | 1995-01-19 | 2003-09-02 | 松下電器産業株式会社 | フォトマスクの検査方法およびフォトマスクの検査装置 |
US5777729A (en) * | 1996-05-07 | 1998-07-07 | Nikon Corporation | Wafer inspection method and apparatus using diffracted light |
US6195460B1 (en) | 1996-11-01 | 2001-02-27 | Yamatake Corporation | Pattern extraction apparatus |
KR100486270B1 (ko) | 2002-10-07 | 2005-04-29 | 삼성전자주식회사 | 웨이퍼 상의 임계 선폭을 제어할 수 있는 포토 마스크제조 방법, 이에 의한 포토 마스크 및 이를 이용한 노광방법 |
JP2005291874A (ja) * | 2004-03-31 | 2005-10-20 | Hoya Corp | パターンのムラ欠陥検査方法及び装置 |
JP4661441B2 (ja) * | 2005-08-05 | 2011-03-30 | 凸版印刷株式会社 | 周期構造の欠陥測定装置 |
CN1940540A (zh) * | 2005-09-30 | 2007-04-04 | Hoya株式会社 | 缺陷检查装置和缺陷检查方法 |
JP4993934B2 (ja) * | 2006-03-31 | 2012-08-08 | Hoya株式会社 | パターン欠陥検査方法、フォトマスクの製造方法、及び表示デバイス用基板の製造方法 |
JP2008170371A (ja) * | 2007-01-15 | 2008-07-24 | Hoya Corp | パターン欠陥検査方法、及びパターン欠陥検査装置 |
JP4869129B2 (ja) * | 2007-03-30 | 2012-02-08 | Hoya株式会社 | パターン欠陥検査方法 |
US7882480B2 (en) * | 2007-06-04 | 2011-02-01 | Asml Netherlands B.V. | System and method for model-based sub-resolution assist feature generation |
JP5135899B2 (ja) * | 2007-06-07 | 2013-02-06 | 凸版印刷株式会社 | 周期性パターンのムラ検査方法及びムラ検査装置 |
-
2009
- 2009-02-06 JP JP2009025473A patent/JP5178561B2/ja active Active
-
2010
- 2010-01-19 TW TW099101362A patent/TWI413768B/zh active
- 2010-02-05 CN CN201010113612.3A patent/CN101799433B/zh active Active
- 2010-02-05 KR KR1020100010807A patent/KR101216803B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101799433B (zh) | 2014-04-16 |
CN101799433A (zh) | 2010-08-11 |
KR101216803B1 (ko) | 2012-12-28 |
TWI413768B (zh) | 2013-11-01 |
TW201033606A (en) | 2010-09-16 |
KR20100090657A (ko) | 2010-08-16 |
JP2010181296A (ja) | 2010-08-19 |
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