JP5154105B2 - 高いフィルファクターを持つ画素を備えるイメージセンサー及びイメージセンサーの形成方法 - Google Patents

高いフィルファクターを持つ画素を備えるイメージセンサー及びイメージセンサーの形成方法 Download PDF

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JP5154105B2
JP5154105B2 JP2007060401A JP2007060401A JP5154105B2 JP 5154105 B2 JP5154105 B2 JP 5154105B2 JP 2007060401 A JP2007060401 A JP 2007060401A JP 2007060401 A JP2007060401 A JP 2007060401A JP 5154105 B2 JP5154105 B2 JP 5154105B2
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photoelectric conversion
common
active region
image sensor
adjacent
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JP2007243197A (ja
JP2007243197A5 (enExample
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錫河 李
徳炯 李
宗哲 愼
康福 李
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Priority claimed from KR1020060022726A external-priority patent/KR100688589B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Element Separation (AREA)
  • Facsimile Heads (AREA)
JP2007060401A 2006-03-10 2007-03-09 高いフィルファクターを持つ画素を備えるイメージセンサー及びイメージセンサーの形成方法 Active JP5154105B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020060022726A KR100688589B1 (ko) 2006-03-10 2006-03-10 필 팩터가 증대된 이미지 센서 및 그의 제조방법
KR10-2006-0022726 2006-03-10
US11/593,663 2006-11-07
US11/593,663 US7667183B2 (en) 2006-03-10 2006-11-07 Image sensor with high fill factor pixels and method for forming an image sensor

Publications (3)

Publication Number Publication Date
JP2007243197A JP2007243197A (ja) 2007-09-20
JP2007243197A5 JP2007243197A5 (enExample) 2010-04-22
JP5154105B2 true JP5154105B2 (ja) 2013-02-27

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JP2007060401A Active JP5154105B2 (ja) 2006-03-10 2007-03-09 高いフィルファクターを持つ画素を備えるイメージセンサー及びイメージセンサーの形成方法

Country Status (4)

Country Link
US (1) US7667183B2 (enExample)
JP (1) JP5154105B2 (enExample)
DE (1) DE102007012279B4 (enExample)
TW (1) TWI360223B (enExample)

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JP4976765B2 (ja) * 2006-07-07 2012-07-18 ルネサスエレクトロニクス株式会社 固体撮像装置
KR100819711B1 (ko) * 2006-12-27 2008-04-04 동부일렉트로닉스 주식회사 씨모스 이미지 센서 및 그 제조 방법
JP4420039B2 (ja) 2007-02-16 2010-02-24 ソニー株式会社 固体撮像装置
DE102007045448B4 (de) 2007-09-24 2025-01-30 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Bildsensor
JP4630907B2 (ja) * 2008-03-03 2011-02-09 シャープ株式会社 固体撮像装置および電子情報機器
US7781716B2 (en) 2008-03-17 2010-08-24 Eastman Kodak Company Stacked image sensor with shared diffusion regions in respective dropped pixel positions of a pixel array
US7977716B2 (en) 2008-03-17 2011-07-12 Fairchild Imaging, Inc. CMOS image sensor with improved fill-factor and reduced dark current
US8077236B2 (en) 2008-03-20 2011-12-13 Aptina Imaging Corporation Method and apparatus providing reduced metal routing in imagers
KR101503682B1 (ko) * 2008-04-18 2015-03-20 삼성전자 주식회사 공유 픽셀형 이미지 센서 및 그 제조 방법
US20090272881A1 (en) * 2008-05-05 2009-11-05 Xiangli Li Apparatus, method, and system providing pixel having increased fill factor
KR20100091107A (ko) * 2009-02-09 2010-08-18 소니 주식회사 고체 촬상 장치, 카메라, 전자 기기, 및, 고체 촬상 장치의 제조 방법
JP5564909B2 (ja) * 2009-11-30 2014-08-06 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP6164951B2 (ja) 2013-06-28 2017-07-19 キヤノン株式会社 光電変換装置の製造方法、光電変換装置、及び撮像システム
JP6198485B2 (ja) 2013-06-28 2017-09-20 キヤノン株式会社 光電変換装置、及び撮像システム
FR3030884B1 (fr) * 2014-12-19 2016-12-30 Stmicroelectronics (Grenoble 2) Sas Structure de pixel a multiples photosites
US10861892B2 (en) * 2018-11-21 2020-12-08 Bae Systems Information And Electronic Systems Integration Inc. Low-light-level CMOS image sensor pixel
KR102642977B1 (ko) * 2019-02-13 2024-03-05 에스케이하이닉스 주식회사 이미지 센싱 장치 및 그 제조 방법

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US6160281A (en) * 1997-02-28 2000-12-12 Eastman Kodak Company Active pixel sensor with inter-pixel function sharing
US6107655A (en) * 1997-08-15 2000-08-22 Eastman Kodak Company Active pixel image sensor with shared amplifier read-out
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US6657665B1 (en) * 1998-12-31 2003-12-02 Eastman Kodak Company Active Pixel Sensor with wired floating diffusions and shared amplifier
US6617174B2 (en) * 1999-06-08 2003-09-09 Tower Semiconductor Ltd. Fieldless CMOS image sensor
US6486913B1 (en) * 1999-09-30 2002-11-26 Intel Corporation Pixel array with shared reset circuitry
JP4216976B2 (ja) * 1999-12-06 2009-01-28 富士フイルム株式会社 固体撮像装置およびその製造方法
JP4721380B2 (ja) * 2000-04-14 2011-07-13 キヤノン株式会社 固体撮像装置および撮像システム
US20030038336A1 (en) * 2001-08-22 2003-02-27 Mann Richard A. Semiconductor device for isolating a photodiode to reduce junction leakage and method of formation
JP4442157B2 (ja) * 2003-08-20 2010-03-31 ソニー株式会社 光電変換装置及び固体撮像装置
KR100561003B1 (ko) * 2003-09-30 2006-03-16 동부아남반도체 주식회사 이미지 센서 및 그 제조방법
KR20050038849A (ko) 2003-10-23 2005-04-29 매그나칩 반도체 유한회사 이미지 소자의 제조 방법
JP4230406B2 (ja) * 2004-04-27 2009-02-25 富士通マイクロエレクトロニクス株式会社 固体撮像装置
US7427798B2 (en) * 2004-07-08 2008-09-23 Micron Technology, Inc. Photonic crystal-based lens elements for use in an image sensor

Also Published As

Publication number Publication date
DE102007012279A1 (de) 2007-09-20
TW200737507A (en) 2007-10-01
JP2007243197A (ja) 2007-09-20
DE102007012279B4 (de) 2015-11-05
US7667183B2 (en) 2010-02-23
US20070210239A1 (en) 2007-09-13
TWI360223B (en) 2012-03-11

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