JP5153271B2 - Adhesive tape - Google Patents

Description

  The present invention relates to a pressure-sensitive adhesive tape having an adhesive force necessary for an adherend and excellent in heat resistance, and particularly capable of being easily peeled off without causing an adhesive residue on the adherend when peeled off. .

  In recent years, pressure-sensitive adhesive tapes have been widely used for manufacturing electronic parts, for structures, for automobiles, and the like. In these applications, a large stress is applied at the time of use, and since the adhesive is often used at a high temperature, the adhesive is required to have high cohesive strength and heat resistance. In particular, in an adhesive tape used in a manufacturing process for electronic parts, semiconductor devices, flat displays such as LCDs and PDPs, the process is usually performed at a high temperature of 100 ° C. or more. For this reason, there is a demand for an adhesive tape that exhibits sufficient adhesive strength and cohesive strength at high temperatures and can be easily peeled off from an adherend after use.

  In order to exhibit sufficient adhesive strength and cohesive strength at high temperatures in an adhesive tape, it has been studied to add various inorganic fillers to the adhesive (for example, see Patent Documents 1 and 2). However, when the adhesive tape is peeled and removed from the adherend at the time of rework or after the manufacturing process is finished, the adhesive containing the inorganic filler easily causes cohesive failure, resulting in adhesive residue on the adherend.

  Also, the method of cleaning and removing foreign matter using an adhesive tape (see, for example, Patent Document 3) is an excellent method for effectively removing foreign matter, but the adhesive is too strongly adhered to the cleaning site and peeled off. There is no fear of it, and there is a possibility of causing adhesive residue on the cleaning site and causing contamination. Moreover, when adhesive force is reduced in order to prevent adhesive residue, there exists a problem that it is inferior to the dust removal property of an important foreign material.

Furthermore, recently, the size of foreign matter that is a problem in various substrate processing apparatuses has become a submicron (1 μm or less) level, and it is not easy to reliably remove foreign matter of this size.
JP 2005-344008 A JP 2005-154581 A JP-A-10-154686

  An object of the present invention is to have a necessary adhesive force to an adherend, remove submicron level foreign matters without causing contamination on the cleaning site, have excellent heat resistance, and have sufficient adhesive force even at high temperatures. An object of the present invention is to provide an adhesive tape that exhibits cohesive force and can be easily peeled off without causing adhesive residue on the adherend when it is peeled off from the adherend after use.

  The pressure-sensitive adhesive tape of the present invention comprises an aggregate layer of oblique columnar structures protruding on the surface of the support at an elevation angle of less than 90 degrees, and the aspect ratio of the oblique columnar structures is 1 or more.

  In a preferred embodiment, the oblique columnar structure has a length of 100 nm or more.

In a preferred embodiment, the number of the oblique columnar structures per unit area on the surface of the support is 1 × 10 ⁸ / cm ² or more.

  In a preferred embodiment, the water contact angle on the surface of the aggregate layer is 10 degrees or less.

  In a preferred embodiment, the aggregate layer is a cleaning layer.

  In preferable embodiment, the adhesive tape of this invention is used for electronic component manufacture.

  According to the present invention, it has a necessary adhesive force to the adherend, can remove foreign matter at a submicron level without causing contamination on the cleaning site, has excellent heat resistance, and has a sufficient adhesive force even at high temperatures. It is possible to provide a pressure-sensitive adhesive tape that exhibits cohesive force and can be easily peeled off without causing adhesive residue when peeled off from the adherend after use.

  The above effects are obtained by providing a large number of oblique columnar structures protruding obliquely at an elevation angle from the surface of less than 90 degrees on the surface of the support, and setting the aspect ratio of the oblique columnar structures to 1 or more. It can be expressed by causing the aggregated layer of the oblique columnar structures to function as an adhesive.

  FIG. 1 is a schematic cross-sectional view of an adhesive tape that is a preferred embodiment of the present invention. The pressure-sensitive adhesive tape 100 includes a support 10 and an aggregate layer 20 of diagonal columnar structures 30. The aggregate layer 20 of the oblique columnar structure 30 may be provided on the entire surface of the support 10, or may be provided only on a part of the surface of the support 10. The aggregate layer 20 of the oblique columnar structure 30 may be provided on one side of the support 10 or may be provided on both sides.

  The aggregate layer 20 of diagonal columnar structures is an aggregate layer of a plurality of diagonal columnar structures 30. The aggregate layer 20 of the oblique columnar structures can act as an adhesive layer or a cleaning layer.

  Adhesive strength between the pressure-sensitive adhesive tape of the present invention and the adherend is achieved by a three-dimensional entanglement effect with the adherend and a van der Faels force effect accompanying an increase in surface area by forming an aggregate layer of a plurality of oblique columnar structures. It is possible to provide a pressure-sensitive adhesive tape that expresses and can be efficiently removed particularly against fine foreign matters of submicron or less.

  As shown in FIG. 2, the oblique columnar structure 30 protrudes from the surface of the support 10 with an elevation angle α of less than 90 degrees from the surface. The elevation angle α is preferably 10 to 85 degrees, more preferably 20 to 80 degrees, and still more preferably 30 to 70 degrees. Since the elevation angle α is less than 90 degrees, the pressure-sensitive adhesive tape of the present invention has a necessary adhesive force to the adherend, and can remove submicron level foreign matters without causing contamination at the cleaning site. It can be easily peeled off when peeled off from the adherend later.

  The oblique columnar structure 30 may protrude substantially straight from the surface of the support 10 at an elevation angle α as shown in FIG. 3, or the initial elevation angle from the surface of the support 10 as shown in FIG. 4. It may have a bent shape after protruding at α.

  The oblique columnar structure has a columnar structure. The columnar structure includes not only a strictly columnar structure but also a substantially columnar structure. For example, a columnar structure, a polygonal columnar structure, a cone-shaped structure, a fibrous structure, and the like are preferable. Further, the cross-sectional shape of the columnar structure may be uniform or non-uniform throughout the columnar structure.

  The oblique columnar structure has an aspect ratio of 1 or more. In the present invention, the “aspect ratio” means the ratio of the length (A) of the oblique columnar structure to the length (B) of the diameter of the thickest part of the oblique columnar structure (however, (A) and (B ) Represents the same unit). The aspect ratio is preferably 2 to 20, more preferably 3 to 10. When the aspect ratio of the oblique columnar structure is in the above range, fine foreign matters, preferably, submicron level foreign matters can be easily, reliably and sufficiently removed. Such an effect is considered to be because van der Waals force acts between the aggregated layer of the oblique columnar structures and the cleaning site (adhered body).

  The length of the oblique columnar structure is preferably 100 nm or more, more preferably 200 to 100,000 nm, still more preferably 300 to 10,000 nm, and particularly preferably 500 to 5000 nm. When the length of the oblique columnar structure is in the above range, fine foreign matters, preferably, submicron level foreign matters can be easily, reliably and sufficiently removed. Such an effect is considered to be because van der Waals force acts between the aggregated layer of the oblique columnar structures and the cleaning site (adhered body).

  The diameter of the oblique columnar structure is preferably 1000 nm or less, more preferably 10 to 500 nm, and still more preferably 100 to 300 nm. When the diameter of the oblique columnar structure is in the above range, fine foreign matters, preferably, submicron level foreign matters can be easily, reliably and sufficiently removed. Such an effect is considered to be because van der Waals force acts between the aggregated layer of the oblique columnar structures and the cleaning site (adhered body).

  The length and diameter of the oblique columnar structure may be measured by any appropriate measurement method. From the viewpoint of ease of measurement, preferably, measurement using a scanning electron microscope (SEM) is mentioned. In the measurement using a scanning electron microscope (SEM), for example, the adhesive tape of the present invention is attached to an SEM observation sample stage, and the length and diameter of the oblique columnar structure are obtained by observing from the side surface direction. Is possible.

The number of diagonal columnar structures per unit area on the surface of the support is preferably 1 × 10 ⁸ / cm ² or more, more preferably 1 × 10 ⁸ to 1 × 10 ¹² / cm ² , and even more preferably 3. × ¹⁰ 8 ~1 × ^{10 10} this is a / cm ^2. When the number of the oblique columnar structures per unit area on the surface of the support is in the above range, fine foreign matters, preferably, submicron level foreign matters can be easily, reliably and sufficiently removed. Such an effect is considered because Van der Waals force acts between the aggregate layer of the oblique columnar structure and the cleaning site (adhered body).

  Any appropriate material can be adopted as the support in the pressure-sensitive adhesive tape of the present invention. For example, polyimide (PI) resin, polyester (PET) resin, polyethylene naphthalate (PEN) resin, polyethersulfone (PES) resin, polyetheretherketone (PEEK) resin, polyarylate (PAR) Sheets made of organic polymer resins such as resin, aramid resin, or liquid crystal polymer (LCP) resin, fluorine resin, acrylic resin, epoxy resin, polyolefin resin, polyvinyl chloride, EVA, PMMA, POM, etc. In addition to the substrate, a substrate made of an inorganic material such as a quartz substrate, a glass substrate, or a silicon wafer is also used. Among these, polyimide resin sheets and silicon wafers are particularly suitable because they have heat resistance.

  In the pressure-sensitive adhesive tape of the present invention, the surface of the support is preliminarily subjected to an etching treatment such as plasma (sputtering) treatment, corona discharge, ultraviolet irradiation, flame, electron beam irradiation, chemical conversion, oxidation, or organic undercoating treatment, and obliquely applied. You may improve the adhesiveness of a columnar structure and a support body. Further, if necessary, dust removal may be performed by solvent cleaning or ultrasonic cleaning.

  Any appropriate thickness can be adopted as the thickness of the support. For example, the sheet shape is preferably 10 to 250 μm, and the substrate shape is preferably 0.1 to 10 mm. The support may be a single layer or a laminate of two or more layers.

Arbitrary appropriate material can be employ | adopted as a diagonal columnar structure in the adhesive tape of this invention. For example, metals such as aluminum, zinc, gold, silver, platinum, nickel, chromium, copper, platinum, indium, inorganic materials such as sapphire, silicon carbide (SiC), gallium nitride (GaN), silicon monoxide (SiO ), Silicon dioxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (CeO ₂ ), chromium oxide (Cr ₂ O ₃ ), gallium oxide (Ga ₂ O ₃ ), hafnium oxide (HfO ₂ ), Tantalum pentoxide (Ta ₂ O ₅ ), yttrium oxide (Y ₂ O ₃ ), tungsten oxide (WO ₃ ), titanium monoxide (TiO), titanium dioxide (TiO ₂ ), titanium pentoxide (Ti ₃ O ₅ ), nickel oxide (NiO), magnesium oxide _{(MgO), ITO (In 2} O 3 + SnO 2), five niobium oxide _{(Nb 2 O} 5) Zinc oxide (ZnO), oxides such as zirconium oxide (ZrO ₂₎ may be used. In addition, fluorine-based materials such as polyimide, aluminum fluoride, calcium fluoride, cerium fluoride, lanthanum fluoride, lithium fluoride, magnesium fluoride, neodymium fluoride, and sodium fluoride, and resins such as silicone can be used. These materials may be used alone or in combination of two or more, or may have a multilayer structure of two or more layers. In particular, oxides such as silicon dioxide (SiO ₂ ) and titanium dioxide (TiO ₂ ), which are hydrophilic materials, are preferably used.

  The water contact angle on the surface of the aggregate layer in the pressure-sensitive adhesive tape of the present invention is preferably 10 degrees or less, more preferably 8 degrees or less, and still more preferably 5 degrees or less. When the water contact angle on the surface of the aggregate layer is in the above range, the wettability of the surface of the aggregate layer is improved, the adhesiveness with the adherend is increased, and the adhesive force and the foreign substance removability are increased.

The surface free energy of the surface of the aggregate layer in the pressure-sensitive adhesive tape of the present invention is preferably 70 mJ / m ² or more, more preferably 73 mJ / m ² or more, and further preferably 75 mJ / m ² or more. When the surface free energy of the surface of the aggregate layer is in the above range, the wettability of the surface of the aggregate layer is improved, the adhesiveness with the adherend is increased, and the adhesive force and the foreign matter removability are increased.

Here, the surface free energy is obtained by measuring the contact angle with water and methylene iodide on the solid surface, and measuring the measured value and the surface free energy value of the contact angle measurement liquid (known from the literature). Substituting into the following formula (1) derived from the above formula and the extended Fowkes formula, and solving the obtained two formulas as simultaneous linear equations means the surface free energy value of the solid obtained.
(1 + cos θ) r _L = 2√ (r _S ^d r _L ^d ) + 2√ (r _S ^v r _L ^v ) (1)
However, each symbol in the formula is as follows.
θ: contact angle r _L : surface free energy r _L ^{d of} contact angle measurement liquid: dispersion force component r _L ^{v at} rL: polar force component at rL r _S ^d : dispersion force component at solid surface free energy r _S ^v : Polar force component in surface free energy of solids

  Arbitrary appropriate conditions can be employ | adopted for the thickness of the aggregate layer in the adhesive tape of this invention in the range which can achieve the objective of this invention. Preferably it is 100 nm or more, More preferably, it is 200-10000 nm, More preferably, it is 500-5000 nm. Within such a range, fine foreign matters, preferably, submicron level foreign matters can be easily, reliably and sufficiently removed.

  The aggregate layer preferably has substantially no adhesive force. Here, having substantially no tackiness means that there is no pressure-sensitive tack that represents the function of tackiness when the essence of tackiness is friction that is resistance to slippage. This pressure-sensitive tack is expressed in the range where the elastic modulus of the adhesive substance is up to 1 MPa, for example, according to the Dahlquist standard.

  In order to protect the surface of the aggregate layer in the pressure-sensitive adhesive tape of the present invention, a protective film may be used. The protective film can be peeled off at an appropriate stage such as at the time of use. As the protective film, a protective film formed of any appropriate material can be used. For example, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate that has been stripped with silicone-based, long-chain alkyl-based, fluorine-based, fatty acid amide-based, silica-based release agents, etc. Examples of the plastic film include a copolymer, an ionomer resin, an ethylene / (meth) acrylic acid copolymer, an ethylene / (meth) acrylic acid ester copolymer, polystyrene, and polycarbonate. In addition, since a polyolefin resin film such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, etc. has releasability without using a release treatment agent, it can be used alone as a protective film.

  The thickness of the protective film is preferably 1 to 100 μm, more preferably 10 to 100 μm. Any appropriate method can be adopted as a method for forming the protective film as long as the object of the present invention can be achieved. For example, it can be formed by an injection molding method, an extrusion molding method, or a blow molding method.

  The pressure-sensitive adhesive tape of the present invention can be produced by forming an oblique columnar structure on the surface of a support. Any appropriate method can be adopted as a method of forming the oblique columnar structure. The oblique vapor deposition method is preferable.

  Any appropriate oblique vapor deposition technique can be adopted as the oblique vapor deposition method. For example, a method described in JP-A-8-27561 can be mentioned. Preferably, the vapor deposition material is vapor-deposited on a support fed by a roll using a vacuum vapor deposition apparatus. As a preferred embodiment, as shown in FIG. 5, the surface of the support 10 placed in a remote position is heated and vaporized or sublimated as a vapor deposition source 60 in a vacuumed container (chamber). When adhering to the substrate 10, the shielding plate 50 is used and the deposition material is deposited while being inclined with respect to the support 10. The oblique columnar structure 30 inclined with respect to the surface of the support 10 is formed by inclining and depositing the vapor deposition material with respect to the support 10. At this time, the support 10 is sent out by the vapor deposition roll 40.

  Any appropriate method can be adopted as a method for heating and vaporizing the vapor deposition material. For example, heating and vaporization are performed by methods such as resistance heating, electron beam, high frequency induction, and laser. An electron beam is preferable.

  Arbitrary appropriate conditions can be employ | adopted as conditions of a diagonal vapor deposition method. For example, the conditions can be set by appropriately changing the degree of chamber vacuum, deposition time, heating conditions (electron beam output current, acceleration voltage, etc.), substrate temperature, and the like.

Any appropriate material can be adopted as the vapor deposition material. For example, metals such as aluminum, zinc, gold, silver, platinum, nickel, chromium, copper, platinum, indium, inorganic materials such as sapphire, silicon carbide (SiC), gallium nitride (GaN), silicon monoxide (SiO ), Silicon dioxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), cerium oxide (CeO ₂ ), chromium oxide (Cr ₂ O ₃ ), gallium oxide (Ga ₂ O ₃ ), hafnium oxide (HfO ₂ ), Tantalum pentoxide (Ta ₂ O ₅ ), yttrium oxide (Y ₂ O ₃ ), tungsten oxide (WO ₃ ), titanium monoxide (TiO), titanium dioxide (TiO ₂ ), titanium pentoxide (Ti ₃ O ₅ ), nickel oxide (NiO), magnesium oxide _{(MgO), ITO (In 2} O 3 + SnO 2), five niobium oxide _{(Nb 2 O} 5) Zinc oxide (ZnO), oxides such as zirconium oxide (ZrO ₂₎ may be used. In addition, fluorine-based materials such as polyimide, aluminum fluoride, calcium fluoride, cerium fluoride, lanthanum fluoride, lithium fluoride, magnesium fluoride, neodymium fluoride, and sodium fluoride, and resins such as silicone can be used. These materials may be used alone or in combination of two or more, or may have a multilayer structure of two or more layers. In particular, oxides such as silicon dioxide (SiO ₂ ) and titanium dioxide (TiO ₂ ), which are hydrophilic materials, are preferably used.

  The pressure-sensitive adhesive tape of the present invention can be used for any appropriate application. Preferably, it can be used for applications requiring heat resistance and cohesion, for example, for manufacturing electronic parts, for structures, and for automobiles. In particular, since there is no problem of adhesive residue when peeling from an adherend, it can be suitably used for applications that require peeling for manufacturing electronic parts such as electronic parts, semiconductor devices, flat displays such as LCDs and PDPs, etc. .

  The pressure-sensitive adhesive tape of the present invention can be used as a cleaning member.

  Any appropriate application can be adopted as the use of the cleaning member. Preferably, it is used for removing foreign substances on the substrate and removing foreign substances in the substrate processing apparatus. More specifically, for example, it is suitably used for cleaning a substrate processing apparatus that dislikes fine foreign matters, such as a manufacturing apparatus or an inspection apparatus such as a semiconductor, a flat panel display, or a printed board.

  When cleaning is performed by transporting the substrate processing apparatus, any appropriate transport member is used as a support. That is, an aggregated layer of oblique columnar structures protruding at an elevation angle of less than 90 degrees from the surface is provided on the surface of the conveying member. By transporting such a cleaning member in the substrate processing apparatus and bringing it into contact with and moving to the site to be cleaned, it can be easily and reliably removed without causing a transport trouble due to foreign matter adhering to the apparatus. Examples of the transport member include semiconductor wafers, flat panel display substrates such as LCDs and PDPs, other compact disks, and substrates such as MR heads.

  Any appropriate apparatus can be adopted as the substrate processing apparatus for performing dust removal. Examples thereof include an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, an appearance inspection apparatus, and a wafer prober.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited by these Examples. In the examples, “parts” are based on weight.

[Inclined evaporation method]
The slanted columnar structure was formed using a take-up electron beam (EB) vacuum deposition apparatus shown in FIG. As a support, a polyimide film with a thickness of 25 μm (manufactured by Toray DuPont, Kapton 100H), silicon dioxide (SiO ₂ ) as an evaporation source, a vacuum reached in the chamber of 1 × 10 ⁻⁴ torr, and a line speed of 0.22 m / min. The film was produced under the conditions of a vapor deposition incident angle of 60 degrees.

[Water contact angle, surface free energy]
The contact angle was measured with water and methylene iodide on the surface of the support, and the surface free energy was calculated from the above equation (1).

[aspect ratio]
The aspect ratio of the oblique columnar structure was calculated as length / diameter by measuring the surface diameter and length of the oblique columnar structure by surface and cross-sectional SEM observation.

[height]
The height of the oblique columnar structure was measured by cross-sectional SEM observation.

[Adhesiveness and adhesive residue]
The adhesive tape was bonded to a stainless steel plate by reciprocating a 2 kg roller once. After leaving this test piece at 200 ° C. for 1 hour, the adhesive tape was peeled off from the stainless steel plate in the direction of 90 °, and it was visually examined whether or not the stainless steel plate could be peeled without leaving an adhesive.

[Dust removal]
A silicon powder having an average particle diameter of 0.5 μm was uniformly adhered on an 8-inch silicon wafer so that the number of particles was about 10,000. Next, an adhesive tape having an oblique columnar structure was bonded onto an 8-inch silicon wafer to which silicon powder was adhered, and contacted for 1 minute. After 1 minute, the adhesive tape was removed, and the number of 0.5 μm silicon powder particles was measured with a particle counter (manufactured by KLA tencor, SurfScan-6200) to evaluate the dust removal rate. The measurement was performed three times and the average was obtained.

[Example 1]
The EB output (emission current) was set to 300 mA to evaporate SiO ₂ as an evaporation source, and an oblique columnar structure was formed on the support to obtain an adhesive tape (1).
The evaluation results are shown in Table 1.

[Example 2]
Except that the EB output (emission current) was 400 mA, the evaporation source SiO ₂ was evaporated in the same manner as in Example 1 to form an oblique columnar structure on the support to obtain an adhesive tape (2). .
The evaluation results are shown in Table 1.

[Example 3]
Except that the EB output (emission current) was 400 mA and the ultimate vacuum was 4 × 10 ⁻⁵ torr, the evaporation source SiO ₂ was evaporated in the same manner as in Example 1, and the oblique columnar structure was placed on the support. This formed an adhesive tape (3).
The evaluation results are shown in Table 1.
A cross-sectional SEM photograph is shown in FIG.

[Comparative Example 1]
Except that the EB output (emission current) was 100 mA, SiO ₂ as the evaporation source was evaporated in the same manner as in Example 1 to form an oblique columnar structure on the support.
The evaluation results are shown in Table 1.

[Comparative Example 2]
Except that the EB output (emission current) was 200 mA, the evaporation source SiO ₂ was evaporated in the same manner as in Example 1 to form an oblique columnar structure on the support.
The evaluation results are shown in Table 1.

[Comparative Example 3]
For 100 parts of an acrylic polymer obtained from a monomer mixture consisting of 100 parts of butyl acrylate and 3 parts of acrylic acid, 2 parts of a polyisocyanate compound (manufactured by Nippon Polyurethane Industry, trade name: Coronate L), an epoxy compound (Mitsubishi) An acrylic pressure-sensitive adhesive solution was prepared by uniformly mixing 0.6 parts of Gas Chemical Co., Ltd. (trade name: Tetrad C).
The thickness after drying the pressure-sensitive adhesive solution on the silicone release treatment surface of a polyester film (Mitsubishi Chemical Polyester Film, trade name: MRF50, thickness 50 μm, width 250 mm) whose one surface is treated with a silicone-based release agent It was coated and dried so as to have a thickness of 10 μm, and laminated on a polyimide film having a thickness of 25 μm (manufactured by Toray DuPont, Kapton 100H) to prepare an adhesive tape.
The evaluation results are shown in Table 1.

  The pressure-sensitive adhesive tapes (1) to (3) obtained in Examples 1 to 3 have a necessary adhesive force on the adherend, and can remove foreign matter at a submicron level without causing contamination at the cleaning site. Excellent heat resistance, exhibits sufficient adhesive strength and cohesion even at high temperatures, and can be easily peeled off without causing adhesive residue when peeled off from the adherend after use .

  The pressure-sensitive adhesive tape of the present invention is suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

It is a schematic sectional drawing of preferable embodiment of the adhesive tape of this invention. It is a schematic sectional drawing of preferable embodiment of the adhesive tape of this invention, Comprising: It is a schematic sectional drawing explaining elevation angle (alpha). It is a schematic sectional drawing of preferable embodiment of the diagonal columnar structure in the adhesive tape of this invention. It is a schematic sectional drawing of preferable embodiment of the diagonal columnar structure in the adhesive tape of this invention. It is a schematic sectional drawing of preferable embodiment of the apparatus used for an oblique vapor deposition method. 4 is a cross-sectional SEM photograph of the pressure-sensitive adhesive tape (3) obtained in Example 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Support body 20 Aggregation layer 30 Diagonal columnar structure 40 Deposition roll 50 Shielding board 60 Deposition source 100 Adhesive tape

Claims (6)

An aggregate layer of oblique columnar structures protruding at an elevation angle of less than 90 degrees from the surface is provided on the surface of the support, the material of the oblique columnar structures is SiO ₂ , and the aspect ratio of the oblique columnar structures is 1 This is the adhesive tape.   The pressure-sensitive adhesive tape according to claim 1, wherein the length of the oblique columnar structure is 100 nm or more. The pressure-sensitive adhesive tape according to claim 1 or 2, wherein the number of the oblique columnar structures per unit area on the surface of the support is 1 x 10 ⁸ / cm ² or more.   The pressure-sensitive adhesive tape according to any one of claims 1 to 3, wherein a water contact angle on the surface of the aggregate layer is 10 degrees or less.   The pressure-sensitive adhesive tape according to any one of claims 1 to 4, wherein the aggregate layer is a cleaning layer. The pressure-sensitive adhesive tape according to any one of claims 1 to 5, which is used for electronic component production.