JP5137295B2 - Silicon-containing curable composition and cured product thereof - Google Patents

Description

  The present invention relates to a silicon-containing curable composition and a cured product obtained by curing the composition. Specifically, the present invention relates to a silicon-containing curable composition useful as an electric / electronic material and a cured product thereof.

Various studies have been made on silicon-containing compounds, and polysiloxane compounds have been used for a long time as represented by silicone resins industrially. However, although silicone resin is excellent in heat resistance and flexibility, its use is limited due to contamination problems in the manufacturing process of electronic members and the like due to the large amount of outgas components (volatile components).
In recent years, with the development of the electronic information field, a high level of performance is required, so technologies that excel in heat resistance, transparency, physical and electrical properties have been studied by taking advantage of the unique properties of silicon. Yes. Among them, various techniques for producing useful compounds by applying hydrosilylation reaction of silicon compounds have been studied. In addition, in the member manufacturing process in the field of electronic information, a lithography process is frequently used, and high base resistance and solvent resistance have been demanded. For this reason, there has been a demand for a material that satisfies high heat resistance, crack resistance, and transparency at the same time while maintaining high base resistance and solvent resistance. In response to these requirements, various silicon-containing curable compositions have been proposed (see Patent Documents 1 to 3 and Non-Patent Document 1).

However, although the technologies proposed for these have individual characteristics, they have the high heat resistance, base resistance, crack resistance, and performance of outgas components that are required for materials in the recent electronic information field. There was nothing to satisfy at the same time.
For example, the material proposed in Patent Document 1 is not sufficiently satisfactory with respect to heat resistance, crack resistance, and particularly base resistance, and the material proposed in Patent Document 2 also particularly relates to base resistance. It is not fully satisfactory, and the material proposed in Patent Document 3 is not sufficiently satisfactory with respect to crack resistance, particularly base resistance.
JP 2002-241614 A Japanese Patent Laid-Open No. 2002-241501 JP 2002-194215 A European Polymer Journal 40 (2004) 615-622

  Accordingly, the object of the present invention is to provide a silicon-containing curing material that has few outgas components, excellent transparency, and has a high heat resistance, excellent base resistance, and crack resistance, and is useful for electrical and electronic materials. It is to provide a sex composition.

As a result of intensive studies to solve the above problems, the present inventors have focused on the structure and prepolymer of a specific silicon-containing compound, and have completed the present invention.
That is, in the present invention, as the component (A), one or more selected from each of the following (α) component and (β) component is converted into two or more Si—H in one molecule obtained by hydrosilylation reaction. A prepolymer (A) containing a group, and a cyclic siloxane compound (B) containing, as a component (B), two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule; A silicon-containing curable composition comprising a hydrosilylation catalyst (C) as the component (C).

  (Α) Component: A cyclic siloxane compound containing two or more Si—H groups in one molecule, represented by the following formula (1).

[In Formula (1), R < ¹ >, R < ² > and R < ³ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be same or different. a represents a number of 2 to 10, b represents a number of 0 to 8, and a + b ≧ 2. ]

Two compounds containing in the molecule a carbon-carbon double bond - of the formula (2) or (4) below, the carbon reactive with the Si-H groups: (beta) components.

[In Formula (3), R ⁴ , R ⁵ , R ⁶ and R ⁷ each represent an alkyl group having 1 to 6 carbon atoms or a phenyl group, and may be the same or different. ]

[In Formula (4), R < ⁸ >, R < ⁹ >, R < ¹⁰ > and R < ¹¹ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be same or different. ]

  Further, the present invention provides a cyclic siloxane in which the component (B) contains two or more carbon-carbon double bonds having a reactivity with the Si-H group represented by the following formula (5). The silicon-containing curable composition as a compound is provided.

[In Formula (5), R < ¹² >, R < ¹³ > and R < ¹⁴ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be same or different. p represents a number of 2 to 10, q represents a number of 0 to 8, and p + q ≧ 2. ]

  The present invention also provides a cured product obtained by curing the silicon-containing curable composition.

  According to the present invention, there are few outgas components, excellent transparency, the cured product has high heat resistance, base resistance, crack resistance, insulating film of electric / electronic material, low dielectric constant material Thus, a silicon-containing curable composition useful for a heat resistant material, a transparent material, and the like can be obtained.

Hereinafter, the present invention will be described in detail.
First, the prepolymer which is the component (A) of the present invention will be described.
The prepolymer of the component (A) of the present invention is obtained by hydrosilylation reaction of one or more selected from each of the following (α) component and (β) component, and two or more of them are contained in one molecule. It has a Si-H group.

The component (α) is a cyclic siloxane compound represented by the following formula (1) and containing two or more Si—H groups in one molecule. In the formula (1), R ¹ , R ² and R ³ each represent an alkyl group having 1 to 6 carbon atoms or a phenyl group, and may be the same or different. R ¹ is preferably a methyl group from the viewpoint of industrial availability, and R ² and R ³ are preferably a methyl group or a phenyl group from the viewpoint of reducing outgas. a represents a number of 2 to 10, b represents a number of 0 to 8, and a + b ≧ 2. a is preferably 4 to 6 from the viewpoint of ease of production, and b is preferably 0 to 1 from the viewpoint of the crosslinking density of the curing reaction.

  Specific examples of the component (α) include 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, 1,3,5,7,9, Examples include 11-hexamethylcyclohexasiloxane, and 1,3,5,7-tetramethylcyclotetrasiloxane is preferable from the viewpoint of industrial availability and the appropriate number of Si-H functional groups. The component (α) may be used alone or in combination of two or more.

  The component (β) is a compound containing two or more carbon-carbon double bonds having reactivity with the Si—H group in one molecule, and as a particularly preferred example, from the viewpoint of heat resistance and crack resistance. And compounds represented by any one of the following formulas (2) to (4).

  The compound represented by the above formula (2) as the component (β) represents divinylbenzene, and may be any of o-divinylbenzene, m-divinylbenzene, and p-divinylbenzene, and a functional group other than the vinyl group (for example, An alkyl group such as a methyl group) may be bonded to a benzene ring, or a mixture thereof.

In the above formula ^{(3), R 4, R} 5, R 6 and R ⁷ each represent an alkyl group or a phenyl group, having 1 to 6 carbon atoms, which may be the same or different and manufacturing From the viewpoint of ease of production and industrial availability, a methyl group and an ethyl group are preferred. Preferable specific examples of the compound represented by the above formula (3) include a compound represented by the following formula (6).

In said formula (4), R < ⁸ >, R <^9> , R < ¹⁰ > and R < ¹¹ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be the same or different, industrial. From the viewpoint of general availability, a methyl group and an ethyl group are preferable. Preferable specific examples of the compound represented by the above formula (4) include a compound represented by the following formula (7).

  The (β) component may be a compound containing two or more carbon-carbon double bonds having reactivity with the Si—H group in one molecule, other than those listed above. As butadiene, isoprene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, cyclohexadiene, decadiene, diallyl phthalate, trimethylolpropane diallyl ether, pentaerythritol triallyl ether, divinylbenzenes (thickness of 50 to 100%, preferably Is 80-100% pure), divinylbiphenyls (50-100% pure, preferably 80-100% pure), 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene , Triallyl isocyanurate, trivinylcyclohexane and Those oligomers, 1,2-polybutadiene (1,2 ratio of 10 to 100%, preferably 1,2 ratio of 50 to 100%), compounds containing two carbon-carbon double bonds in the spiro skeleton (For example, 3,9-divinyl-2,4,8,10-tetraoxaspiro [5,5] undecane) and the like. The (β) component may be used alone or in combination of two or more.

  The number of carbon-carbon double bonds having reactivity with the Si—H group of the component (β) may be at least 2 on average per molecule, but from the point of crosslinking density, 2 to 3 Is preferred.

  The prepolymer of the component (A) of the present invention may be a hydrosilylation reaction between the component (α) and the component (β), and the blending ratio of the component (α) and the component (β) is not particularly limited. What is necessary is just to make it contain 2 or more Si-H group in 1 molecule of prepolymers of (A) component. Preferably, from the viewpoint of the viscosity of the prepolymer, a carbon-carbon double bond having reactivity between the number (X) of Si-H groups in the component (α) and the Si-H groups in the component (β). The ratio with respect to the number (Y) is X: Y = 10: 1 to 2: 1, more preferably X: Y = 4: 1 to 2: 1.

  In addition, the concentration of the Si—H group contained in the prepolymer of the component (A) of the present invention is preferably 0.0001 mmol / g to 100 mmol / g, more preferably 0.01 mmol / g from the viewpoint of curability and storage stability. g-20 mmol / g is preferable.

  The prepolymer of the component (A) of the present invention preferably has a weight average molecular weight of 500 to 500,000, more preferably 1000 to 300,000 from the viewpoint of heat resistance and handling properties. The measurement of the weight average molecular weight of the present prepolymer may use GPC, and may be obtained by polystyrene conversion.

  The hydrosilylation reaction between the (α) component and the (β) component is preferably performed using a platinum-based catalyst, and the platinum-based catalyst contains one or more metals of platinum, palladium, and rhodium that promote the hydrosilylation reaction. Any known catalyst may be used. Platinum-based catalysts used as catalysts for these hydrosilylation reactions include platinum-carbonyl vinylmethyl complexes, platinum-divinyltetramethyldisiloxane complexes, platinum-cyclovinylmethylsiloxane complexes, platinum-octylaldehyde complexes, etc. In addition to the catalyst, compounds containing palladium, rhodium, etc., which are also platinum-based metals, may be used instead of platinum, and one or more of these may be used in combination. In particular, from the viewpoint of curability, those containing platinum are preferable, and specifically, platinum-divinyltetramethyldisiloxane complex (Karstedt catalyst) and platinum-carbonylvinylmethyl complex (Ossko catalyst) are preferable. In addition, a so-called Wilkinson catalyst containing the above platinum-based metal such as chlorotristriphenylphosphine rhodium (I) is also included in the platinum-based catalyst in the present invention. The amount of the platinum-based catalyst used is preferably 5% by mass or less, more preferably 0.0001 to 1.0% by mass of the total amount of the (α) component and the (β) component from the viewpoint of reactivity. The hydrosilylation reaction conditions for the (α) component and the (β) component are not particularly limited, and may be carried out under the conventionally known conditions using the above catalyst, but from the point of curing speed, it is carried out at room temperature to 130 ° C. Preferably, a conventionally known solvent such as toluene, hexane, MIBK (methyl isobutyl ketone), cyclopentanone, or PGMEA (propylene glycol monomethyl ether acetate) may be used during the reaction.

  The prepolymer of the component (A) of the present invention is a compound containing two or more carbon-carbon double bonds having reactivity with the component (α), which is a cyclic siloxane compound, and a Si—H group. The (β) component is a prepolymer obtained by a hydrosilylation reaction. The present invention is based on the fact that the (α) component is cyclic, and is first converted into a prepolymer, which is then added to the curable composition. There is a big feature in using as an ingredient. Since it has an annular structure, the curing shrinkage is small, and therefore a cured product having excellent crack resistance can be obtained. Moreover, since a low boiling point thing can be removed by prepolymerizing, the hardening composition which does not contain an outgas component is obtained. Furthermore, since the silicon content can be increased while the viscosity is low, a curable composition having excellent heat resistance can be obtained.

Next, (B) component of this invention is demonstrated. The component (B) of the present invention is a cyclic siloxane compound containing two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule. The number of double bonds is preferably 2 to 10, and more preferably 2 to 6 from the viewpoint of the crosslink density of the cured product. Further, examples of the carbon-carbon double bond having reactivity with the Si-H group include an alkenyl group and a vinyl group. From the viewpoint of reactivity, a vinyl group bonded to a silicon atom (Si-CH = CH ₂ group) is preferred.
Moreover, the cyclic siloxane compound shown by following formula (5) is mentioned as a (B) component especially preferable from the point of the physical property of hardened | cured material.

In said formula (5), R <^12> , R <^13> and R < ¹⁴ > respectively represent a C1-C6 alkyl group or a phenyl group, and may be the same or different, industrial availability. From this point, R ¹² , R ¹³ and R ¹⁴ are preferably a methyl group or a phenyl group. p represents a number of 2 to 10, preferably 2 to 4 from the viewpoint of crosslinking density, q represents a number of 0 to 8, and 1 to 3 are preferable from the viewpoint of outgas reduction and viscosity. p + q ≧ 2. From the viewpoint of reducing the outgas, specific examples of the preferred component (B) include cyclic siloxane compounds represented by the following formulas (8) to (11).

The component (B) of the present invention is a cyclic siloxane compound containing two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule, and the component (B) is a cyclic siloxane compound. This is a major feature of the present invention. When the component (B) is a siloxane compound, it is superior in heat resistance, transparency, etc. compared to a non-siloxane compound, and is a cyclic compound, so that it is a physical product of a cured product compared to a chain compound. Excellent strength (rigidity), base resistance, crack resistance, etc.
The component (B) of the present invention is a cyclic siloxane compound containing two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule, and it is more particularly excellent in detail. The enumeration is as follows.

(1) Since it has an annular structure, curing shrinkage is reduced, and therefore it is excellent in crack resistance at high temperatures.
(2) The Si concentration can be increased, and the heat resistance is easily improved.
(3) The characteristics inherent in the Si compound such as transparency and heat resistance are expressed as they are.

  In the silicon-containing curable composition of the present invention, the content of the component (A) and the component (B) considers the ratio of Si—H groups and carbon-carbon double bonds that are reactive with Si—H groups. The equivalent ratio of the Si-H group and the carbon-carbon double bond having reactivity with the Si-H group is preferably 0.9 to 10, and preferably 1.0 to 5.0. Particularly preferred. In terms of mass%, the content of the component (A) is preferably 1 to 99 mass%, particularly preferably 10 to 90 mass%. 1-99 mass% is preferable, and, as for content of (B) component, 10-90 mass% is especially preferable.

Next, the hydrosilylation catalyst which is the component (C) of the present invention will be described.
Examples of the component (C) hydrosilylation catalyst include platinum-based catalysts, which may be known catalysts containing one or more metals of platinum, palladium, and rhodium that promote the hydrosilylation reaction. Platinum-based catalysts used as catalysts for these hydrosilylation reactions include platinum-carbonyl vinylmethyl complexes, platinum-divinyltetramethyldisiloxane complexes, platinum-cyclovinylmethylsiloxane complexes, platinum-octylaldehyde complexes, etc. In addition to the catalyst, compounds containing palladium, rhodium, etc., which are also platinum-based metals, may be used instead of platinum, and one or more of these may be used in combination. In particular, from the viewpoint of curability, those containing platinum are preferable, and specifically, platinum-divinyltetramethyldisiloxane complex (Karstedt catalyst) and platinum-carbonylvinylmethyl complex (Ossko catalyst) are preferable. In addition, a so-called Wilkinson catalyst containing the above platinum-based metal such as chlorotristriphenylphosphine rhodium (I) is also included in the platinum-based catalyst in the present invention.

  In the silicon-containing curable composition of the present invention, the content of the component (C) is preferably 5% by mass or less, more preferably 0.0001 to 1.0% by mass from the viewpoints of curability and storage stability. When the content is more than 5% by mass, the stability of the silicon-containing curable composition tends to be poor, and when it is less than 0.0001% by mass, sufficient curability may not be obtained.

  The silicon-containing curable composition of the present invention preferably contains metal oxide fine powder (also referred to as metal oxide fine particles) as an optional component in addition to the components (A) to (C). The metal oxide fine powder as an optional component of the present invention refers to so-called fillers, inorganic materials such as minerals, and organically modified ones thereof. Examples thereof include colloidal silica, silica filler, silica gel, minerals such as mica and montmorillonite, metal oxides such as aluminum oxide, zinc oxide, and beryllium oxide, and these may be modified by organic modification treatment or the like. Various physical properties can be obtained by adding these metal oxide fine powders. Particularly preferred is silicon dioxide fine powder. The particle diameter of these metal oxide fine particles is preferably 100 μm or less, and more preferably 50 μm or less from the viewpoint of heat resistance. The content of the metal oxide fine powder in the silicon-containing curable composition of the present invention is preferably 90% by mass or less and more preferably 50% by mass or less from the viewpoint of heat resistance and handling.

  The silicon-containing curable composition of the present invention may further contain a free radical scavenger as an optional component. The free radical scavenger in this case may be any antioxidant substance such as an antioxidant or a stabilizer, such as triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxyphenyl). ) Propionate], dibutylhydroxytoluene (BHT), 2,6-di-t-butyl-paracresol (DBPC) and the like. The content of the free radical scavenger in the silicon-containing curable composition of the present invention is preferably 0.1 to 50% by mass from the viewpoints of heat resistance, electrical properties, curability, mechanical properties, storage stability and handling. 1-30 mass% is more preferable.

Next, the cured product of the present invention will be described.
The silicon-containing curable composition of the present invention can be cured by heating and can be a cured product. This curing reaction may be performed by any method, such as a method of mixing the compounding components of the silicon-containing curable composition of the present invention immediately before use, a method of mixing all in advance and curing by heating or the like when performing the curing reaction. You may go.
The heating temperature for curing is preferably 35 to 350 ° C, more preferably 50 to 250 ° C. The curing time is preferably from 0.01 to 10 hours, more preferably from 0.05 to 6 hours. By performing a curing reaction under these curing reaction conditions, the silicon-containing curable composition of the present invention has excellent performance such as heat resistance, crack resistance, base resistance, low dielectric constant, and low outgas component. A cured product can be obtained. In particular, the cured product of the present invention is excellent in electrical characteristics, and its relative dielectric constant is preferably in the range of 2.5 to 3.2.

  The silicon-containing curable composition of the present invention has good fluidity at room temperature (25 ° C.), excellent handling properties, and the cured product has particularly excellent heat resistance and crack resistance. . Specifically, a cured product having a temperature causing a weight loss of 5% by mass of the cured product is preferably 400 ° C. or higher, more preferably 500 ° C. or higher. Moreover, the hardened | cured material with few crack generations is obtained suitably. Regarding the fluidity, the viscosity measured with an E-type viscometer at room temperature (25 ° C.) is preferably 1 Pa · S or less, and more preferably 0.1 Pa · S or less.

The silicon-containing curable composition of the present invention has an effect of a curing reaction catalyst that is a hydrosilylation catalyst (for example, platinum-based catalyst) of the component (C), and the Si-H group of the component (A) and the component (B). The curing reaction by the reaction of a carbon-carbon double bond (for example, Si—CH═CH ₂ group) having reactivity with the Si—H group proceeds rapidly. Furthermore, since the silicon-containing curable composition of the present invention is uniform and transparent, it has good light transmittance such as ultraviolet rays, and can be photocured by adding a photoreactive catalyst. Of course, a photoreactive monomer or resin may be further blended, and any one or more of each component in the silicon-containing curable composition may have a photoreactive group. Furthermore, for weather resistance, hardness, stain resistance, flame resistance, moisture resistance, gas barrier properties, flexibility, elongation and strength, electrical insulation, low dielectric constant, and other mechanical properties, optical properties, electrical properties, etc. An excellent material can be obtained.

In addition, the silicon-containing curable composition of the present invention includes other known resins, fillers, additives, and the like as optional components other than those described above, as long as the target performance of the present invention is not impaired. Can be blended. Further, various organic functional groups can be bonded to any one or more of the component (A), the component (B), and the component (C) to give further functions. In addition, a highly functional composite material in which the silicon-containing curable composition of the present invention or a cured product thereof is used as a matrix and other useful compounds are dispersed therein can also be produced.
Examples of various resins that can be arbitrarily blended include polyimide resins, polyether resins such as polyethylene glycol and polypropylene glycol, polyurethane resins, epoxy resins, phenol resins, polyester resins, melamine resins, polyamide resins, polyphenylene sulfide resins, and the like. .
Examples of additives that can be optionally added include ultraviolet absorbers, antistatic agents, and antioxidants.
Examples of the filler that can be arbitrarily blended include ceramics such as silicon nitride, aluminum nitride, boron nitride, and silicon carbide. These may be modified by organic modification treatment or the like.

EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited by these Examples. In the examples, “parts” and “%” are based on mass. The following Examples 1, 4, 5, 6 and 10 are reference examples.

Synthesis Example 1 Component (A): Synthesis of Prepolymer-1 100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 100 parts of 1,4-bis (dimethylvinylsilyl) benzene, 60 parts of toluene and 0.0005 part of platinum-carbonylvinylmethyl complex (Ossko catalyst) was added and refluxed for 5 hours while stirring. The solvent of the reaction solution was distilled off at 70 ° C. under reduced pressure to obtain Prepolymer-1 as component (A).
As a result of analysis by GPC, the molecular weight of Prepolymer-1 was Mw = 3000, and the content of hydrosilyl group (Si—H group) was 5.3 mmol / g from ¹ H-NMR.

[Synthesis Example 2] Component (A): Synthesis of Prepolymer-2 [Precursor] 1,5-divinyl-1,1,5,5-tetramethyl-3,3-diphenylto
First, 1,5-divinyl-1,1,5,5-tetramethyl-3,3-diphenyltrisiloxane was synthesized as a precursor of prepolymer-2. That is, 100 parts of diphenylsilanediol was dispersed in 450 parts of toluene, and 120 parts of pyridine was added and stirred.
After adding 170 parts of vinyldimethylchlorosilane to this suspension and reacting at 50 ° C. for 2 hours, ion-exchanged water was added to stop the reaction.
The aqueous layer was removed from the reaction solution, and the solvent was distilled off to obtain a silicon-containing divinyl compound (1,5-divinyl-1,1,5,5-tetramethyl-3,3-diphenyltrisiloxane).
As a result of analysis by GC-MS, the silicon-containing divinyl compound had a molecular weight of Mw = 384 and a vinyl group content of 4.99 mmol / g from ¹ H-NMR.
GC-MS column: HP-1, HEWLETT PACKARD, 30m x 300mm
Next, 100 parts 1,3,5,7-tetramethylcyclotetrasiloxane, 130 parts 1,5-divinyl-1,1,5,5-tetramethyl-3,3-diphenyltrisiloxane, 500 parts hexane, 0.0005 part of platinum-divinyltetramethyldisiloxane complex (Karstedt catalyst) was added and refluxed for 2 hours while stirring. The solvent was distilled off under reduced pressure at 70 ° C. to obtain a silicon-containing hydrosilyl type prepolymer-2.
As a result of analysis by GPC, the molecular weight of the silicon-containing hydrosilyl type prepolymer-2 was Mw = 2500, and the content of hydrosilyl group was 4.9 mmol / g from ¹ H-NMR.

[Synthesis Example 3] Component (A): Synthesis of Prepolymer-3 1,3,5,7-tetramethylcyclotetrasiloxane 100 parts, divinylbenzene 50 parts, 1-methoxy-2-propanol acetate 70 parts and platinum- 0.0001 part of carbonylvinylmethyl complex (Ossko catalyst) was added and refluxed for 6 hours while stirring. The solvent of the reaction solution was distilled off at 50 ° C. under reduced pressure to obtain Prepolymer-3 as component (A).
As a result of analysis by GPC, the molecular weight of Prepolymer-3 was Mw = 14,000, and the content of hydrosilyl group (Si—H group) was 5.2 mmol / g from ¹ H-NMR.

[Synthesis Example 4] Component (B): Synthesis of Cyclic Siloxane Compound-1 Into a mixed solution in which 300 parts of 1,4-dioxane and 300 parts of hydrochloric acid were added and stirred, 210 parts of methylvinyldichlorosilane and 90 parts of phenylmethyldichlorosilane were synthesized. Part of the mixture was added dropwise. While recovering hydrochloric acid generated by the hydrolysis reaction, the reaction was carried out at room temperature for 30 minutes and then at 70 ° C. for 3 hours. After the reaction, among the liquid layers separated into two layers, the upper layer is purified by distillation under reduced pressure of 120 to 140 ° C. with a vacuum pump, and the cyclic siloxane compound as component (B) represented by the following formula (12) -1 was obtained.
As a result of analysis by GC-MS, the cyclic siloxane compound-1 contains 85% or more of a molecular weight of 395 by area ratio. As a result of analysis by FT-IR, the cyclic siloxane compound-1 has 3200-3600 cm. Absorption of hydroxyl groups belonging to the absorption region of ^-1 was not observed. As a result of analysis by ¹ H-NMR, a molar ratio of vinyl group to phenyl group was found to be 3.3: 1.0.

[Synthesis Example 5] Component (B): Synthesis of Cyclic Siloxane Compound-2 In a mixed liquid in which 300 parts of 1,4-dioxane and 300 parts of hydrochloric acid were added and stirred, 140 parts of methylvinyldichlorosilane and 180 parts of phenylmethyldichlorosilane were added. Part of the mixture was added dropwise. While recovering hydrochloric acid generated by the hydrolysis reaction, the reaction was carried out at room temperature for 30 minutes and then at 70 ° C. for 3 hours. After the reaction, among the liquid layers separated into two layers, the upper layer is purified by distillation under reduced pressure by a vacuum pump at 135 to 150 ° C., and is represented by the following formula (13), which is a cyclic siloxane compound as component (B) -2 was obtained.
As a result of analysis by GC-MS, the cyclic siloxane compound-2 contains those having a molecular weight of Mw = 445 in an area ratio of 85% or more. As a result of analysis by FT-IR, the cyclic siloxane compound-2 has 3200 to 3200. Absorption of hydroxyl groups belonging to the absorption region of 3600 cm ⁻¹ was not observed. As a result of analysis by ¹ H-NMR, a molar ratio of vinyl group to phenyl group was found to be 1.2: 1.0.

[Synthesis Example 6] Component (B): Synthesis of Cyclic Siloxane Compound-3 50 parts of the cyclic siloxane compound-1 obtained in Synthesis Example 4 and 50 parts of the cyclic siloxane compound-2 obtained in Synthesis Example 5 By mixing, cyclic siloxane compound-3 as component (B) was obtained.

[Synthesis Example 7] Component (B): Synthesis of Cyclic Siloxane Compound-4 280 parts of methylvinyldichlorosilane were added dropwise to a mixed liquid in which 300 parts of 1,4-dioxane and 300 parts of hydrochloric acid were added and stirred. While recovering hydrochloric acid generated by the hydrolysis reaction, the reaction was carried out at room temperature for 30 minutes and then at 70 ° C. for 3 hours. After the reaction, among the liquid layers separated into two layers, the upper layer was distilled and purified under reduced pressure by a vacuum pump at 120 ° C. or lower, and the cyclic siloxane compound as component (B) represented by the following formula (14): 4 was obtained.
As a result of analysis by GC-MS, the molecular weight of the cyclic siloxane compound-4 is Mw = 345. As a result of analysis by FT-IR, the cyclic siloxane compound-4 has a hydroxyl group attributed to an absorption region of 3200 to 3600 cm ⁻¹ . Absorption was not seen. The vinyl group content was 11.6 mmol / g from ¹ H-NMR.

[Example 1] Silicon-containing curable composition-1
Platinum-carbonylvinyl as 100 parts of prepolymer-1 as component (A) obtained in Synthesis Example 1, 67 parts of cyclic siloxane compound-1 as component (B) obtained in Synthesis Example 4 and as component (C) The silicon-containing curable composition-1 of this invention was obtained by mix | blending 0.0001 part of methyl complexes.
The obtained silicon-containing curable composition-1 was cured by the following curing method to obtain a cured product-1. A colorless and transparent hard cured product was obtained without any smoke during curing.

<Curing method>
1) Curing method for preparing specimens for curable confirmation, heat resistance test and outgas test Hot plate adjusted to 130 ° C by pouring the curable composition uniformly into a mold made of Teflon (registered trademark) resin After preheating for 30 minutes above, it was further heated for 1 hour on a hot plate adjusted to 200 ° C. to obtain a cured product.
2) Curing method for preparing test pieces to be used for crack resistance test and base resistance test A uniform thin film (SOG film) is prepared by spin-casting on a glass plate that has been washed and dried. After 30 minutes of preheating on the hot plate adjusted to 1 hour, it was further heated on a hot plate adjusted to 200 ° C. for 1 hour to obtain a cured product.
3) Curing method for test piece to be used for relative dielectric constant test A curable composition was uniformly applied on a glass substrate with a transparent electrode, and pre-heated for 30 minutes on a hot plate adjusted to 130 ° C. Then, it further heated for 1 hour on the hotplate adjusted to 200 degreeC, and hardened | cured material was obtained.

[Example 2] Silicon-containing curable composition-2
Platinum-carbonylvinyl as 100 parts of prepolymer-2 as component (A) obtained in Synthesis Example 2 and 62 parts of cyclic siloxane compound-1 as component (B) obtained in Synthesis Example 4 and as component (C) 0.0001 part of a methyl complex was blended to obtain a silicon-containing curable composition-2 of the present invention.
The obtained silicon-containing curable composition-2 was cured by the same curing method as in Example 1 to obtain a cured product-2. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 3] Silicon-containing curable composition-3
Platinum-carbonylvinyl as 100 parts of prepolymer-3 as component (A) obtained in Synthesis Example 3, 66 parts of cyclic siloxane compound-1 as component (B) obtained in Synthesis Example 4 and as component (C) The silicon complex curable composition-3 of this invention was obtained by mix | blending 0.0001 part of methyl complexes.
The obtained silicon-containing curable composition-3 was cured by the same curing method as in Example 1 to obtain a cured product-3. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 4] Silicon-containing curable composition-4
100 parts of prepolymer-1 as component (A) obtained in Synthesis Example 1, 110 parts of cyclic siloxane compound-2 as component (B) obtained in Synthesis Example 5, and platinum-carbonylvinyl as component (C) 0.0001 part of a methyl complex was blended to obtain a silicon-containing curable composition-4 of the present invention.
The obtained silicon-containing curable composition-4 was cured by the same curing method as in Example 1 to obtain a cured product-4. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 5] Curable composition containing silicon-5
100 parts of prepolymer-1 as component (A) obtained in Synthesis Example 1 and 83.5 parts of cyclic siloxane compound-3 as component (B) obtained in Synthesis Example 6 and platinum as component (C) The silicon-containing curable composition-5 of the present invention was obtained by blending 0.0001 part of a carbonylvinylmethyl complex.
The obtained silicon-containing curable composition-5 was cured by the same curing method as in Example 1 to obtain a cured product-5. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 6] Silicon-containing curable composition-6
100 parts of prepolymer-1 as component (A) obtained in Synthesis Example 1, 46 parts of cyclic siloxane compound-4 as component (B) obtained in Synthesis Example 7 and platinum-divinyltetra as (C) component 0.0005 part of methyldisiloxane complex (Karstedt catalyst) was blended to obtain a silicon-containing curable composition-6 of the present invention.
The obtained silicon-containing curable composition-6 was cured by the same curing method as in Example 1 to obtain a cured product-6. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 7] Silicon-containing curable composition-7
100 parts of prepolymer-3 as component (A) obtained in Synthesis Example 3 and 108 parts of cyclic siloxane compound-2 as component (B) obtained in Synthesis Example 5 and platinum-carbonylvinyl as component (C) The silicon complex curable composition-7 of this invention was obtained by mix | blending 0.0001 part of methyl complexes.
The obtained silicon-containing curable composition-7 was cured by the same curing method as in Example 1 to obtain a cured product-7. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 8] Silicon-containing curable composition-8
100 parts of prepolymer-3 as component (A) obtained in Synthesis Example 3, 82 parts of cyclic siloxane compound-3 as component (B) obtained in Synthesis Example 6 and platinum-carbonylvinyl as component (C) The silicon complex curable composition-8 of this invention was obtained by mix | blending 0.0001 part of methyl complexes.
The obtained silicon-containing curable composition-8 was cured by the same curing method as in Example 1 to obtain a cured product-8. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 9] Silicon-containing curable composition-9
100 parts of prepolymer-3 as component (A) obtained in Synthesis Example 3, 45 parts of cyclic siloxane compound-4 as component (B) obtained in Synthesis Example 7 and platinum-divinyltetra as component (C) 0.0005 part of methyldisiloxane complex (Karstedt catalyst) was blended to obtain a silicon-containing curable composition-9 of the present invention.
The obtained silicon-containing curable composition-9 was cured by the same curing method as in Example 1 to obtain a cured product-9. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Example 10] Silicon-containing curable composition-10
100 parts of prepolymer-1 as component (A) obtained in Synthesis Example 1, 67 parts of cyclic siloxane compound-1 as component (B) obtained in Synthesis Example 4, and platinum-carbonylvinyl as component (C) 0.0001 part of a methyl complex and 19 parts of fine powder of dioxide as an optional component were blended to obtain a silicon-containing curable composition-10 of the present invention.
The obtained silicon-containing curable composition-10 was cured by the same curing method as in Example 1 to obtain a cured product-10. A colorless and transparent hard cured product was obtained without any smoke during curing.

[Comparative Example 1]
100 parts 1,3,5,7-tetramethylcyclotetrasiloxane, 205 parts 1,4-bis (dimethylvinylsilyl) benzene and 0.0005 parts platinum-divinyltetramethyldisiloxane complex (Karstedt catalyst) Then, a curable composition comparative product-1 was obtained. The obtained curable composition comparative product-1 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-1. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 2]
100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 108 parts of divinylbenzene and 0.0005 part of a platinum-divinyltetramethyldisiloxane complex were blended to obtain a curable composition comparative product-2. It was. The obtained curable composition comparative product-2 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-2. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 3]
Combining 100 parts of Prepolymer-1 obtained in Synthesis Example 1, 65 parts of 1,4-bis (dimethylvinylsilyl) benzene and 0.0005 part of a platinum-carbonylvinylmethyl complex, a comparative curable composition -3 was obtained. The obtained curable composition comparative product-3 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-3. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 4]
100 parts of prepolymer-2 obtained in Synthesis Example 2, 60 parts of 1,4-bis (dimethylvinylsilyl) benzene, and 0.0005 part of a platinum-divinyltetramethyldisiloxane complex are blended to obtain a curable composition. Comparative product-4 was obtained. The obtained curable composition comparative product-4 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-4. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 5]
Combining 100 parts of Prepolymer-3 obtained in Synthesis Example 3, 64 parts of 1,4-bis (dimethylvinylsilyl) benzene and 0.0005 part of a platinum-carbonylvinylmethyl complex, a comparative curable composition -5 was obtained. The obtained curable composition comparative product-5 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-5. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 6]
100 parts of Prepolymer-3 obtained in Synthesis Example 3, 34 parts of divinylbenzene and 0.0005 part of a platinum-divinyltetramethyldisiloxane complex were blended to obtain a curable composition comparative product-6. The obtained curable composition comparative product-6 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-6. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 7]
100 parts of prepolymer-3 obtained in Synthesis Example 3 and 43 parts of triallyl isocyanurate were blended to obtain a curable composition comparative product-7. The obtained curable composition comparative product-7 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-7. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 8]
100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 211 parts of cyclic siloxane compound-1 obtained in Synthesis Example 4 and 0.0005 part of a platinum-divinyltetramethyldisiloxane complex were blended, A curable composition comparative product-8 was obtained. The obtained curable composition comparative product-8 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-8. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Comparative Example 9]
100 parts of 1,4-bis (dimethylsilyl) benzene, 130 parts of the cyclic siloxane compound-1 obtained in Synthesis Example 4 and 0.0005 part of a platinum-divinyltetramethyldisiloxane complex are blended to form a curable composition. A comparative product-9 was obtained. The obtained curable composition comparative product-9 was cured by the same curing method as in Example 1 to obtain a cured product comparative product-9. It was recognized that white smoke was generated during the curing reaction and volatile components were scattered.

[Heat resistance test]
The heat-resistant test was implemented with the measuring method shown next to the hardened | cured material -1-10 obtained in Examples 1-10 and the hardened | cured material comparative products 1-9 of Comparative Examples 1-9. The test results are shown in Table 1. The 1% weight loss temperature is shown in the upper part, and the 5% weight loss temperature is shown in the lower part. It turned out that the hardened | cured material -1-10 of this invention has a high heat-resistant temperature. On the other hand, in the cured product comparative products 1 to 9, since the volatile component was scattered, the equivalence ratio balance between the vinyl group and the Si—H group was lost, and it was expected that only a low heat-resistant temperature was expressed.
<Measurement method for heat resistance test>
Each cured product was measured for 1% weight loss temperature and 5% weight loss temperature with a thermal analyzer (TG-DTA).
Measuring instrument: SSC / 5200 manufactured by Seiko Instruments Inc.
Measurement conditions: Temperature range 100-550 ℃, temperature increase rate 10 ℃ / min

[Crack resistance test]
A crack resistance test was performed on the cured products 1 to 10 obtained in Examples 1 to 10 and the cured product comparative products 1 to 9 of Comparative Examples 1 to 9 by the following measurement method. The test results are shown in Table 1.
From this, it turned out that the hardened | cured material -1-10 of this invention has the crack resistance in high temperature.
<Measurement method for crack resistance test>
A thin film on glass (SOG film) cured product was placed in a glass container on a hot plate, heated to 350 ° C. while flowing nitrogen gas, and held for 1 hour. The heating was stopped in a nitrogen atmosphere as it was, and the film was cooled to room temperature, and the surface of the thin film was visually observed.
In the evaluation, a case where no crack was generated was evaluated as “◯”, and a case where a crack was generated was determined as “×”.

[Base resistance test]
The cured products-1 to 10 (SOG thin film) on the glass plates obtained in Examples 1 to 10 and the cured product comparative products 1 to 9 (SOG thin film) of Comparative Examples 1 to 9 were resistant to the following measurement methods. A basic test was performed. The test results are shown in Table 1.
From this, it turned out that hardened | cured material -1-10 of this invention has base resistance.
<Measurement method of base resistance test>
A cured film on glass plate (SOG film) was immersed in an amine test solution. After the immersion, the test piece was washed with ion exchange water, air-dried, and the presence or absence of cracks was determined with a microscope.
In the evaluation, a case where no crack was generated was evaluated as “◯”, and a case where a crack was generated was determined as “×”.
Amine test solution: tetramethylammonium hydroxide 26% aqueous solution Immersion conditions: 80 ° C. × 1 hour

[Relative permittivity test]
Cured product comparison of cured products -1 to 10 cured on a glass substrate with transparent electrodes obtained in Examples 1 to 10 and Comparative Examples 1 to 9 cured on a glass substrate with transparent electrodes similarly Products 1 to 9 were subjected to a relative dielectric constant test by the following measurement method. The test results are shown in Table 1. The dielectric constant at 1 kHz is shown in the upper stage, and the dielectric constant at 10 kHz is shown in the lower stage.
Thereby, it turned out that the hardened | cured material -1-10 of this invention has the value of relative dielectric constant 2.7-2.9, and is a low dielectric constant compound.
<Measurement method of relative permittivity test>
Each cured product coated and cured on a glass substrate with a transparent electrode is placed in a vacuum deposition apparatus, and high-purity aluminum is deposited to a thickness of 200 nm under a reduced pressure of 10 ⁻³ Pa or less. did. After taking out from the vapor deposition system, the electric charge at 1 kHz and 10 kHz was measured with an LCR meter 4262A manufactured by Yokogawa Hewlett-Packard, and the relative dielectric constant was calculated from the film thickness and the area of aluminum.

[Outgas amount test]
The outgas amount test was carried out on the cured products 1 to 10 obtained in Examples 1 to 10 and the cured product comparative products 1 to 9 of Comparative Examples 1 to 9 by the following measuring method. The test results are shown in Table 1.
Thereby, it turned out that hardened | cured material -1-10 of this invention has few outgas amounts. On the other hand, the cured product comparative products 1 to 9 had a large amount of outgas due to a large amount of residual volatile components.
<Measurement method for outgas amount test>
Each cured product was continuously operated at 350 ° C. for 1 hour using the same apparatus (TG / DTA) as in the heat resistance measurement, and the mass change was examined. It was determined that the weight loss corresponds to the outgas amount. Unit:% by mass Measuring instrument: SSC / 5200 manufactured by Seiko Instruments Inc.

In addition, the meaning of the numerical value and symbol in Table 1 is as follows.
Heat resistance test: Upper stage = 1% weight loss temperature, Lower stage = 5% weight loss temperature Crack resistance test: ○ No crack occurrence, x crack occurred Amine resistance test: ○ No crack occurrence, x crack occurred Relative permittivity: Upper stage = Dielectric constant at 1 KHz, lower = dielectric constant at 10 KHz Outgas amount test: Unit = mass%

The silicon-containing curable composition of the present invention is excellent in storage stability, transparency, handling properties, curability, etc., and further, the cured product has heat resistance, crack resistance, base resistance, optical properties, electrical properties, It can be used as a curable composition having excellent physical properties such as low outgassing. Also, in the fields of electrical and electronic materials, sealing materials such as display materials, optical materials, recording materials, and semiconductors, high-voltage insulating materials, spin casting, potting, dipping, etc. for the purpose of insulation, vibration proofing, waterproofing, and moisture proofing. Depending on the film method, prototype mold for plastic parts, coating material, interlayer insulation film, insulation packing, heat shrink rubber tube, O-ring, sealant / protective material for display device, optical waveguide, optical fiber protective material, optical lens, Adhesives for optical equipment, high heat resistant adhesives, high heat dissipation materials, high heat resistant sealing materials, solar cell / fuel cell components, solid electrolytes for batteries, insulation coating materials, photosensitive drums for copying machines, gas separation membranes Can be applied. Also applied to concrete protection materials, linings, soil injecting agents, sealing agents, regenerator materials, glass coatings, etc. in the civil engineering and building materials field, and in the medical materials field, tubes, sealing materials, coating materials, sterilization equipment It can be applied to sealing materials, contact lenses, oxygen-enriched films and the like.

Claims (3)

As a component (A), a prepolymer containing two or more Si-H groups in one molecule obtained by hydrosilylation reaction of at least one selected from the following (α) component and (β) component: Polymer (A);
As the component (B), a cyclic siloxane compound (B) containing two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule;
As component (C), hydrosilylation catalyst (C)
A silicon-containing curable composition characterized by containing.
(Α) Component: A cyclic siloxane compound containing two or more Si—H groups in one molecule, represented by the following formula (1).
[In Formula (1), R < ¹ >, R < ² > and R < ³ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be same or different. a represents a number of 2 to 10, b represents a number of 0 to 8, and a + b ≧ 2. ]
Two compounds containing in the molecule a carbon-carbon double bond - of the formula (2) or (4) below, the carbon reactive with the Si-H groups: (beta) components.
[In Formula (4), R < ⁸ >, R < ⁹ >, R < ¹⁰ > and R < ¹¹ > represent a C1-C6 alkyl group or a phenyl group, respectively, and may be same or different. ] The component (B) is a cyclic siloxane compound represented by the following formula (5), which contains two or more carbon-carbon double bonds having reactivity with Si-H groups in one molecule. 2. The silicon-containing curable composition according to 1.
[In Formula (5), R < ¹² >, R < ¹³ > and R < ¹⁴ > respectively represent a C1-C6 alkyl group or a phenyl group, and may be the same or different. p represents a number of 2 to 10, q represents a number of 0 to 8, and p + q ≧ 2. ]   A cured product obtained by curing the silicon-containing curable composition according to claim 1.