JP5166762B2 - 帯電防止フィルム - Google Patents
帯電防止フィルム Download PDFInfo
- Publication number
- JP5166762B2 JP5166762B2 JP2007102623A JP2007102623A JP5166762B2 JP 5166762 B2 JP5166762 B2 JP 5166762B2 JP 2007102623 A JP2007102623 A JP 2007102623A JP 2007102623 A JP2007102623 A JP 2007102623A JP 5166762 B2 JP5166762 B2 JP 5166762B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- antistatic
- resin
- layer
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000010410 layer Substances 0.000 claims description 55
- 239000002216 antistatic agent Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 239000011342 resin composition Substances 0.000 claims description 32
- 229920001038 ethylene copolymer Polymers 0.000 claims description 15
- 229920000570 polyether Polymers 0.000 claims description 15
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 13
- 229920005672 polyolefin resin Polymers 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000012792 core layer Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 238000010559 graft polymerization reaction Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229920006026 co-polymeric resin Polymers 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000011109 contamination Methods 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 7
- 230000000740 bleeding effect Effects 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- -1 polyoxyethylene chain Polymers 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229920002614 Polyether block amide Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- CGPRUXZTHGTMKW-UHFFFAOYSA-N ethene;ethyl prop-2-enoate Chemical compound C=C.CCOC(=O)C=C CGPRUXZTHGTMKW-UHFFFAOYSA-N 0.000 description 1
- ALSOCDGAZNNNME-UHFFFAOYSA-N ethene;hex-1-ene Chemical compound C=C.CCCCC=C ALSOCDGAZNNNME-UHFFFAOYSA-N 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007102623A JP5166762B2 (ja) | 2007-04-10 | 2007-04-10 | 帯電防止フィルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007102623A JP5166762B2 (ja) | 2007-04-10 | 2007-04-10 | 帯電防止フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008260141A JP2008260141A (ja) | 2008-10-30 |
| JP2008260141A5 JP2008260141A5 (enExample) | 2010-05-20 |
| JP5166762B2 true JP5166762B2 (ja) | 2013-03-21 |
Family
ID=39983008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007102623A Active JP5166762B2 (ja) | 2007-04-10 | 2007-04-10 | 帯電防止フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5166762B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101062360B1 (ko) | 2008-10-31 | 2011-09-05 | 광 석 서 | 계면 접착력이 개선된 3층 구조의 대전방지 쉬트 및 이를 이용한 트레이 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194521A (ja) * | 2003-12-11 | 2005-07-21 | Sumitomo Chemical Co Ltd | 接着フィルムの製造方法 |
| JP4317161B2 (ja) * | 2004-05-31 | 2009-08-19 | 三洋化成工業株式会社 | 帯電防止性多層フィルム |
| JP4526937B2 (ja) * | 2004-12-02 | 2010-08-18 | アキレス株式会社 | 半導体製造テープ用帯電防止基材フィルム |
-
2007
- 2007-04-10 JP JP2007102623A patent/JP5166762B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008260141A (ja) | 2008-10-30 |
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