JP5144299B2 - Vacuum dryer - Google Patents

Vacuum dryer Download PDF

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JP5144299B2
JP5144299B2 JP2008029892A JP2008029892A JP5144299B2 JP 5144299 B2 JP5144299 B2 JP 5144299B2 JP 2008029892 A JP2008029892 A JP 2008029892A JP 2008029892 A JP2008029892 A JP 2008029892A JP 5144299 B2 JP5144299 B2 JP 5144299B2
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hot air
chamber
exhaust pipe
substrate
closed space
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JP2009189896A (en
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泰浩 佐々木
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JTEKT Thermo Systems Corp
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Koyo Thermo Systems Co Ltd
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Priority to TW097112958A priority patent/TWI412407B/en
Priority to KR1020080036143A priority patent/KR101402065B1/en
Priority to CN2008101278714A priority patent/CN101507959B/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/04—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields

Description

本発明は、液晶表示パネル製造用大型ガラス基板など、塗布膜の成分と溶剤とを混ぜ合わせてなる塗布液を塗布された基板を減圧状態で乾燥することによって、塗布液から溶剤を除去するように構成された減圧乾燥装置に関する。   The present invention removes the solvent from the coating solution by drying the substrate coated with the coating solution obtained by mixing the components of the coating film and the solvent, such as a large glass substrate for manufacturing a liquid crystal display panel, under reduced pressure. The present invention relates to a reduced-pressure drying apparatus configured as described above.

一般的に減圧乾燥装置では、減圧乾燥処理時には減圧ポンプによってチャンバの密閉容器を減圧しつつ基板を加熱する。そして処理されるべき基板に供給された塗布液中の溶剤が蒸発し、排気管を介して減圧ポンプに吸引される。   In general, in a vacuum drying apparatus, a substrate is heated while a vacuum container is decompressed by a vacuum pump during a vacuum drying process. Then, the solvent in the coating solution supplied to the substrate to be processed evaporates and is sucked into the vacuum pump through the exhaust pipe.

排気管は、密閉容器よりも温度が低いクリーンルーム側の雰囲気の影響を受け易いため、加熱された塗布基板の表面温度より低い温度になる部分が排気管の内部に形成され、塗布基板から蒸発した溶剤が排気管の内部にて凝縮され結露が発生することがあった。   Since the exhaust pipe is easily affected by the atmosphere on the clean room side where the temperature is lower than that of the sealed container, a portion having a temperature lower than the surface temperature of the heated coating substrate is formed inside the exhaust pipe and evaporated from the coating substrate. Condensation may occur due to condensation of the solvent inside the exhaust pipe.

このような結露への対策として、従来技術の中には、減圧乾燥時に、排気管の一部をテープヒータにて加熱しつつ、温度調整した窒素ガスを排気管内へ供給することによって、塗布液から乾燥する溶剤蒸気の温度コントロールを行うように構成された減圧乾燥装置が存在する（例えば、特許文献１参照。）。この減圧乾燥装置では、少ないコストで排気管内における溶剤蒸気の結露を抑え、かつ乾燥処理を迅速に行うことができる、とされている。
特開２００３−２６４１８４号公報 As a countermeasure against such condensation, in the prior art, during drying under reduced pressure, a part of the exhaust pipe is heated with a tape heater while supplying a temperature-adjusted nitrogen gas into the exhaust pipe. There is a reduced-pressure drying apparatus configured to control the temperature of the solvent vapor that is dried from (see, for example, Patent Document 1). In this reduced pressure drying apparatus, it is said that the dew condensation of the solvent vapor in the exhaust pipe can be suppressed and the drying process can be performed quickly at a low cost.
JP 2003-264184 A

ところが、減圧乾燥処理時において、排気管だけではなく密閉容器内でも加熱された塗布基板の表面温度より低い温度の部分に塗布基板から蒸発した溶剤が凝縮され結露が発生し、その結果として結露を乾燥させる為の処理時間がさらに必要になることで、全体として乾燥処理時間が長くなるという不都合を生じることがあった。   However, during the drying process under reduced pressure, not only the exhaust pipe but also the inside of the sealed container, the solvent evaporated from the coated substrate is condensed in the portion of the surface temperature lower than the surface temperature of the coated substrate, which results in condensation. When the processing time for drying is further required, there is a problem that the drying processing time becomes longer as a whole.

上述の特許文献１に係る技術では、例えばチャンバの外面に形成された補強リブや基板リフトアップピン等の可動部に対する加熱を効果的に行うことは困難であるため、チャンバの外面に形成された補強リブやリフトアップピン等の可動部からの放熱により、チャンバの内部の一部に結露の原因となり得る低温部が発生する虞が依然として存在することが明らかになった。   In the technique according to Patent Document 1 described above, it is difficult to effectively heat the movable portion such as the reinforcing rib and the substrate lift-up pin formed on the outer surface of the chamber. It has been revealed that there is still a possibility that a low temperature part that may cause condensation is generated in a part of the interior of the chamber due to heat radiation from the movable part such as the reinforcing rib and the lift-up pin.

また、チャンバの外面に形成された補強リブや基板リフトアップピン等の各部位は、特許文献１に記載のテープヒータを用いて加熱することが極めて困難であり、仮に加熱することができたとしてもテープヒータの施工やメンテナンスやその制御に膨大なコストがかかる虞がある。   In addition, it is extremely difficult to heat each portion such as the reinforcing rib and the substrate lift-up pin formed on the outer surface of the chamber using the tape heater described in Patent Document 1, and it can be temporarily heated. However, the construction, maintenance and control of the tape heater may be enormous.

この発明の目的は、簡易な構成および制御によって、チャンバ内部や排気管内部に結露の原因となり得る低温部が発生することを防止することにより処理時間を短縮することが可能な減圧乾燥装置を提供することである。   An object of the present invention is to provide a vacuum drying apparatus capable of shortening the processing time by preventing a low temperature portion that may cause condensation in a chamber or an exhaust pipe with a simple configuration and control. It is to be.

本発明に係る減圧乾燥装置は、塗布膜の成分と溶剤とを含む塗布液が塗布された基板を減圧状態で乾燥することによって塗布液から溶剤を除去するように構成される。この減圧乾燥装置は、チャンバ、排気管、減圧手段、閉空間形成手段、および熱風供給手段を備える。   The reduced pressure drying apparatus according to the present invention is configured to remove the solvent from the coating solution by drying the substrate coated with the coating solution containing the components of the coating film and the solvent in a reduced pressure state. The vacuum drying apparatus includes a chamber, an exhaust pipe, a decompression unit, a closed space formation unit, and a hot air supply unit.

チャンバは、基板を載置する載置部と基板を設定温度で加熱するヒータとを内部に備え、かつ、開閉可能に構成される。チャンバの例として、チャンバ上部およびチャンバ下部の少なくとも一方が移動自在に構成される例が挙げられる。排気管は、チャンバ内部に連通するように構成される。減圧手段は、排気管を介してチャンバ内部を減圧するように構成される。減圧手段の例として真空ポンプ等の減圧ポンプが挙げられる。   The chamber includes a placement unit for placing the substrate and a heater for heating the substrate at a set temperature, and is configured to be openable and closable. As an example of the chamber, an example in which at least one of the upper part of the chamber and the lower part of the chamber is configured to be movable is given. The exhaust pipe is configured to communicate with the interior of the chamber. The decompression means is configured to decompress the interior of the chamber via the exhaust pipe. An example of the decompression means is a decompression pump such as a vacuum pump.

閉空間形成手段は、少なくともチャンバにおける排気管との接続箇所、補強リブ、または基板リフトアップピンと排気管とを囲んで閉空間を形成する。ここで、閉空間とは、気密性を有する程に閉じていることを要せず、配管のための小窓または切り込みが仕切り部材に設けられていても良い。また、必ずしも排気管の全部が閉空間内に位置する必要はなく、排気管の一部が閉空間の外部に位置することがあっても良い。   The closed space forming means forms a closed space by surrounding at least the connection portion of the chamber with the exhaust pipe, the reinforcing rib, or the substrate lift-up pin and the exhaust pipe. Here, the closed space does not need to be closed to the extent that it has airtightness, and a small window or notch for piping may be provided in the partition member. In addition, the entire exhaust pipe is not necessarily located in the closed space, and a part of the exhaust pipe may be located outside the closed space.

なお、閉空間形成手段は可撓性を有する仕切り部材によって閉空間を画定することが好ましい。チャンバの開閉動作に追従させることを考慮すると、仕切り部材としてはシート材を用いることが好ましいが、可撓性を有する板材や伸縮自在に構成された複数の板材を用いることも可能である。   The closed space forming means preferably defines the closed space by a flexible partition member. In consideration of following the opening / closing operation of the chamber, it is preferable to use a sheet material as the partition member, but it is also possible to use a flexible plate material or a plurality of plate materials configured to be stretchable.

熱風供給手段は、閉空間形成手段によって閉じられた空間内に熱風を供給させるように構成される。熱風供給手段の構成の例として、熱風を発生させる熱風発生器と熱風発生器にて発生した熱風をチャンバにおける排気管が接続された面の縁部に吹き付けるように構成された熱風導入管とを有する構成が挙げられる。   The hot air supply means is configured to supply hot air into the space closed by the closed space forming means. As an example of the configuration of the hot air supply means, a hot air generator that generates hot air and a hot air introduction pipe configured to blow hot air generated by the hot air generator to an edge of a surface of the chamber to which the exhaust pipe is connected are provided. The structure which has is mentioned.

熱風供給手段が閉空間に所定温度の熱風を供給させることにより、閉空間内部が略均一に加熱されるとともに、チャンバにおける閉空間内に配置された部位や排気管に対して熱風が吹き付けられる。特に、補強リブ、リフトアップピン、およびその他の可動箇所のように、構造が複雑であるため均一に加熱するのが困難な箇所にも熱風が吹き付けられるため、それらの箇所を均一に加熱し易くなる。その結果、結露の原因となり得る低温部が発生することが防止される。   When the hot air supply means supplies hot air having a predetermined temperature to the closed space, the inside of the closed space is heated substantially uniformly, and hot air is blown to a portion or an exhaust pipe disposed in the closed space in the chamber. In particular, hot air is blown to places that are difficult to heat uniformly, such as reinforcing ribs, lift-up pins, and other movable parts, so it is easy to heat those places uniformly. Become. As a result, it is possible to prevent the generation of a low temperature portion that can cause condensation.

なお、熱風供給手段は、チャンバの内壁や排気管内壁を、除去すべき溶剤の蒸発温度と結露温度との間の温度に保つことが好ましい。その理由は、一般に、結露温度は蒸発温度よりも低いためである。   The hot air supply means preferably keeps the inner wall of the chamber and the inner wall of the exhaust pipe at a temperature between the evaporation temperature of the solvent to be removed and the dew condensation temperature. This is because the condensation temperature is generally lower than the evaporation temperature.

本発明によれば、簡易な構成および制御によって、チャンバ内部や排気管内部に結露の原因となり得る低温部が発生することを防止することが可能となり、処理時間を大幅に短縮することが可能になる。   According to the present invention, it is possible to prevent the occurrence of a low temperature portion that may cause condensation in the chamber or the exhaust pipe with a simple configuration and control, and it is possible to greatly reduce the processing time. Become.

図１を用いて、本発明の実施形態に係る減圧乾燥装置１０を説明する。ここでは減圧乾燥装置１０は、液晶ディスプレイの製造工程において用いられ、クリーンルーム内に設けられる。減圧乾燥装置１０は、密封容器を形成するチャンバ上部１２およびチャンバ下部１４を備える。チャンバ上部１２およびチャンバ下部１４は、いずれか一方が移動することによって開閉自在になるように構成される。この実施形態では、チャンバ下部１４がチャンバ上部１２に対して移動するように例を説明するが、チャンバ上部１２がチャンバ下部１４に対して移動する構成であっても本発明を適用することは可能である。   A vacuum drying apparatus 10 according to an embodiment of the present invention will be described with reference to FIG. Here, the reduced-pressure drying apparatus 10 is used in a manufacturing process of a liquid crystal display and is provided in a clean room. The vacuum drying apparatus 10 includes an upper chamber portion 12 and a lower chamber portion 14 that form a sealed container. The chamber upper portion 12 and the chamber lower portion 14 are configured to be freely opened and closed when one of them moves. In this embodiment, an example will be described in which the chamber lower portion 14 moves with respect to the chamber upper portion 12, but the present invention can be applied even in a configuration in which the chamber upper portion 12 moves with respect to the chamber lower portion 14. It is.

チャンバ上部１２は、内部に上プレートヒータ３６を備える。上プレートヒータ３６は、設定された温度で密閉容器内部を加熱するように構成される。   The chamber upper portion 12 includes an upper plate heater 36 inside. The upper plate heater 36 is configured to heat the inside of the sealed container at a set temperature.

チャンバ下部１４は、内部に基板支持ピン４２および下プレートヒータ３８を備える。基板支持ピン４２は、乾燥処理時に基板４０を支持するように構成される。この実施形態では、基板４０は、塗布液が供給され顔料レジストの膜が形成されたガラス基板である。下プレートヒータ３８は、設定された温度で密閉容器内部を加熱するように構成される。チャンバ下部１４の底部には、複数のリフトアップピン４４が設けられる。リフトアップピン４４は伸縮自在に構成されており、基板４０の移動時に基板４０を昇降させるように構成される。この実施形態では、リフトアップピン４４を１６本用いているが、リフトアップピン４４の本数はこれに限定されるものではない。   The chamber lower part 14 includes a substrate support pin 42 and a lower plate heater 38 inside. The substrate support pins 42 are configured to support the substrate 40 during the drying process. In this embodiment, the substrate 40 is a glass substrate on which a coating liquid is supplied and a pigment resist film is formed. The lower plate heater 38 is configured to heat the inside of the sealed container at a set temperature. A plurality of lift-up pins 44 are provided at the bottom of the chamber lower portion 14. The lift-up pins 44 are configured to be freely extendable and configured to raise and lower the substrate 40 when the substrate 40 is moved. In this embodiment, 16 lift-up pins 44 are used, but the number of lift-up pins 44 is not limited to this.

チャンバ下部１４は、エアシリンダ３０によって昇降自在に支持されている。チャンバ下部１４の底部には、減圧ポンプ２８に接続された排気管３２につながる開口部が設けられる。排気管３２は、チャンバ下部１４の昇降動作に対応するために、垂直方向に延びる部位にはフレキシブルな配管が施されている。   The lower chamber portion 14 is supported by an air cylinder 30 so as to be movable up and down. An opening connected to the exhaust pipe 32 connected to the vacuum pump 28 is provided at the bottom of the chamber lower part 14. The exhaust pipe 32 is provided with a flexible pipe at a portion extending in the vertical direction so as to correspond to the raising / lowering operation of the chamber lower portion 14.

この実施形態に係る減圧乾燥装置１０はさらに、仕切りシート材１６、熱風発生器２０、および熱風導入管３４を備える。仕切りシート材１６は、チャンバ下部１４の外周面、リフトアップピン４４、排気管３２、その他の部品を覆うように配置される。仕切りシート材１６は、図２に示すように、チャンバ下部１４の外周面に複数のシート材固定板１６２およびボルト１６４を介して取り付けられる。この実施形態では、仕切りシート材１６、シート材固定板１６２、およびボルト１６４が本発明の閉空間形成手段に対応する。   The reduced-pressure drying apparatus 10 according to this embodiment further includes a partition sheet material 16, a hot air generator 20, and a hot air introduction pipe 34. The partition sheet material 16 is disposed so as to cover the outer peripheral surface of the chamber lower portion 14, the lift-up pins 44, the exhaust pipe 32, and other components. As shown in FIG. 2, the partition sheet material 16 is attached to the outer peripheral surface of the chamber lower portion 14 via a plurality of sheet material fixing plates 162 and bolts 164. In this embodiment, the partition sheet material 16, the sheet material fixing plate 162, and the bolt 164 correspond to the closed space forming means of the present invention.

仕切りシート材１６は、約１５０μｍの厚みを有しており透明性のある素材によって構成される。仕切りシート材１６は、仕切り材に適した柔軟な物性を有する中間層（例えば、メタロセンポリエチレン）と、中間層を覆うように配置され帯電防止特性を有する表層（導電剤配合ポリエチレン）とからなる。ただし、仕切りシート材１６の構成はこれに限定されるものではなく、他の物質からなる仕切り材を適用することが可能である。また、仕切りシート材１６は、熱風導入管３４や排気管３２が貫通可能な窓孔または切り込みを備える。   The partition sheet material 16 has a thickness of about 150 μm and is made of a transparent material. The partition sheet material 16 includes an intermediate layer (for example, metallocene polyethylene) having flexible physical properties suitable for the partition material, and a surface layer (polyethylene containing a conductive agent) disposed so as to cover the intermediate layer and having antistatic properties. However, the configuration of the partition sheet material 16 is not limited to this, and partition materials made of other substances can be applied. Further, the partition sheet material 16 includes a window hole or notch through which the hot air introduction pipe 34 and the exhaust pipe 32 can pass.

熱風発生器２０は、設定された温度および風量の熱風を発生させるように構成される。熱風発生器２０の吹き出し口の近くには、熱風の温度を検出する熱電対を含む温度センサ２２が配置される。この実施形態では、熱風発生器２０の設定温度は、上プレートヒータ３６の設定温度（例えば、６８℃）よりも５〜６℃程度低くなるように温度設定が為されているが、この温度設定に限定されることはない。   The hot air generator 20 is configured to generate hot air having a set temperature and air volume. A temperature sensor 22 including a thermocouple for detecting the temperature of the hot air is disposed near the outlet of the hot air generator 20. In this embodiment, the temperature is set so that the set temperature of the hot air generator 20 is about 5 to 6 ° C. lower than the set temperature of the upper plate heater 36 (for example, 68 ° C.). It is not limited to.

熱風導入管３４は、熱風発生器２０にて発生した熱風を仕切りシート材１６により囲まれる空間内に均等に送り込むように構成される。熱風導入管３４には、熱風の清浄度を保つためのエアフィルタ２４が設けられる。この実施形態では、エアフィルタ２４としてＨＥＰＡフィルタを用いているが、エアフィルタ２４はこれに限定されるものではない。さらに、熱風導入管３４には、微差圧計１８が設けられる。微差圧計１８は、空気の流れを監視および制御するように構成される。ここでは、微差圧計１８は、汚れた空気の侵入を遮断する目的で設けられる。   The hot air introduction pipe 34 is configured to uniformly feed the hot air generated by the hot air generator 20 into the space surrounded by the partition sheet material 16. The hot air introduction pipe 34 is provided with an air filter 24 for maintaining the cleanliness of the hot air. In this embodiment, a HEPA filter is used as the air filter 24, but the air filter 24 is not limited to this. Further, the hot air introduction pipe 34 is provided with a fine differential pressure gauge 18. The fine differential pressure gauge 18 is configured to monitor and control the air flow. Here, the fine differential pressure gauge 18 is provided for the purpose of blocking the entry of dirty air.

図３を用いて熱風導入管３４の構成を説明する。熱風導入管３４は、熱風ダクト３４６および熱風噴出部３４２を備える。熱風ダクト３４６は、熱風発生器２０からの熱風を分岐させつつ、複数の経路を介して熱風噴出部３４２まで導くように構成される。チャンバ下部１４の昇降動作に対応させるため、熱風ダクト３４６における垂直に延びる部位にはフレキシブルな配管が施されている。また、複数の経路における熱風の流量の偏りを防ぐ観点から、各経路を構成する熱風ダクト長は均一であることが好ましい。   The configuration of the hot air introduction pipe 34 will be described with reference to FIG. The hot air introduction pipe 34 includes a hot air duct 346 and a hot air ejection part 342. The hot air duct 346 is configured to guide the hot air from the hot air generator 20 to the hot air ejecting portion 342 through a plurality of paths while branching the hot air from the hot air generator 20. In order to correspond to the raising and lowering operation of the chamber lower portion 14, flexible piping is applied to a vertically extending portion of the hot air duct 346. Moreover, it is preferable that the hot air duct length which comprises each path | route is uniform from a viewpoint of preventing the deviation of the flow volume of the hot air in a some path | route.

熱風噴出部３４２は、複数の熱風噴出孔３４４を備える。熱風噴出部３４２は、チャンバ下部１４の外周に沿って環状に構成されており、チャンバ下部１４の底面の外面の縁部に対して熱風を吹き付ける。熱風噴出部３４２をこのように構成した理由は、チャンバ下部１４の外周からの放熱が最も大きいことを考慮したからである。   The hot air ejection part 342 includes a plurality of hot air ejection holes 344. The hot air ejection part 342 is formed in an annular shape along the outer periphery of the chamber lower part 14, and blows hot air against the outer edge of the bottom surface of the chamber lower part 14. The reason why the hot air ejection part 342 is configured in this manner is that the heat radiation from the outer periphery of the chamber lower part 14 is considered to be the largest.

熱風噴出部３４２からチャンバ下部１４に吹き付けられた熱風は、閉空間内を流通した後、下部に設けられた排気口２６から排気される。ここでは、熱風の洗浄度を重視して熱風の循環はさせていないが、熱風を循環させる構成を採用することも可能である。この実施形態では、熱風発生器２０および熱風導入管３４が本発明の熱風供給手段に対応する。   The hot air blown from the hot air blowing portion 342 to the chamber lower portion 14 circulates in the closed space and is then exhausted from the exhaust port 26 provided in the lower portion. Here, hot air is not circulated with an emphasis on the degree of cleaning of hot air, but a configuration in which hot air is circulated may be employed. In this embodiment, the hot air generator 20 and the hot air introduction pipe 34 correspond to the hot air supply means of the present invention.

上述の構成において、減圧乾燥装置１０は、減圧乾燥処理時には減圧ポンプ２８によってチャンバ上部１２およびチャンバ下部１４で構成される密閉容器内を減圧する。この実施形態では、上プレートヒータ３６が６８℃に設定され、下プレートヒータ３８がオフの状態で、真空引きを行う。この結果、基板４０に供給された塗布液中の溶剤が蒸発し、排気管３２を介して減圧ポンプ２８側に吸引される。   In the above-described configuration, the vacuum drying apparatus 10 decompresses the inside of the sealed container constituted by the chamber upper portion 12 and the chamber lower portion 14 by the vacuum pump 28 during the vacuum drying process. In this embodiment, evacuation is performed with the upper plate heater 36 set to 68 ° C. and the lower plate heater 38 turned off. As a result, the solvent in the coating solution supplied to the substrate 40 evaporates and is sucked to the decompression pump 28 side through the exhaust pipe 32.

また、減圧乾燥処理時には、熱風発生器２０を動作させ仕切りシート材１６内に熱風を行き渡らせる。仕切りシート材１６内に熱風を流通させることにより、排気管３２およびチャンバ下部１４の外面が加熱されるため、チャンバ下部１４の内表面温度や排気管３２内の温度が６６〜６８℃の範囲に抑えられる。このため、基板４０の表面温度とチャンバ下部１４の内表面温度や排気管３２内の温度との間に差がほとんど生じないため、チャンバ下部１４や排気管３２の内部に結露が生じにくくなる。   Further, at the time of drying under reduced pressure, the hot air generator 20 is operated to distribute the hot air into the partition sheet material 16. Since the outer surface of the exhaust pipe 32 and the chamber lower part 14 is heated by circulating hot air through the partition sheet material 16, the inner surface temperature of the chamber lower part 14 and the temperature in the exhaust pipe 32 are in the range of 66 to 68 ° C. It can be suppressed. For this reason, there is almost no difference between the surface temperature of the substrate 40 and the inner surface temperature of the chamber lower part 14 or the temperature in the exhaust pipe 32, so that dew condensation hardly occurs in the chamber lower part 14 or the exhaust pipe 32.

さらに、図４に示すように、チャンバ下部１４の昇降動作に対応して仕切りシート材１６が撓むため、チャンバ下部１４の下方に閉空間を形成したことによって、チャンバ下部１４の昇降動作に支障を来たすことがない。   Further, as shown in FIG. 4, the partition sheet material 16 bends in response to the raising / lowering operation of the chamber lower portion 14, and hence the closed space is formed below the chamber lower portion 14, thereby hindering the raising / lowering operation of the chamber lower portion 14. Never come.

なお、上述の構成において、熱風発生器２０によって密閉容器の外表面の加熱を行わなかった場合には塗布基板１枚当たりの乾燥処理に約８００秒かかっていたのに対して、熱風発生器２０によって密閉容器の外表面の加熱を行った場合には塗布基板１枚当たりの乾燥処理時間を約６００秒程度にまで短縮されている。   In the above-described configuration, when the outer surface of the sealed container is not heated by the hot air generator 20, the drying process per coating substrate took about 800 seconds, whereas the hot air generator 20 Thus, when the outer surface of the sealed container is heated, the drying processing time per coated substrate is shortened to about 600 seconds.

この実施形態では、チャンバ下部１４がチャンバ上部１２に対して移動する構成を採用しているが、チャンバ上部１２がチャンバ下部１４に対して移動する構成や、シャッタによってチャンバを開閉する構成にも本願発明を適用することが可能である。チャンバ上部１２の上に閉空間を形成する際には、仕切りシート材１６を支持するためのフレーム部材をチャンバ上部１２の上に設けると良い。   In this embodiment, the configuration in which the chamber lower portion 14 moves with respect to the chamber upper portion 12 is adopted. The invention can be applied. When the closed space is formed on the chamber upper portion 12, a frame member for supporting the partition sheet material 16 may be provided on the chamber upper portion 12.

また、上述の実施形態では、液晶ディスプレイの製造工程におけるガラス基板に対する乾燥処理について説明したが、この発明の適用範囲はこれに限定されるものではない。例えば、半導体デバイス分野で用いる減圧乾燥装置の密閉容器や真空管の保温加熱、半導体デバイス分野でのＣＶＤ装置の密閉容器や管の保温加熱、およびＦＰＤ分野でのスパッタリング装置の密閉容器の保温加熱に対しても本発明を適用することが可能である。   Moreover, although the above-mentioned embodiment demonstrated the drying process with respect to the glass substrate in the manufacturing process of a liquid crystal display, the application range of this invention is not limited to this. For example, for heat insulation heating of airtight containers and vacuum tubes for vacuum drying equipment used in the field of semiconductor devices, heat insulation heating of airtight containers and tubes of CVD equipment in the field of semiconductor devices, and heat insulation heating of airtight containers of sputtering equipment in the field of FPD However, the present invention can be applied.

上述の実施形態の説明は、すべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。   The above description of the embodiment is to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

本発明の実施形態に係る減圧乾燥装置の概略を示す図である。It is a figure which shows the outline of the reduced pressure drying apparatus which concerns on embodiment of this invention. 仕切りシート材の設置例を示す図である。It is a figure which shows the example of installation of a partition sheet material. 熱風導入管の概略を示す図である。It is a figure which shows the outline of a hot air introduction pipe | tube. 基板移載時における減圧乾燥装置を示す図である。It is a figure which shows the reduced pressure drying apparatus at the time of board | substrate transfer.

符号の説明Explanation of symbols

１０−減圧乾燥装置
１２−チャンバ上部
１４−チャンバ下部
１６−仕切りシート材
２０−熱風発生器
３４−熱風導入管
４０−基板 10-Vacuum drying apparatus 12-Upper part of chamber 14-Lower part of chamber 16-Partition sheet material 20-Hot air generator 34-Hot air introduction pipe 40-Substrate

Claims (6)

塗布膜の成分と溶剤とを含む塗布液が塗布された基板を減圧状態で乾燥することによって前記塗布液から前記溶剤を除去するように構成された減圧乾燥装置であって、
前記基板を載置する載置部と、前記基板を設定温度で加熱するヒータとを内部に備えた開閉可能なチャンバと、
前記チャンバ内部に連通するように構成された排気管と、
前記排気管を介して前記チャンバ内部を減圧するように構成された減圧手段と、
少なくとも前記チャンバにおける前記排気管との接続箇所と前記排気管とを囲んで閉空間を形成する閉空間形成手段と、
前記閉空間形成手段によって閉じられた空間内に所定温度の熱風を供給するように構成された熱風供給手段と、
を備えた減圧乾燥装置。 A vacuum drying apparatus configured to remove the solvent from the coating solution by drying the substrate coated with the coating solution containing the component of the coating film and the solvent in a reduced pressure state,
An openable and closable chamber having therein a placement unit for placing the substrate and a heater for heating the substrate at a set temperature;
An exhaust pipe configured to communicate with the interior of the chamber;
Decompression means configured to decompress the interior of the chamber via the exhaust pipe;
A closed space forming means for forming a closed space surrounding at least the connection portion of the chamber with the exhaust pipe and the exhaust pipe;
Hot air supply means configured to supply hot air of a predetermined temperature into the space closed by the closed space forming means;
A vacuum drying apparatus comprising: 塗布膜の成分と溶剤とを含む塗布液が塗布された基板を減圧状態で乾燥することによって前記塗布液から前記溶剤を除去するように構成された減圧乾燥装置であって、
前記基板を載置する載置部と、前記基板を設定温度で加熱するヒータとを内部に備えた開閉可能なチャンバと、
前記チャンバ内部に連通するように構成された排気管と、
前記排気管を介して前記チャンバ内部を減圧するように構成された減圧手段と、
少なくとも前記チャンバにおける基板リフトアップピンを囲んで閉空間を形成する閉空間形成手段と、
前記閉空間形成手段によって閉じられた空間内に所定温度の熱風を供給させるように構成された熱風供給手段と、
を備えた減圧乾燥装置。 A vacuum drying apparatus configured to remove the solvent from the coating solution by drying the substrate coated with the coating solution containing the component of the coating film and the solvent in a reduced pressure state,
An openable and closable chamber having therein a placement unit for placing the substrate and a heater for heating the substrate at a set temperature;
An exhaust pipe configured to communicate with the interior of the chamber;
Decompression means configured to decompress the interior of the chamber via the exhaust pipe;
Closed space forming means for forming a closed space surrounding at least a substrate lift-up pin in the chamber;
Hot air supply means configured to supply hot air of a predetermined temperature into the space closed by the closed space forming means;
A vacuum drying apparatus comprising: 塗布膜の成分と溶剤とを含む塗布液が塗布された基板を減圧状態で乾燥することによって前記塗布液から前記溶剤を除去するように構成された減圧乾燥装置であって、
前記基板を載置する載置部と、前記基板を設定温度で加熱するヒータとを内部に備えた開閉可能なチャンバと、
前記チャンバ内部に連通するように構成された排気管と、
前記排気管を介して前記チャンバ内部を減圧するように構成された減圧手段と、
少なくとも前記チャンバにおける補強リブを囲んで閉空間を形成する閉空間形成手段と、
前記閉空間形成手段によって閉じられた空間内に所定温度の熱風を供給させるように構成された熱風供給手段と、
を備えた減圧乾燥装置。 A vacuum drying apparatus configured to remove the solvent from the coating solution by drying the substrate coated with the coating solution containing the component of the coating film and the solvent in a reduced pressure state,
An openable and closable chamber having therein a placement unit for placing the substrate and a heater for heating the substrate at a set temperature;
An exhaust pipe configured to communicate with the interior of the chamber;
Decompression means configured to decompress the interior of the chamber via the exhaust pipe;
A closed space forming means for forming a closed space surrounding at least the reinforcing rib in the chamber;
Hot air supply means configured to supply hot air of a predetermined temperature into the space closed by the closed space forming means;
A vacuum drying apparatus comprising: 前記閉空間形成手段は、可撓性を有する仕切り部材を備えた請求項１〜３のいずれか１項に記載の減圧乾燥装置。   The reduced-pressure drying apparatus according to any one of claims 1 to 3, wherein the closed space forming unit includes a flexible partition member. 前記熱風供給手段は、
所定温度の熱風を発生させる熱風発生器と、
前記熱風発生器にて発生した熱風を前記チャンバにおける前記排気管が接続された面の縁部に吹き付けるように構成された熱風導入管と、
を備えた請求項１〜４のいずれか１項に記載の減圧乾燥装置。 The hot air supply means includes
A hot air generator for generating hot air of a predetermined temperature;
A hot air introduction pipe configured to blow hot air generated by the hot air generator to an edge of a surface of the chamber to which the exhaust pipe is connected;
The reduced-pressure drying apparatus according to claim 1, comprising: 前記仕切り部材が透明部材である請求項４または５に記載の減圧乾燥装置。   The vacuum drying apparatus according to claim 4 or 5, wherein the partition member is a transparent member.
JP2008029892A 2008-02-12 2008-02-12 Vacuum dryer Expired - Fee Related JP5144299B2 (en)

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KR20090087395A (en) 2009-08-17
CN101507959B (en) 2013-09-11

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