JP5175692B2 - Support apparatus, support method, dicing apparatus, and dicing method - Google Patents

Description

  The present invention relates to a support device and a support method for supporting a semiconductor wafer, a dicing device for a semiconductor wafer, and a dicing method.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into semiconductor chips (dicing). A dicing apparatus to perform is known (for example, see Patent Document 1). The dicing apparatus described in Patent Document 1 includes a chuck table that sucks and supports the wafer from the dicing tape (mounting tape) side attached to the back surface of the wafer, and a ring frame that surrounds the wafer and is fixed to the dicing tape. It comprises a clamping mechanism for holding, and a cutting means (rotating blade) for cutting the wafer held on the chuck table.

  On the other hand, in the pre-dicing process in the semiconductor manufacturing process, the back surface of the wafer is ground to reduce the thickness of the semiconductor chip. In this grinding process, the inside of the wafer is ground deeper than the outer edge. Thus, a semiconductor wafer is known in which the inner side is formed thinner than the outer edge, that is, the outer edge has an annular convex part protruding in the thickness direction, and the inner part is surrounded by the convex part. For example, see Patent Document 2).

Japanese Patent No. 3424052 JP 2007-19379 A

  By the way, in the wafer which has a convex part in the outer edge part as described in patent document 2, a mounting tape is not affixed to the concave part of the wafer, and a space is formed between the concave part of the wafer and the tape. When such a wafer is diced by a conventional dicing apparatus as described in Patent Document 1, since the chips that have been cut and separated are not bonded to the tape, individual chips can be held. Instead, the chip is scattered.

  The present invention has been devised paying attention to the inconveniences as described above, and its purpose is to prevent chip scattering during dicing even for a wafer having a convex portion at the outer edge. A semiconductor wafer support device, a support method, a dicing device, and a dicing method are provided.

  In order to achieve the above object, the supporting device of the present invention has an annular convex portion protruding in the thickness direction at the outer edge portion and the convex portion with respect to a semiconductor wafer having a concave portion inside surrounded by the convex portion. A support device for supporting the semiconductor wafer in a state where a space is formed between the protruding side of the mounting tape and the mounting tape and the mounting tape is affixed from the mounting tape side, the position corresponding to the convex portion An outer support for supporting, an inner support for supporting a position corresponding to the recess, a suction means provided on at least the inner support among the outer support and the inner support, and a hole penetrating the space. A configuration is adopted in which a hole forming means formed in the mounting tape is provided.

In this case, in the support device of the present invention, the outer support and the inner support are provided so as to be relatively movable with respect to the semiconductor wafer, and the inner support protrudes toward the semiconductor wafer from the outer support. By doing so, it is preferable that the mounting tape corresponding to the space is adhered to the bottom surface of the recess of the semiconductor wafer.
Furthermore, in the support device of the present invention, the suction means provided on the inner support body is configured to have a plurality of suction ports, and the hole forming means is formed from at least a part of the plurality of suction ports. It is preferable to have a needle-like member provided so as to protrude and retract toward the semiconductor wafer.

  In addition, the supporting method of the present invention has an annular convex portion protruding in the thickness direction on the outer edge portion and a semiconductor wafer having a concave portion on the inner side surrounded by the convex portion, from the protruding side of the convex portion. A support method for supporting the semiconductor wafer in a state in which a space is formed between the concave portion and the mounting tape from the mounting tape side, the outer position corresponding to the convex portion, and the concave portion A corresponding inner position, and a hole penetrating into the space is formed in the mounting tape at the inner position, the gas inside the space is sucked out through the formed hole, and the mounting tape is The semiconductor wafer is adhered to the bottom surface of the concave portion of the semiconductor wafer.

On the other hand, the dicing apparatus of the present invention has an annular convex portion protruding in the thickness direction at the outer edge portion and a semiconductor wafer having a concave portion on the inner side surrounded by the convex portion from the protruding side of the convex portion. A dicing apparatus for cutting the semiconductor wafer in a state where a space is formed between the concave portion and the mounting tape is affixed, the supporting means for supporting the semiconductor wafer from the mounting tape side, and the supporting means Cutting means for cutting the semiconductor wafer supported in a predetermined shape, the support means, an outer support for supporting a position corresponding to the convex portion,
An inner support that supports a position corresponding to the recess, a suction means provided on at least the inner support of the outer support and the inner support, and a hole that forms a hole penetrating the space in the mounting tape. And forming means.

  Further, the dicing method of the present invention has an annular convex portion protruding in the thickness direction at the outer edge portion and a semiconductor wafer having a concave portion on the inner side surrounded by the convex portion from the protruding side of the convex portion. A dicing method for cutting the semiconductor wafer in a state where a space is formed between the recess and the mounting tape is affixed, and an outer position corresponding to the protrusion and an inner position corresponding to the recess Supporting from the mounting tape side, forming a hole penetrating into the space in the mounting tape at the inner position, sucking out the gas inside the space through the formed hole, The semiconductor wafer is bonded to the bottom surface of the recess of the semiconductor wafer and then cut into a predetermined shape.

  According to the present invention as described above, a semiconductor wafer having an annular convex portion on the outer edge portion is supported from the mounting tape side, and a hole penetrating into a space surrounded by the concave portion of the semiconductor wafer and the mounting tape is formed. Forming on the mounting tape, sucking out the gas inside the space, and bonding the mounting tape to the bottom surface of the recess of the semiconductor wafer can prevent the chips from being scattered when the semiconductor wafer is cut by subsequent dicing. Therefore, by using the dicing apparatus provided with the support device of the present invention, the semiconductor wafer can be diced smoothly and reliably, and the efficiency of the semiconductor manufacturing process can be improved.

Further, in the support device, the outer support and the inner support are provided so as to be relatively movable with respect to the semiconductor wafer, and the inner support is protruded so that the mounting tape is adhered to the bottom surface of the recess of the semiconductor wafer. By doing so, the mounting tape can be reliably bonded to the bottom surface of the recess of the semiconductor wafer. Further, by performing dicing while the bottom surface of the concave portion of the semiconductor wafer is supported by the inner support, the dicing process can be stably performed and the wafer cutting accuracy can be increased.
Furthermore, if the needle-like member is projected from the suction port of the suction means toward the semiconductor wafer to form a hole in the mounting tape, the gas inside the space can be reliably and efficiently sucked from the hole. it can. Also, by configuring the needle-like member to pass through a part of the suction port, it is possible to prevent the formation of holes at the positions of other suction ports, and the mounting tape is sucked through this suction port. Thus, the semiconductor wafer can be securely held.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a partial cross-sectional view showing a semiconductor wafer dicing apparatus 1 according to the first embodiment.
In FIG. 1, a dicing apparatus 1 cuts a semiconductor wafer having a circuit formed on a surface thereof and divides it into chips WG (see FIG. 6) having a predetermined shape. Here, for example, as described in Patent Document 2, the wafer W is an annular convex portion protruding in the thickness direction (rear surface side) by grinding the outer edge portion thinner than the other portions. WA is formed on the outer edge portion, and a concave portion WB composed of a concave bottom surface WC and a concave peripheral surface WD is formed on the inner side surrounded by the convex portion WA, and the surface thereof (on the opposite side of the grinding surface, FIG. The upper surface is a semiconductor wafer having a circuit formed on WE. A protective sheet S that protects the circuit surface in a grinding process or the like is attached to the front surface WE of the wafer W, and the back surface of the wafer W is formed with a convex portion WA so as to form a space W1 with the concave portion WB. A mounting tape T is attached to the top surface WF and integrated with the ring frame RF.

  The dicing apparatus 1 includes a support device 2 as a support means for supporting the wafer W from the mounting tape T side, a peeling device 3 for peeling the protective sheet S from the surface WE of the wafer W, and a wafer W supported by the support device 2. And a cutting device 4 as a cutting means for cutting the wire into a predetermined shape.

  As shown in FIG. 5, the peeling device 3 attaches a peeling tape RT to the protective sheet S attached to the surface WE of the wafer W while the wafer W is supported by the support device 2, and this peeling tape RT The protective sheet S is peeled from the wafer W by being gripped and pulled by a chuck device C that is moved by a driving means (not shown).

  As shown in FIG. 6, the cutting device 4 is provided on the surface WE side of the wafer W, and includes a rotating blade 41 that cuts the wafer W. The rotary blade 41 is controlled in its height position so as to form a notch reaching the mounting tape T from the surface WE of the wafer W, and moves along a predetermined path along the surface WE of the wafer W. Control is performed so that W is divided into individual chips WG.

  The support device 2 corresponds to the outer table 5 that is an outer support that supports a position corresponding to the convex portion WA of the wafer W from the top surface WF side, and the concave portion WB of the wafer W that is provided inside the outer table 5. The inner table 6 is an inner support body that supports the position to be supported, and the supporting means 9 that supports the supported wafer W from the surface WE side of the wafer W via the protective sheet S. Further, a moving device 7 for moving the inner table 6 up and down relative to the outer table 5 is provided below the inner table 6, and the mounting tape T penetrates into the space W <b> 1 inside the inner table 6. A hole forming device 8 is provided as hole forming means for forming the hole T1 (see FIG. 3). Further, the outer table 5 and the inner table 6 are provided with a plurality of suction ports 51 and 61 as suction means for sucking and supporting the wafer W via the mounting tape T, respectively.

  The outer table 5 includes an outer table main body 52 having a substantially square shape in plan view. A chamber portion 54 having an annular shape in plan view is provided on the inner periphery thereof, and is substantially the same as the bottom surface WC of the recess W of the wafer W in the center. A concave portion 53 is formed, which is composed of a concave bottom surface 53A having a shape (substantially circular) and a concave peripheral surface 53B. The plurality of suction ports 51 communicate with the upper surface of the outer table main body 52 from the chamber portion 54 and are connected to a suction device (not shown) via the chamber portion 54 and support the wafer W via the mounting tape T. It is configured to be able to.

  The inner table 6 is composed of an inner table body 62 having a substantially circular shape in plan view provided with a slight gap (a gap larger than the thickness of the mounting tape T) between the outer peripheral surface 53B of the outer table 5 and Inside, a chamber portion 63 having a substantially circular shape in plan view is provided. The plurality of suction ports 61 communicate with the upper surface of the inner table main body 62 from the chamber portion 63 and are connected to a suction device (not shown) via a pipe 64 provided at the lower portion of the chamber portion 63. The wafer W is configured to be sucked and supported via the tape T.

  The support unit 9 is provided so as to be separated from and approachable to the wafer W via a driving unit (not shown), and is configured to suck and support the wafer W through the protective sheet S by the suction port 91.

  The moving device 7 includes a linear motion motor 71 fixed to the bottom surface 53 </ b> A of the concave portion of the outer table 5, and the inner table 6 and the outer table 6 are fixed to the output shaft 72 of the linear motion motor 71. 5 and the inner table 6 can be projected and retracted toward the wafer W.

  The hole forming device 8 projects from a linear motion motor 81 fixed to the bottom surface of the chamber 63, a disk-shaped lifting plate 83 fixed to the output shaft 82 of the linear motion motor 81, and the upper surface of the lifting plate 83. And a plurality of needle-like members 84 provided. The plurality of needle-like members 84 are provided so as to protrude and retract from the upper surface of the inner table body 62 toward the wafer W as the elevating plate 83 is raised and lowered by the linear motion motor 81. The plurality of needle-like members 84 are provided corresponding to the appropriate number of suction ports 61 among the plurality of suction ports 61 of the inner table 6. Accordingly, the needle-like member 84 is configured to form a hole T1 (see FIG. 3) penetrating the space W1 in the mounting tape T.

In the dicing apparatus 1 described above, as a procedure for dicing the wafer W, first, the wafer W to which the protective sheet S is attached and integrated with the ring frame RF via the mounting tape T is as shown in FIG. The concave bottom surface WC is set on the support device 2 so that the center of the inner table 6 coincides. Then, the mounting tape T is sucked by the suction ports 51 and 61 of the outer table 5 and the inner table 6 to support the wafer W.
Next, as shown in FIG. 2, the support means 9 is lowered to suck and support the wafer W through the protective sheet S through the suction port 91. Then, the hole forming device 8 drives the linear motion motor 81 to raise the elevating plate 83 and the needle-like member 84, and causes the needle-like member 84 to protrude from the suction port 61 of the inner table 6 so as to leave a space on the mounting tape T. A hole T1 (see FIG. 3) penetrating W1 is formed. Thereafter, as shown in FIG. 3, the hole forming device 8 lowers the lifting plate 83 and the needle-like member 84 and pulls out the needle-like member 84 from the hole T1. At this time, since the wafer W is sucked by the support means 9, the concave bottom surface WC is not sucked toward the mounting tape T side. That is, the suction force of the support means 9 is set larger than the suction force of the inner table 6.

  Next, as shown in FIG. 4, when the linear motor 71 is driven to raise the inner table 6 and the mounting tape T area corresponding to the concave portion WB is pushed up, the concave portion WB of the wafer W and the mounting tape T While the gas inside the space W1 surrounded by is sucked out from the suction port 61 through the hole T1, the pushed mounting tape T comes into contact with and adheres to the recess bottom surface WC. When it is detected that the output torque of the linear motion motor 71 has reached a predetermined value, the moving device 7 stops driving the linear motion motor 71 and maintains its position. In this way, the mounting tape T is pushed up by the inner table 6 while sucking out the gas inside the space W1, so that the mounting tape T is adhered to the concave bottom surface WC by the adhesive force, and the wafer W is mounted. It is sucked and supported by the inner table 6 through the tape T. When the mounting tape T is adhered to the concave portion WB of the wafer W, the support means 9 is retracted from the upper position of the wafer W.

Next, as shown in FIG. 5, the peeling device 3 attaches a peeling tape RT to the end of the protective sheet S, holds the peeling tape RT with the chuck device C, and pulls it with a driving means (not shown). The protective sheet S is peeled from the wafer W. After the protective sheet S is peeled from the wafer W in this way, the peeling device 3 is retracted from above the wafer W.
Next, as shown in FIG. 6, the cutting device 4 forms a cut reaching the mounting tape T from the surface WE side of the wafer W by the rotating blade 41, and separates the wafer W into a plurality of chips WG. At this time, the individual chips WG are bonded to the mounting tape T, so that there is no problem of scattering.

According to the present embodiment as described above, the following effects are obtained.
That is, by cutting the gas inside the space W1 from the hole T1 formed in the mounting tape T by the hole forming device 8 and adhering the mounting tape T pushed up by the inner table 6 to the bottom surface WC of the recess, the cutting device 4 When the wafer W is cut into individual pieces, the bottom surface of the recess WC does not rise or sink, so that the wafer W can be divided into individual pieces and the scattering of the chips WG can be prevented. it can.
Further, since the recess bottom surface WC is sucked and supported by the inner table 6 via the mounting tape T, the recess bottom surface WC is pulled together with the protection sheet S in the peeling process of the protection sheet S, and the wafer W is damaged. Can be prevented.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, in the above-described embodiment, the example in which the support device 2 is used for the dicing device 1 has been described. However, in addition to the dicing device 1, the support device (support method) of the present invention is, for example, attaching an adhesive sheet to a semiconductor wafer. The present invention can be applied to various devices for manufacturing semiconductors, such as a sheet sticking device for peeling off and a sheet peeling device for peeling an adhesive sheet from a semiconductor wafer.

Moreover, the protective sheet S, the support means 9, the ring frame RF, and the suction port 51 of the outer table 5 of the embodiment are not essential requirements of the present invention and can be omitted.
Furthermore, after the wafer W is cut with the protective sheet S attached, the protective sheet S remaining on each chip WG may be peeled off by the peeling device 3. In this case, the peeling tape RT may be a size that can be attached to all the cut protective sheets S.
Further, the peeling device 3 can be omitted.
Furthermore, in the said embodiment, although it comprised so that the inner table 6 might raise / lower with respect to the outer table 5 in the support apparatus 2, you may comprise so that the outer table 5 may raise / lower with respect to the inner table 6. The inner table 6 and the outer table 5 may both be raised and lowered.
Further, the inner table 6 may be provided integrally with the outer table 5, and even in that case, the gas inside the space W1 is sucked out from the hole T1 of the mounting tape T by the suction port 61, so that it can be mounted on the bottom surface WC of the recess. The tape T can be adhered.
Further, the wafer W may be a silicon wafer or a compound wafer.
Moreover, you may comprise a hole formation means so that a hole may be formed by heat, such as a laser beam and a heating wire, a rotary drill.
Further, the cutting means 4 may be constituted by a cutter using a laser beam in addition to the rotating blade 41.

1 is a partial cross-sectional view of a semiconductor wafer dicing apparatus according to an embodiment of the present invention. Operation | movement explanatory drawing of the dicing apparatus of FIG. Explanatory drawing of the principal part of the dicing apparatus of FIG. Operation | movement explanatory drawing following FIG. 3 of the dicing apparatus of FIG. Operation | movement explanatory drawing following FIG. 4 of the dicing apparatus of FIG. Operation | movement explanatory drawing following FIG. 5 of the dicing apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Dicing apparatus 2 Support apparatus (support means)
4 Cutting device (cutting means)
5 Outer table (outer support)
6 Inner table (inner support)
8 Hole forming device (hole forming means)
51, 61 Suction port (suction means)
84 Needle-shaped member T Mount tape T1 Hole W Wafer (Semiconductor wafer)
W1 Space WA Convex WB Concave WC Concave bottom

Claims (6)

A space is formed between the projecting side of the convex portion and the concave portion with respect to a semiconductor wafer having an annular convex portion protruding in the thickness direction at the outer edge portion and a concave portion inside the convex portion. A supporting device for supporting the semiconductor wafer in a state where the mounting tape is attached from the mounting tape side,
An outer support that supports a position corresponding to the convex portion;
An inner support that supports a position corresponding to the recess;
A suction means provided on at least the inner support of the outer support and the inner support;
And a hole forming means for forming a hole penetrating the space in the mounting tape.   The outer support and the inner support are provided so as to be movable relative to the semiconductor wafer, and the inner support protrudes toward the semiconductor wafer from the outer support so that the mount corresponding to the space is provided. The supporting device according to claim 1, wherein the tape for use is adhered to the bottom surface of the recess of the semiconductor wafer.   The suction means provided on the inner support is configured to have a plurality of suction ports, and the hole forming means can project and retract from at least a part of the plurality of suction ports toward the semiconductor wafer. The support device according to claim 1, wherein the support device is configured to have a needle-like member provided on the support. A space is formed between the projecting side of the convex portion and the concave portion with respect to a semiconductor wafer having an annular convex portion protruding in the thickness direction at the outer edge portion and a concave portion inside the convex portion. A mounting method for supporting the semiconductor wafer in a state where the mounting tape is affixed from the mounting tape side,
Supporting the outer position corresponding to the convex part and the inner position corresponding to the concave part,
Forming a hole that penetrates the space in the mounting tape at the inner position;
A support method, wherein the gas inside the space is sucked out through the formed hole, and the mounting tape is adhered to the bottom surface of the recess of the semiconductor wafer. A space is formed between the projecting side of the convex portion and the concave portion with respect to a semiconductor wafer having an annular convex portion protruding in the thickness direction at the outer edge portion and a concave portion inside the convex portion. A dicing apparatus for cutting the semiconductor wafer with the mounting tape attached thereto,
Supporting means for supporting the semiconductor wafer from the mounting tape side;
Cutting means for cutting the semiconductor wafer supported by the support means into a predetermined shape,
The support means is
An outer support that supports a position corresponding to the convex portion;
An inner support that supports a position corresponding to the recess;
A suction means provided on at least the inner support of the outer support and the inner support;
A dicing apparatus comprising: a hole forming means for forming a hole penetrating the space in the mounting tape. A space is formed between the projecting side of the convex portion and the concave portion with respect to a semiconductor wafer having an annular convex portion protruding in the thickness direction at the outer edge portion and a concave portion inside the convex portion. A dicing method for cutting the semiconductor wafer in a state where the mounting tape is attached,
Supporting the outer position corresponding to the convex part and the inner position corresponding to the concave part from the mounting tape side, respectively.
Forming a hole that penetrates the space in the mounting tape at the inner position;
A dicing method comprising: sucking out gas in the space through the formed hole, adhering the mounting tape to the bottom surface of the recess of the semiconductor wafer, and then cutting the semiconductor wafer into a predetermined shape.

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